JP6993115B2 - めっき装置 - Google Patents

めっき装置 Download PDF

Info

Publication number
JP6993115B2
JP6993115B2 JP2017118663A JP2017118663A JP6993115B2 JP 6993115 B2 JP6993115 B2 JP 6993115B2 JP 2017118663 A JP2017118663 A JP 2017118663A JP 2017118663 A JP2017118663 A JP 2017118663A JP 6993115 B2 JP6993115 B2 JP 6993115B2
Authority
JP
Japan
Prior art keywords
anode
substrate
plating
holder
holders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017118663A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019002051A (ja
Inventor
光弘 社本
正 下山
瑞樹 長井
勉 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2017118663A priority Critical patent/JP6993115B2/ja
Priority to KR1020180056475A priority patent/KR102463909B1/ko
Priority to CN201810502488.6A priority patent/CN109137051B/zh
Priority to TW107118440A priority patent/TWI806872B/zh
Publication of JP2019002051A publication Critical patent/JP2019002051A/ja
Application granted granted Critical
Publication of JP6993115B2 publication Critical patent/JP6993115B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2017118663A 2017-06-16 2017-06-16 めっき装置 Active JP6993115B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017118663A JP6993115B2 (ja) 2017-06-16 2017-06-16 めっき装置
KR1020180056475A KR102463909B1 (ko) 2017-06-16 2018-05-17 도금 장치
CN201810502488.6A CN109137051B (zh) 2017-06-16 2018-05-23 镀覆装置及非暂时性计算机可读存储介质
TW107118440A TWI806872B (zh) 2017-06-16 2018-05-30 鍍覆裝置及非暫時性電腦可讀存儲介質

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017118663A JP6993115B2 (ja) 2017-06-16 2017-06-16 めっき装置

Publications (2)

Publication Number Publication Date
JP2019002051A JP2019002051A (ja) 2019-01-10
JP6993115B2 true JP6993115B2 (ja) 2022-01-13

Family

ID=64801771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017118663A Active JP6993115B2 (ja) 2017-06-16 2017-06-16 めっき装置

Country Status (4)

Country Link
JP (1) JP6993115B2 (ko)
KR (1) KR102463909B1 (ko)
CN (1) CN109137051B (ko)
TW (1) TWI806872B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3911001A4 (en) 2019-01-09 2022-03-16 Panasonic Intellectual Property Corporation of America BASE STATION, TERMINAL, TRANSMISSION METHOD AND RECEIVING METHOD
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
JP7296832B2 (ja) * 2019-09-10 2023-06-23 株式会社荏原製作所 めっき装置
WO2022190243A1 (ja) * 2021-03-10 2022-09-15 株式会社荏原製作所 めっき装置、およびめっき方法
JP7093478B1 (ja) * 2021-06-18 2022-06-29 株式会社荏原製作所 めっき装置及びめっき方法
CN115522250A (zh) * 2021-06-24 2022-12-27 南通深南电路有限公司 印制线路板的电镀方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004225129A (ja) 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置
JP2013053372A (ja) 2012-11-15 2013-03-21 Ebara Corp 磁性体膜めっき装置及びめっき処理設備

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11181590A (ja) * 1997-12-17 1999-07-06 Hitachi Ltd 電解めっき方法および装置
JP3637214B2 (ja) * 1998-09-24 2005-04-13 株式会社荏原製作所 ウエハのメッキ方法
JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
CN201785520U (zh) * 2010-08-26 2011-04-06 元旸工业有限公司 在电镀槽内均匀喷流电镀液的电镀装置
KR101575068B1 (ko) * 2014-09-16 2015-12-07 주식회사 호진플라텍 광유도 도금 및 순방향 바이어스 도금을 병행하는 태양전지 기판용 도금장치
JP6408936B2 (ja) 2015-03-05 2018-10-17 株式会社荏原製作所 めっき装置
JP6399973B2 (ja) * 2015-06-18 2018-10-03 株式会社荏原製作所 めっき装置の調整方法及び測定装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004225129A (ja) 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置
JP2013053372A (ja) 2012-11-15 2013-03-21 Ebara Corp 磁性体膜めっき装置及びめっき処理設備

Also Published As

Publication number Publication date
TWI806872B (zh) 2023-07-01
KR102463909B1 (ko) 2022-11-07
TW201905248A (zh) 2019-02-01
KR20180137401A (ko) 2018-12-27
CN109137051A (zh) 2019-01-04
CN109137051B (zh) 2021-08-31
JP2019002051A (ja) 2019-01-10

Similar Documents

Publication Publication Date Title
JP6993115B2 (ja) めっき装置
US11591709B2 (en) Apparatus for plating
US11686009B2 (en) Regulation plate, anode holder, and substrate holder
CN110184639B (zh) 电镀装置
CN105420778A (zh) 电镀装置及电镀方法
TWI805780B (zh) 鍍覆裝置及鍍覆方法
JP6847691B2 (ja) めっき装置およびめっき装置とともに使用される基板ホルダ
JP2005501180A (ja) 超小型電子ワークピースの電気化学処理のための装置及び方法
TW201443298A (zh) 導電性結構之形成方法、鍍覆裝置及鍍覆方法
JP6993288B2 (ja) めっき装置
JP7440571B2 (ja) めっき装置及びめっき方法
JP7285389B1 (ja) めっき装置、および、めっき方法
WO2023053182A1 (ja) めっき装置
TWI833972B (zh) 基板保持架及鍍敷裝置
TW202108826A (zh) 基板保持架及鍍敷裝置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200612

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210323

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210402

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20210525

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210726

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210910

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211014

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20211122

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20211209

R150 Certificate of patent or registration of utility model

Ref document number: 6993115

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150