JP6989510B2 - 基板処理システム内の1つ以上の環境状態の存在を検出するためのシステムおよび方法 - Google Patents
基板処理システム内の1つ以上の環境状態の存在を検出するためのシステムおよび方法 Download PDFInfo
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
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- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Description
Claims (15)
- 基板処理クラスタツールを作動させる方法であって、
1つ以上の基板を受け入れるように寸法決めされ構成された内部容積部を画定する基板収納カセットを、前記基板処理クラスタツールのファクトリインターフェース内に配置することと、
前記内部容積部内の複数の状態のうちの1つの状態の発生と、前記内部容積部内の前記複数の状態のうちの1つの状態の持続とのうちの少なくとも一方を、前記内部容積部の内部に配された少なくとも1つのセンサおよび観察窓を介して前記内部容積部の外部に配された少なくとも1つのセンサを含む、複数のセンサと作動的に関連付けられたプロセッサによる格納された命令の実行により、感知することと、
前記感知することに応答して、アラートを生成することと、不活性ガスで前記基板収納カセットの前記内部容積部をパージすることと、前記基板収納カセットの前記内部容積部から前記基板処理クラスタツールの処理チャンバ内への基板の移送を一時停止または差し止めることとのうちの少なくとも1つを行うことと、
を含む方法。 - 前記感知することが、前記基板収納カセット内の温度を感知することを含み、リアルタイム温度測定値が、前記温度を感知することに応答して、記録および/または表示される、請求項1に記載の方法。
- 感知された温度が、選択された温度閾値と温度持続閾値のうちの少なくとも一方を超えていることに応答して、前記アラートが、生成されることと、
感知された温度が、前記温度閾値または前記温度持続閾値未満である場合に、前記アラートが、前記基板収納カセットの取り扱い安全状態を含むことと、
のうちの少なくとも一方である、請求項2に記載の方法。 - 前記感知することが、前記基板収納カセットに関する第1のプロセスの終了と前記基板収納カセットに関する第2のプロセスの開始との間の経過時間を測定することと、表示することとのうちの少なくとも一方を含む、請求項1に記載の方法。
- 前記アラートが、可視の経過時間表示と可聴の経過時間超過表示のうちの少なくとも一方を含む、請求項4に記載の方法。
- 前記感知することが、
前記基板収納カセットおよび前記ファクトリインターフェースのうちの少なくとも一方の中の空中浮遊揮発性有機化合物、酸素濃度および空中浮遊金属微粒子のうちの少なくとも1つを監視することと、
前記基板収納カセット内の相対湿度を監視することと、
のうちの1つ以上を含む、請求項1に記載の方法。 - 前記内部容積部の外部に配された前記少なくとも1つのセンサが、光センサを含み、
前記感知することが、光源を作動させて、前記観察窓を介して前記光センサによって前記内部容積部内の光散乱または吸収を測定することにより、前記基板収納カセットの中の1種以上の空中浮遊汚染物質の濃度を測定することと、監視することとのうちの少なくとも一方を行うことを含む、請求項1に記載の方法。 - 基板処理チャンバを含む少なくとも1つのツールと、
複数の基板収納カセットを受け入れるように寸法決めされ構成された密封された内部キャビティを画定するファクトリインターフェースと、
前記内部キャビティ内に配置される少なくとも1つの基板収納カセットであって、各基板収納カセットが、1つ以上の基板を受け入れるように寸法決めされ構成された内部容積部を画定する、少なくとも1つの基板収納カセットと、
前記内部容積部の内部に配された少なくとも1つのセンサ、および観察窓を介して前記内部容積部の外部に配された少なくとも1つのセンサを含む、複数のセンサと、
前記複数のセンサおよび命令を含むメモリと作動的に関連付けられたプロセッサであって、前記命令が、
前記内部容積部内の複数の状態のうちの1つの状態の発生と、前記内部容積部内の前記複数の状態のうちの1つの状態の持続とのうちの少なくとも一方を感知すること、および
前記感知することに応答して、アラートを生成することと、不活性ガスで前記基板収納カセットの前記内部容積部をパージすることと、前記基板収納カセットの前記内部容積部から前記基板処理チャンバ内への基板の移送を一時停止または差し止めることとのうちの少なくとも1つを行うように、
前記プロセッサによって実行可能である、プロセッサと、
を備える基板処理クラスタツール。 - 前記メモリが、前記基板収納カセット内の温度を感知し、前記温度を感知することに応答して、リアルタイム温度測定値を記録することと表示することのうちの少なくとも一方を行うように、前記プロセッサによって実行可能である命令を含む、請求項8に記載の基板処理クラスタツール。
- 感知された前記温度が、選択された温度閾値と温度持続閾値のうちの少なくとも一方を超えていることに応答して、前記メモリに格納され前記プロセッサによって実行可能な前記命令が、アラートを生成する、請求項9に記載の基板処理クラスタツール。
- 感知された前記温度が、所定の温度未満である場合に、前記メモリに格納され前記プロセッサによって実行可能な前記命令が、基板収納カセット取り扱い安全アラートを生成する、請求項9に記載の基板処理クラスタツール。
- 前記メモリが、前記少なくとも1つの基板収納カセットに関する第1のプロセスの終了と前記少なくとも1つの基板収納カセットに関する第2のプロセスの開始との間の経過時間を測定することと表示することのうちの少なくとも1つを行うように、前記プロセッサによって実行可能である命令を含み、
前記アラートが、可視の経過時間表示と可聴の経過時間超過表示のうちの少なくとも一方を含む、
請求項8に記載の基板処理クラスタツール。 - 前記内部容積部の外部に配された前記少なくとも1つのセンサが、光センサを含み、
前記感知することが、光源を作動させて、前記観察窓を介して前記光センサによって前記内部容積部内の光散乱または吸収を測定することにより、前記基板収納カセットの中の1種以上の空中浮遊汚染物質の濃度を測定することと、監視することとのうちの少なくとも一方を行うことを含む、請求項8に記載の基板処理クラスタツール。 - 基板処理ツールとともに使用するための基板収納監視システムであって、
前記基板処理ツールのファクトリインターフェースの内部キャビティ内に配置されるように寸法決めされ構成された少なくとも1つの基板収納カセットであって、各基板収納カセットが、1つ以上の基板を受け入れるように寸法決めされ構成された内部容積部を画定する、少なくとも1つの基板収納カセットと、
前記内部容積部の内部に配された少なくとも1つのセンサ、および観察窓を介して前記内部容積部の外部に配された少なくとも1つのセンサを含む、複数のセンサと、
前記複数のセンサおよび命令を含むメモリと作動的に関連付けられたプロセッサであって、前記命令が、
前記内部容積部内の複数の状態のうちの1つの状態の発生と、前記内部容積部内の前記複数の状態のうちの1つの状態の持続とのうちの少なくとも一方を感知すること、および
前記感知することに応答して、アラートを生成することと、不活性ガスで前記基板収納カセットの前記内部容積部をパージすることと、前記基板収納カセットの前記内部容積部から前記基板処理ツールの処理チャンバ内への基板の移送を一時停止または差し止めることとのうちの少なくとも1つを行うように、
前記プロセッサによって実行可能である、プロセッサと、
を備える基板収納監視システム。 - 前記複数のセンサが、温度センサと、湿度センサと、1つ以上の空中浮遊成分センサと、前記内部容積部の外部に配された光センサとのうちの少なくとも1つを含み、前記1つ以上の空中浮遊成分センサが、空中浮遊金属微粒子センサと、酸素センサと、揮発性有機化合物センサとのうちの少なくとも1つを含む、請求項14に記載の基板収納監視システム。
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US201662287429P | 2016-01-26 | 2016-01-26 | |
US62/287,429 | 2016-01-26 | ||
US15/048,258 US10192762B2 (en) | 2016-01-26 | 2016-02-19 | Systems and methods for detecting the existence of one or more environmental conditions within a substrate processing system |
US15/048,258 | 2016-02-19 | ||
PCT/US2017/014842 WO2017132203A1 (en) | 2016-01-26 | 2017-01-25 | Systems and methods for detecting the existence of one or more environmental conditions within a substrate processing system |
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JP2019508886A5 JP2019508886A5 (ja) | 2020-04-02 |
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JP (1) | JP6989510B2 (ja) |
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CN (1) | CN108604565B (ja) |
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- 2017-01-25 KR KR1020187024521A patent/KR20180099909A/ko not_active Application Discontinuation
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TWI745343B (zh) | 2021-11-11 |
US10192762B2 (en) | 2019-01-29 |
JP2019508886A (ja) | 2019-03-28 |
CN108604565A (zh) | 2018-09-28 |
WO2017132203A1 (en) | 2017-08-03 |
CN108604565B (zh) | 2024-01-12 |
US20170213750A1 (en) | 2017-07-27 |
TW201732984A (zh) | 2017-09-16 |
KR20180099909A (ko) | 2018-09-05 |
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