JP7001048B2 - 融着層付き絶縁電線 - Google Patents
融着層付き絶縁電線 Download PDFInfo
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- JP7001048B2 JP7001048B2 JP2018240720A JP2018240720A JP7001048B2 JP 7001048 B2 JP7001048 B2 JP 7001048B2 JP 2018240720 A JP2018240720 A JP 2018240720A JP 2018240720 A JP2018240720 A JP 2018240720A JP 7001048 B2 JP7001048 B2 JP 7001048B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/10—Homopolymers or copolymers of propene
- C09D123/14—Copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/04—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C09D127/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/448—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from other vinyl compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/40—Insulated conductors or cables characterised by their form with arrangements for facilitating mounting or securing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/302—Applications of adhesives in processes or use of adhesives in the form of films or foils for bundling cables
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
ポリ塩化ビニル(信越化学製、「TK-1300」)100質量部と、可塑剤(DIC製、n-MOTM「モノサイザーW-750」)30質量部と、Ca-Zn系熱安定剤(アデカ製、「アデカスタブRUP-100」)5質量部と、炭酸カルシウム(丸尾カルシウム製、「スーパー1700」)5質量部とを二軸押出機を用いて混練し、ポリ塩化ビニル絶縁被覆層用組成物とした。
ポリプロピレン(日本ポリプロ製、「ノバテックEC9」)92質量部と、熱可塑性エラストマー(旭化成製、「タフテックM-1913」)8質量部と、水酸化マグネシウム(協和化学製、「キスマ5」)70質量部と、ヒンダードフェノール系酸化防止剤(BASF製、「イルガノックス1010」0.5質量部とを二軸押出機を用いて混練し、ポリプロピレン絶縁被覆層用組成物とした。
調製した絶縁被覆材用組成物を、導体断面積0.13mm2の撚線導体の周囲に被覆厚0.2mmで押出成形することにより絶縁電線を作製した。
下記に示す材料を用い、表1~3に示す割合(質量部)で、(A)成分および(B)成分を配合し、二軸押出機を用いて混練し、融着層用組成物を調製した。なお、比較例1~3、参考例1、2は、(A)成分または(B)成分の一方のみである。
・変性PP1 東洋紡製:トーヨータック M-312(引張破断強度25.8MPa)
・変性PP2 三井化学製:アドマー QE060(引張破断強度35.0MPa)
(B)成分
・ポリエステル樹脂1 東洋紡製:バイロショット GM-955-RK20(引張破断強度4.0MPa、融点160℃)
・ポリエステル樹脂2 東亞合成製:アロンメルト PES-120L(引張破断強度36.5MPa、融点120℃)
・ポリエステルエラストマー1 東レ・デュポン製:ハイトレル 3046(引張破断強度23.4MPa、融点160℃)
・ポリエステルエラストマー2 東レ・デュポン製:ハイトレル 4047N(引張破断強度19.1MPa、融点182℃)
ポリ塩化ビニル製またはポリプロピレン製の絶縁被覆層を有する絶縁電線の外側全周に対し、各融着層用組成物を200℃で押出成形することにより、厚さ0.1mmの融着層を形成した。
図5(a)に示すように、被着体16上に、融着層付き絶縁電線11を端部から1cmが接するように置き、その他の部分を剥離シート17で保護した後、上方から、ホーンHにより、20kHzの超音波を10秒間照射し、融着層付き絶縁電線11と被着体16とを融着させた。融着箇所が常温になるまで放置し、図5(b)に示すように、剥離シートで保護していた箇所を融着している端部の方向に180度折り返し、軸線方向に50mm/秒の速さで引っ張り、融着層付き絶縁電線11の引き剥がしを行った。引き剥がし時の最大試験力を表1~3に示す。なお、被着体16は、表1~3に示すポリプロピレン製(PP)、ポリエチレンテレフタレート製(PET)、またはアルミニウム製(AL)のいずれかによる板状のものを使用した。
2 導体
3 絶縁被覆層
4 融着層
5 被着体
11 融着層付き絶縁電線
16 被着体
17 剥離シート
H ホーン(超音波発生器)
Claims (5)
- 導体と、前記導体の外周を被覆する絶縁被覆層と、
前記絶縁被覆層の外側に設けられ、熱により融着する融着層とを有し、
前記融着層は、
(A)変性ポリオレフィンと、
(B)ポリエステル樹脂、ポリエステルエラストマーから選択される1種以上
とを含有し、
前記融着層は、前記(A)成分と前記(B)成分との合計100質量部に対し、前記(B)成分を10~70質量部含有することを特徴とする融着層付き絶縁電線。 - 前記絶縁被覆層は、ポリ塩化ビニルを含有することを特徴とする請求項1に記載の融着層付き絶縁電線。
- 前記融着層が、(A)変性ポリオレフィンと、(B)ポリエステル樹脂とを含有することを特徴とする請求項1または2に記載の融着層付き絶縁電線。
- 前記融着層が、(A)変性ポリオレフィンと、(B)ポリエステルエラストマーとを含有することを特徴とする請求項1または2に記載の融着層付き絶縁電線。
- 前記融着層は、前記絶縁被覆層の外側に、周方向の全周にわたって設けられていることを特徴とする請求項1~4のいずれか1項に記載の融着層付き絶縁電線。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018240720A JP7001048B2 (ja) | 2018-12-25 | 2018-12-25 | 融着層付き絶縁電線 |
DE112019006404.5T DE112019006404T5 (de) | 2018-12-25 | 2019-12-05 | Isolierter draht mit klebeschicht |
PCT/JP2019/047565 WO2020137412A1 (ja) | 2018-12-25 | 2019-12-05 | 融着層付き絶縁電線 |
US17/416,687 US20220064502A1 (en) | 2018-12-25 | 2019-12-05 | Insulated wire with bonding layer |
CN201980085469.0A CN113287177B (zh) | 2018-12-25 | 2019-12-05 | 带熔接层的绝缘电线 |
Applications Claiming Priority (1)
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JP2018240720A JP7001048B2 (ja) | 2018-12-25 | 2018-12-25 | 融着層付き絶縁電線 |
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JP2020102392A JP2020102392A (ja) | 2020-07-02 |
JP2020102392A5 JP2020102392A5 (ja) | 2021-07-29 |
JP7001048B2 true JP7001048B2 (ja) | 2022-01-19 |
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JP2018240720A Active JP7001048B2 (ja) | 2018-12-25 | 2018-12-25 | 融着層付き絶縁電線 |
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US (1) | US20220064502A1 (ja) |
JP (1) | JP7001048B2 (ja) |
CN (1) | CN113287177B (ja) |
DE (1) | DE112019006404T5 (ja) |
WO (1) | WO2020137412A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002237219A (ja) | 2001-02-08 | 2002-08-23 | Yazaki Corp | 融着層付き電線及び融着層付き電線の製造方法 |
JP2014191885A (ja) | 2013-03-26 | 2014-10-06 | Hitachi Metals Ltd | フラットケーブル及びその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10149725A (ja) * | 1996-11-19 | 1998-06-02 | Sekisui Chem Co Ltd | 難燃性接着フィルム及びそれを用いたフラットケーブル |
JP2009048934A (ja) * | 2007-08-22 | 2009-03-05 | Fujikura Ltd | 集合電線、コイルアンテナ、及び携帯型無線機器 |
JP5916386B2 (ja) * | 2009-07-03 | 2016-05-11 | 三井化学株式会社 | 表面保護フィルム |
EP3043399B1 (en) * | 2013-09-03 | 2024-04-24 | Dai Nippon Printing Co., Ltd. | Resin composition for sealant layer of battery packaging material |
US20170012370A1 (en) * | 2014-01-09 | 2017-01-12 | Autonetworks Technologies, Ltd. | Connector-equipped electrical wire and method for manufacturing same |
-
2018
- 2018-12-25 JP JP2018240720A patent/JP7001048B2/ja active Active
-
2019
- 2019-12-05 CN CN201980085469.0A patent/CN113287177B/zh active Active
- 2019-12-05 US US17/416,687 patent/US20220064502A1/en active Pending
- 2019-12-05 WO PCT/JP2019/047565 patent/WO2020137412A1/ja active Application Filing
- 2019-12-05 DE DE112019006404.5T patent/DE112019006404T5/de active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002237219A (ja) | 2001-02-08 | 2002-08-23 | Yazaki Corp | 融着層付き電線及び融着層付き電線の製造方法 |
JP2014191885A (ja) | 2013-03-26 | 2014-10-06 | Hitachi Metals Ltd | フラットケーブル及びその製造方法 |
Also Published As
Publication number | Publication date |
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CN113287177A (zh) | 2021-08-20 |
CN113287177B (zh) | 2023-01-13 |
JP2020102392A (ja) | 2020-07-02 |
US20220064502A1 (en) | 2022-03-03 |
DE112019006404T5 (de) | 2021-09-09 |
WO2020137412A1 (ja) | 2020-07-02 |
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