JP6984602B2 - 低誘電接着剤層を含有する積層体 - Google Patents
低誘電接着剤層を含有する積層体 Download PDFInfo
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- JP6984602B2 JP6984602B2 JP2018532870A JP2018532870A JP6984602B2 JP 6984602 B2 JP6984602 B2 JP 6984602B2 JP 2018532870 A JP2018532870 A JP 2018532870A JP 2018532870 A JP2018532870 A JP 2018532870A JP 6984602 B2 JP6984602 B2 JP 6984602B2
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
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| JP2016156204 | 2016-08-09 | ||
| PCT/JP2017/024168 WO2018030026A1 (ja) | 2016-08-09 | 2017-06-30 | 低誘電接着剤層を含有する積層体 |
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| JPWO2018030026A1 JPWO2018030026A1 (ja) | 2019-06-06 |
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| CN111918944A (zh) * | 2018-03-30 | 2020-11-10 | 东洋纺株式会社 | 聚烯烃类粘接剂组合物 |
| CN112440532A (zh) * | 2019-08-27 | 2021-03-05 | 康宁股份有限公司 | 用于高频印刷电路板应用的有机/无机层叠体 |
| WO2021045125A1 (ja) * | 2019-09-06 | 2021-03-11 | 東洋紡株式会社 | ポリオレフィン系接着剤組成物 |
| TWI724563B (zh) * | 2019-09-26 | 2021-04-11 | 盟鑫金屬股份有限公司 | 金屬材料的膠合方法 |
| JP2021077716A (ja) * | 2019-11-06 | 2021-05-20 | 古河電気工業株式会社 | プリント基板およびプリント基板の製造方法 |
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| WO2021132058A1 (ja) * | 2019-12-23 | 2021-07-01 | 三井化学株式会社 | 電子タグ用接着剤および電子タグ |
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| CN113355032B (zh) * | 2020-03-03 | 2023-02-28 | 利诺士尖端材料有限公司 | 粘结膜、包括其的粘结膜附着层叠体及金属箔层叠体 |
| KR20220161283A (ko) * | 2020-03-30 | 2022-12-06 | 도요보 가부시키가이샤 | 접착제 조성물, 및 접착 시트, 적층체 및 프린트 배선판 |
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| US10544305B2 (en) * | 2015-01-16 | 2020-01-28 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same |
| TWI697532B (zh) * | 2015-05-15 | 2020-07-01 | 日商東洋紡股份有限公司 | 包含低介電性接著劑層的疊層體 |
| WO2017077912A1 (ja) * | 2015-11-02 | 2017-05-11 | 東洋紡株式会社 | 低誘電難燃性接着剤組成物 |
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| JPWO2018030026A1 (ja) | 2019-06-06 |
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| CN109476124B (zh) | 2021-06-22 |
| TWI749038B (zh) | 2021-12-11 |
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| KR102340014B1 (ko) | 2021-12-16 |
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