JP6992944B2 - 積層セラミック電子部品の製造方法 - Google Patents

積層セラミック電子部品の製造方法 Download PDF

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JP6992944B2
JP6992944B2 JP2016076690A JP2016076690A JP6992944B2 JP 6992944 B2 JP6992944 B2 JP 6992944B2 JP 2016076690 A JP2016076690 A JP 2016076690A JP 2016076690 A JP2016076690 A JP 2016076690A JP 6992944 B2 JP6992944 B2 JP 6992944B2
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internal electrode
ceramic
weight
internal
conductive metal
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JP2017120870A (ja
Inventor
ハン キム、ジョン
ヨル チョイ、ジェ
ホ リー、セウン
ゴン リー、ミン
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サムソン エレクトロ－メカニックス カンパニーリミテッド．
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Priority to JP2021151547A priority Critical patent/JP2021192460A/ja
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Conductive Materials (AREA)
JP2016076690A 2015-12-28 2016-04-06 積層セラミック電子部品の製造方法 Active JP6992944B2 (ja)

Priority Applications (1)

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JP2021151547A JP2021192460A (ja) 2015-12-28 2021-09-16 内部電極用導電性ペースト及び積層セラミック電子部品の製造方法

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KR1020150187492A KR102198539B1 (ko) 2015-12-28 2015-12-28 내부전극용 도전성 페이스트 및 적층 세라믹 전자부품의 제조방법
KR10-2015-0187492 2015-12-28

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JP2021151547A Division JP2021192460A (ja) 2015-12-28 2021-09-16 内部電極用導電性ペースト及び積層セラミック電子部品の製造方法

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JP2017120870A JP2017120870A (ja) 2017-07-06
JP6992944B2 true JP6992944B2 (ja) 2022-01-13

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JP2016076690A Active JP6992944B2 (ja) 2015-12-28 2016-04-06 積層セラミック電子部品の製造方法
JP2021151547A Pending JP2021192460A (ja) 2015-12-28 2021-09-16 内部電極用導電性ペースト及び積層セラミック電子部品の製造方法

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KR (1) KR102198539B1 (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011021464A1 (ja) 2009-08-20 2011-02-24 株式会社村田製作所 積層セラミックコンデンサの製造方法および積層セラミックコンデンサ
JP6267785B2 (ja) 2013-04-30 2018-01-24 コングク・ユニバーシティ・インダストリアル・コーペレイション・コーポレイション Ｃｍｐ−アセチルノイラミン酸ヒドロキシラーゼタゲッティングベクター、そのベクターが導入された異種間移植用形質転換動物及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06267785A (ja) * 1993-03-12 1994-09-22 Toshiba Corp 積層セラミック電子部品の製造方法
JP2000269074A (ja) * 1999-03-19 2000-09-29 Taiyo Yuden Co Ltd 積層セラミックコンデンサとその製造方法
JP4403488B2 (ja) 2002-06-20 2010-01-27 株式会社村田製作所 導電性ペースト及び積層型電子部品
JP4587924B2 (ja) * 2005-09-27 2010-11-24 京セラ株式会社 積層セラミックコンデンサ
JP5253351B2 (ja) * 2009-10-20 2013-07-31 株式会社村田製作所 積層セラミック電子部品およびその製造方法、積層セラミック電子部品用の扁平状導電性微粉末ならびに積層セラミック電子部品用の扁平状導電性微粉末分散液

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011021464A1 (ja) 2009-08-20 2011-02-24 株式会社村田製作所 積層セラミックコンデンサの製造方法および積層セラミックコンデンサ
JP6267785B2 (ja) 2013-04-30 2018-01-24 コングク・ユニバーシティ・インダストリアル・コーペレイション・コーポレイション Ｃｍｐ−アセチルノイラミン酸ヒドロキシラーゼタゲッティングベクター、そのベクターが導入された異種間移植用形質転換動物及びその製造方法

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KR20170077532A (ko) 2017-07-06
JP2021192460A (ja) 2021-12-16
KR102198539B1 (ko) 2021-01-06
JP2017120870A (ja) 2017-07-06

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