TWI806872B - 鍍覆裝置及非暫時性電腦可讀存儲介質 - Google Patents

鍍覆裝置及非暫時性電腦可讀存儲介質 Download PDF

Info

Publication number
TWI806872B
TWI806872B TW107118440A TW107118440A TWI806872B TW I806872 B TWI806872 B TW I806872B TW 107118440 A TW107118440 A TW 107118440A TW 107118440 A TW107118440 A TW 107118440A TW I806872 B TWI806872 B TW I806872B
Authority
TW
Taiwan
Prior art keywords
substrate
anode
plating
shielding
holder
Prior art date
Application number
TW107118440A
Other languages
English (en)
Chinese (zh)
Other versions
TW201905248A (zh
Inventor
社本光弘
下山正
長井瑞樹
中田勉
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201905248A publication Critical patent/TW201905248A/zh
Application granted granted Critical
Publication of TWI806872B publication Critical patent/TWI806872B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW107118440A 2017-06-16 2018-05-30 鍍覆裝置及非暫時性電腦可讀存儲介質 TWI806872B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017118663A JP6993115B2 (ja) 2017-06-16 2017-06-16 めっき装置
JP2017-118663 2017-06-16

Publications (2)

Publication Number Publication Date
TW201905248A TW201905248A (zh) 2019-02-01
TWI806872B true TWI806872B (zh) 2023-07-01

Family

ID=64801771

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107118440A TWI806872B (zh) 2017-06-16 2018-05-30 鍍覆裝置及非暫時性電腦可讀存儲介質

Country Status (4)

Country Link
JP (1) JP6993115B2 (ko)
KR (1) KR102463909B1 (ko)
CN (1) CN109137051B (ko)
TW (1) TWI806872B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3911001A4 (en) 2019-01-09 2022-03-16 Panasonic Intellectual Property Corporation of America BASE STATION, TERMINAL, TRANSMISSION METHOD AND RECEIVING METHOD
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
JP7296832B2 (ja) * 2019-09-10 2023-06-23 株式会社荏原製作所 めっき装置
WO2022190243A1 (ja) * 2021-03-10 2022-09-15 株式会社荏原製作所 めっき装置、およびめっき方法
JP7093478B1 (ja) * 2021-06-18 2022-06-29 株式会社荏原製作所 めっき装置及びめっき方法
CN115522250A (zh) * 2021-06-24 2022-12-27 南通深南电路有限公司 印制线路板的电镀方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11181590A (ja) * 1997-12-17 1999-07-06 Hitachi Ltd 電解めっき方法および装置
JP3637214B2 (ja) * 1998-09-24 2005-04-13 株式会社荏原製作所 ウエハのメッキ方法
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置
JP5184308B2 (ja) * 2007-12-04 2013-04-17 株式会社荏原製作所 めっき装置及びめっき方法
CN201785520U (zh) * 2010-08-26 2011-04-06 元旸工业有限公司 在电镀槽内均匀喷流电镀液的电镀装置
JP5507649B2 (ja) * 2012-11-15 2014-05-28 株式会社荏原製作所 磁性体膜めっき装置及びめっき処理設備
KR101575068B1 (ko) * 2014-09-16 2015-12-07 주식회사 호진플라텍 광유도 도금 및 순방향 바이어스 도금을 병행하는 태양전지 기판용 도금장치
JP6408936B2 (ja) 2015-03-05 2018-10-17 株式会社荏原製作所 めっき装置
JP6399973B2 (ja) * 2015-06-18 2018-10-03 株式会社荏原製作所 めっき装置の調整方法及び測定装置

Also Published As

Publication number Publication date
KR102463909B1 (ko) 2022-11-07
TW201905248A (zh) 2019-02-01
KR20180137401A (ko) 2018-12-27
JP6993115B2 (ja) 2022-01-13
CN109137051A (zh) 2019-01-04
CN109137051B (zh) 2021-08-31
JP2019002051A (ja) 2019-01-10

Similar Documents

Publication Publication Date Title
TWI806872B (zh) 鍍覆裝置及非暫時性電腦可讀存儲介質
JP4434948B2 (ja) めっき装置及びめっき方法
US11591709B2 (en) Apparatus for plating
JP4392168B2 (ja) 銅めっき浴およびこれを用いる基板のめっき方法
US8784636B2 (en) Plating apparatus and plating method
CN110184639B (zh) 电镀装置
US20060081478A1 (en) Plating apparatus and plating method
TWI763762B (zh) 鍍覆裝置、與鍍覆裝置一起使用的基板固持器
US11066755B2 (en) Plating apparatus and plating method
US20120255864A1 (en) Electroplating method
US20120145552A1 (en) Electroplating method
JP2015071802A (ja) めっき装置および該めっき装置に使用されるクリーニング装置
JP6223199B2 (ja) めっき装置およびめっき方法
TWI518213B (zh) 導電性結構之形成方法
JP6993288B2 (ja) めっき装置
TW202108829A (zh) 陽極固持器、鍍覆裝置、及鍍覆方法
US10179950B2 (en) Plating method, plated component, and plating system
WO2023053182A1 (ja) めっき装置
TW202403121A (zh) 鍍覆裝置及鍍覆方法
JP2001319895A (ja) 液処理方法