JP6952120B2 - セラミック接合体およびその製造方法 - Google Patents
セラミック接合体およびその製造方法 Download PDFInfo
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- JP6952120B2 JP6952120B2 JP2019539586A JP2019539586A JP6952120B2 JP 6952120 B2 JP6952120 B2 JP 6952120B2 JP 2019539586 A JP2019539586 A JP 2019539586A JP 2019539586 A JP2019539586 A JP 2019539586A JP 6952120 B2 JP6952120 B2 JP 6952120B2
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- aluminum oxide
- closed pores
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000011148 porous material Substances 0.000 claims description 122
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 54
- 230000005484 gravity Effects 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 10
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- 150000004676 glycans Chemical class 0.000 claims description 7
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- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
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- 239000011812 mixed powder Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
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- 239000002245 particle Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
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- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- -1 Cl 2 Chemical compound 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
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- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 101100441092 Danio rerio crlf3 gene Proteins 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
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- 239000006061 abrasive grain Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
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- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000001761 ethyl methyl cellulose Substances 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229920003063 hydroxymethyl cellulose Polymers 0.000 description 1
- 229940031574 hydroxymethyl cellulose Drugs 0.000 description 1
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 1
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 1
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 1
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
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- 230000002093 peripheral effect Effects 0.000 description 1
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- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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Description
11 第1焼結体
12 第2焼結体
13 接合層
14 凸部
Claims (7)
- 第1の酸化アルミニウム質焼結体と、第2の酸化アルミニウム質焼結体と、前記第1の酸化アルミニウム質焼結体と前記第2の酸化アルミニウム質焼結体との間に位置する酸化アルミニウム質接合層と、該酸化アルミニウム質接合層に繋がる酸化アルミニウム質凸部と、を有するセラミック接合体であって、
該酸化アルミニウム質凸部の閉気孔の平均径が、1.5μm以下であるとともに前記第1の酸化アルミニウム質焼結体および前記第2の酸化アルミニウム質焼結体のそれぞれの閉気孔の平均径の0.8倍以上1.5倍以下である、セラミック接合体。 - 前記酸化アルミニウム質凸部の閉気孔の平均径が、前記第1の酸化アルミニウム質焼結体および前記第2の酸化アルミニウム質焼結体のそれぞれの閉気孔の平均径よりも小さい、請求項1に記載のセラミック接合体。
- 前記酸化アルミニウム質凸部の閉気孔の重心間距離の歪度Skの絶対値が前記第1の酸化アルミニウム質焼結体および前記第2の酸化アルミニウム質焼結体のそれぞれの重心間距離の歪度Skの絶対値よりも小さい領域を有する、請求項1または請求項2に記載のセラミック接合体。
- 前記酸化アルミニウム質凸部の閉気孔の重心間距離の平均値から前記酸化アルミニウム質凸部の閉気孔の平均径を差し引いた値が、前記第1の酸化アルミニウム質焼結体の閉気孔の重心間距離の平均値から前記第1の酸化アルミニウム質焼結体の閉気孔の平均径を差し引いた値の0.4倍以上であり、前記第2の酸化アルミニウム質焼結体の閉気孔の重心間距離の平均値から前記第2の酸化アルミニウム質焼結体の閉気孔の平均径を差し引いた値の0.4倍以上である、請求項1乃至請求項3のいずれかに記載のセラミック接合体。
- 前記酸化アルミニウム質凸部の閉気孔の円相当径の歪度Skは、前記酸化アルミニウム質凸部の閉気孔の重心間距離の歪度Skよりも大きい、請求項1乃至請求項4のいずれかに記載のセラミック接合体。
- 前記酸化アルミニウム質凸部の閉気孔の円形度の平均値が0.78以上である、請求項1乃至請求項3のいずれかに記載のセラミック接合体。
- 請求項1乃至6のいずれかに記載のセラミック接合体の製造方法であって、
酸化アルミニウムを主成分とする粉末と樹脂とを含有する第1成形体と、酸化アルミニウムを主成分とする粉末と樹脂とを含有する第2成形体とを準備する工程と、
酸化アルミニウムを主成分とする粉末とセルロース系多糖類と溶媒とを含有するペーストを準備する工程と、
前記第1成形体および前記第2成形体のいずれかの表面に前記ペーストを存在させる工程と、
前記第1成形体と前記第2成形体との間である接合領域から前記ペーストが突出するように前記第1成形体および前記第2成形体を合わせて複合成形体とする工程と、前記複合成形体を焼成する工程とを、有する、セラミック接合体の製造方法。
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