JP6982433B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP6982433B2
JP6982433B2 JP2017161445A JP2017161445A JP6982433B2 JP 6982433 B2 JP6982433 B2 JP 6982433B2 JP 2017161445 A JP2017161445 A JP 2017161445A JP 2017161445 A JP2017161445 A JP 2017161445A JP 6982433 B2 JP6982433 B2 JP 6982433B2
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Japan
Prior art keywords
substrate
liquid
holding portion
liquid receiving
processing apparatus
Prior art date
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Active
Application number
JP2017161445A
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English (en)
Japanese (ja)
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JP2019039039A (ja
Inventor
栄次 梅田
隆行 郷原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017161445A priority Critical patent/JP6982433B2/ja
Priority to PCT/JP2018/023874 priority patent/WO2019039066A1/ja
Priority to TW107123495A priority patent/TWI673114B/zh
Publication of JP2019039039A publication Critical patent/JP2019039039A/ja
Application granted granted Critical
Publication of JP6982433B2 publication Critical patent/JP6982433B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2017161445A 2017-08-24 2017-08-24 基板処理装置 Active JP6982433B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017161445A JP6982433B2 (ja) 2017-08-24 2017-08-24 基板処理装置
PCT/JP2018/023874 WO2019039066A1 (ja) 2017-08-24 2018-06-22 基板処理装置
TW107123495A TWI673114B (zh) 2017-08-24 2018-07-06 基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017161445A JP6982433B2 (ja) 2017-08-24 2017-08-24 基板処理装置

Publications (2)

Publication Number Publication Date
JP2019039039A JP2019039039A (ja) 2019-03-14
JP6982433B2 true JP6982433B2 (ja) 2021-12-17

Family

ID=65440064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017161445A Active JP6982433B2 (ja) 2017-08-24 2017-08-24 基板処理装置

Country Status (3)

Country Link
JP (1) JP6982433B2 (zh)
TW (1) TWI673114B (zh)
WO (1) WO2019039066A1 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5996381B2 (ja) * 2011-12-28 2016-09-21 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP2015115456A (ja) * 2013-12-11 2015-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6118758B2 (ja) * 2014-05-01 2017-04-19 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP6461617B2 (ja) * 2015-01-20 2019-01-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6672023B2 (ja) * 2016-03-08 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
TWI673114B (zh) 2019-10-01
WO2019039066A1 (ja) 2019-02-28
JP2019039039A (ja) 2019-03-14
TW201912255A (zh) 2019-04-01

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