JP6952945B2 - 発光素子パッケージ及び照明装置 - Google Patents
発光素子パッケージ及び照明装置 Download PDFInfo
- Publication number
- JP6952945B2 JP6952945B2 JP2017055275A JP2017055275A JP6952945B2 JP 6952945 B2 JP6952945 B2 JP 6952945B2 JP 2017055275 A JP2017055275 A JP 2017055275A JP 2017055275 A JP2017055275 A JP 2017055275A JP 6952945 B2 JP6952945 B2 JP 6952945B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- cavity
- frame
- contact portion
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/20—Breakdown diodes, e.g. avalanche diodes
- H10D8/25—Zener diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8585—Means for heat extraction or cooling being an interconnection
-
- H10W90/00—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- H10W90/753—
Landscapes
- Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160036091A KR102522811B1 (ko) | 2016-03-25 | 2016-03-25 | 발광소자 패키지 및 조명 장치 |
| KR1020160036100A KR102522590B1 (ko) | 2016-03-25 | 2016-03-25 | 발광소자 패키지 및 조명 장치 |
| KR1020160036096A KR102509053B1 (ko) | 2016-03-25 | 2016-03-25 | 발광소자 패키지 및 조명 장치 |
| KR10-2016-0036091 | 2016-03-25 | ||
| KR10-2016-0036100 | 2016-03-25 | ||
| KR10-2016-0036096 | 2016-03-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017175132A JP2017175132A (ja) | 2017-09-28 |
| JP2017175132A5 JP2017175132A5 (enExample) | 2020-04-16 |
| JP6952945B2 true JP6952945B2 (ja) | 2021-10-27 |
Family
ID=58401460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017055275A Expired - Fee Related JP6952945B2 (ja) | 2016-03-25 | 2017-03-22 | 発光素子パッケージ及び照明装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9997683B2 (enExample) |
| EP (1) | EP3223322B1 (enExample) |
| JP (1) | JP6952945B2 (enExample) |
| CN (2) | CN107256859B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017039198A1 (ko) * | 2015-09-01 | 2017-03-09 | 엘지이노텍(주) | 조명 장치 |
| KR102432024B1 (ko) * | 2017-12-08 | 2022-08-12 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 및 광원 장치 |
| JP1627942S (enExample) * | 2018-09-27 | 2019-04-01 | ||
| USD895559S1 (en) * | 2019-01-15 | 2020-09-08 | Citizen Electronics Co., Ltd. | Light emitting diode |
| JP1640278S (enExample) * | 2019-01-15 | 2019-09-02 | ||
| JP7210305B2 (ja) * | 2019-01-31 | 2023-01-23 | 日機装株式会社 | 流体殺菌装置 |
| CN211260395U (zh) * | 2019-09-29 | 2020-08-14 | 漳州立达信光电子科技有限公司 | 一种led灯以及控制电路 |
| WO2025147842A1 (en) * | 2024-01-09 | 2025-07-17 | Lumileds Llc | Light emmitting diode package with improved light quality |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0550752U (ja) * | 1991-12-11 | 1993-07-02 | 株式会社精工舎 | 発光装置 |
| DE10041686A1 (de) * | 2000-08-24 | 2002-03-14 | Osram Opto Semiconductors Gmbh | Bauelement mit einer Vielzahl von Lumineszenzdiodenchips |
| CN100359703C (zh) * | 2001-08-21 | 2008-01-02 | 奥斯兰姆奥普托半导体有限责任公司 | 辐射构件及其引线框和壳体及带辐射构件的显示装置和/或照明装置 |
| CN1489224A (zh) * | 2003-09-02 | 2004-04-14 | �º黨 | 高亮度超薄光半导体器件 |
| KR100591687B1 (ko) | 2005-05-06 | 2006-06-22 | 럭스피아 주식회사 | 칼라게멋을 향상한 멀티-칩 발광다이오드 패키지 및 이를채용한 백라이트 유닛 |
| KR100616695B1 (ko) * | 2005-10-04 | 2006-08-28 | 삼성전기주식회사 | 고출력 발광 다이오드 패키지 |
| DE102006015377B4 (de) * | 2006-04-03 | 2018-06-14 | Ivoclar Vivadent Ag | Halbleiter-Strahlungsquelle sowie Lichthärtgerät |
| KR100818162B1 (ko) * | 2007-05-14 | 2008-03-31 | 루미마이크로 주식회사 | 색온도 조절이 가능한 백색 led 장치 |
| KR200447448Y1 (ko) | 2007-11-29 | 2010-01-25 | (주)솔라루체 | Led 소자용 리드프레임 패키지 및 이를 이용한 led패키지 |
| KR100998233B1 (ko) * | 2007-12-03 | 2010-12-07 | 서울반도체 주식회사 | 슬림형 led 패키지 |
| JP2009224431A (ja) * | 2008-03-14 | 2009-10-01 | Nichia Corp | 半導体装置 |
| JP2010118560A (ja) * | 2008-11-13 | 2010-05-27 | Sumitomo Metal Electronics Devices Inc | 発光素子搭載用パッケージの製造方法 |
| US7923739B2 (en) * | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
| KR101064072B1 (ko) * | 2009-02-24 | 2011-09-08 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| TWI389357B (zh) * | 2009-08-04 | 2013-03-11 | 榮創能源科技股份有限公司 | 具有防水功能的表面黏著型發光二極體元件、具有防水功能的發光二極體模組以及其製作方法 |
| US20110062482A1 (en) * | 2010-01-20 | 2011-03-17 | Bridgelux, Inc. | Apparatus And Method For Enhancing Connectability In LED Array Using Metal Traces |
| JP5010716B2 (ja) * | 2010-01-29 | 2012-08-29 | 株式会社東芝 | Ledパッケージ |
| KR101282829B1 (ko) * | 2010-02-17 | 2013-07-26 | 일진엘이디(주) | 발광 다이오드 패키지 |
| JP2011204790A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 半導体発光装置 |
| KR101039994B1 (ko) * | 2010-05-24 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 이를 구비한 라이트 유닛 |
| KR101103674B1 (ko) * | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | 발광 소자 |
| EP2418700B1 (en) * | 2010-08-09 | 2017-11-01 | LG Innotek Co., Ltd. | Light emitting device |
| JP2012119376A (ja) * | 2010-11-29 | 2012-06-21 | Toshiba Corp | Ledパッケージ |
| KR101110911B1 (ko) * | 2010-12-24 | 2012-02-24 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| KR101832306B1 (ko) * | 2011-05-30 | 2018-02-26 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| KR101818466B1 (ko) * | 2011-08-18 | 2018-01-15 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지 |
| US8895998B2 (en) * | 2012-03-30 | 2014-11-25 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components and methods |
| TW201344971A (zh) * | 2012-04-18 | 2013-11-01 | 隆達電子股份有限公司 | 發光元件之封裝結構 |
| US10026676B2 (en) * | 2012-12-11 | 2018-07-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor lead frame package and LED package |
| TWI518952B (zh) * | 2013-07-17 | 2016-01-21 | 隆達電子股份有限公司 | 發光二極體封裝結構及發光元件 |
| JP2015126137A (ja) * | 2013-12-26 | 2015-07-06 | アピックヤマダ株式会社 | リードフレーム、ledパッケージ用基板、リフレクタ部材、ledパッケージ、発光装置、発光システム、並びに、ledパッケージ用基板及びledパッケージの製造方法 |
| JP6671117B2 (ja) * | 2014-07-08 | 2020-03-25 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
| JP6413412B2 (ja) * | 2014-07-11 | 2018-10-31 | 日亜化学工業株式会社 | 半導体発光装置及びその製造方法 |
| EP2988341B1 (en) * | 2014-08-22 | 2017-04-05 | LG Innotek Co., Ltd. | Light emitting device package |
-
2017
- 2017-03-22 EP EP17162253.3A patent/EP3223322B1/en active Active
- 2017-03-22 JP JP2017055275A patent/JP6952945B2/ja not_active Expired - Fee Related
- 2017-03-23 US US15/467,204 patent/US9997683B2/en active Active
- 2017-03-27 CN CN201710188302.XA patent/CN107256859B/zh active Active
- 2017-03-27 CN CN202210957506.6A patent/CN115274638B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN115274638A (zh) | 2022-11-01 |
| EP3223322B1 (en) | 2019-05-01 |
| US20170279015A1 (en) | 2017-09-28 |
| JP2017175132A (ja) | 2017-09-28 |
| CN107256859A (zh) | 2017-10-17 |
| US9997683B2 (en) | 2018-06-12 |
| CN107256859B (zh) | 2022-08-23 |
| CN115274638B (zh) | 2025-11-07 |
| EP3223322A1 (en) | 2017-09-27 |
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