JP6943959B2 - 電子回路基板 - Google Patents
電子回路基板 Download PDFInfo
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- JP6943959B2 JP6943959B2 JP2019528979A JP2019528979A JP6943959B2 JP 6943959 B2 JP6943959 B2 JP 6943959B2 JP 2019528979 A JP2019528979 A JP 2019528979A JP 2019528979 A JP2019528979 A JP 2019528979A JP 6943959 B2 JP6943959 B2 JP 6943959B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
図1は、本発明の実施形態1に係る電子回路基板100の要部を拡大した平面図である。図2は、図1に示す電子回路基板100のII-II線に沿う断面図である。図3は、図1に示す電子回路基板100のIII-III線に沿う断面図である。
次に、図6および図7を参照して、本発明の実施形態2に係る電子回路基板200について説明する。
Claims (6)
- プリント配線板と、該プリント配線板の表面に実装された電子部品とを備える電子回路基板であって、
前記プリント配線板は、前記表面に沿う一方向に並んだ第1ランドと第2ランドを有し、
前記電子部品は、前記第1ランドにはんだ接合される第1接合部と、前記第2ランドにはんだ接合される第2接合部とを有し、
前記第1ランドと前記第1接合部の接合面積は、前記第2ランドと前記第2接合部の接合面積よりも大きく、
前記第1ランドと前記第2ランドは、前記一方向において、それぞれ、互いに近接する内側縁と、該内側縁と反対側で互いに離隔する外側縁とを有し、
前記第1接合部と前記第2接合部は、前記一方向において、それぞれ、互いに近接する内側縁と、該内側縁と反対側で互いに離隔する外側縁とを有し、
前記一方向において、前記第1ランドの前記外側縁と前記内側縁は、前記電子部品の本体部の両側縁の内側に位置しており、前記第1接合部の前記外側縁の位置は、前記第1ランドの前記外側縁の位置に揃えられており、前記第2接合部の前記外側縁と前記内側縁は、前記第2ランドの前記外側縁と前記内側縁の間に位置しており、
前記一方向に直交しかつ前記プリント配線板の表面に沿う方向において、前記第1接合部の両側縁の位置は、前記第1ランドの両側縁の位置に揃えられていることを特徴とする電子回路基板。 - 前記一方向において、前記第2ランドと前記第2接合部は、前記電子部品の片側に設けられていることを特徴とする請求項1に記載の電子回路基板。
- プリント配線板と、該プリント配線板の表面に実装された電子部品とを備える電子回路基板であって、
前記プリント配線板は、前記表面に沿う一方向に並んだ第1ランドと第2ランドを有し、
前記電子部品は、前記第1ランドにはんだ接合される第1接合部と、前記第2ランドにはんだ接合される第2接合部とを有し、
前記第1ランドと前記第1接合部の接合面積は、前記第2ランドと前記第2接合部の接合面積よりも大きく、
前記第1ランドと前記第2ランドは、前記一方向において、それぞれ、互いに近接する内側縁と、該内側縁と反対側で互いに離隔する外側縁とを有し、
前記第1接合部と前記第2接合部は、前記一方向において、それぞれ、互いに近接する内側縁と、該内側縁と反対側で互いに離隔する外側縁とを有し、
前記一方向において、前記第1接合部の前記外側縁の位置は、前記第1ランドの前記外側縁の位置に揃えられており、前記第2ランドと前記第2接合部は、前記電子部品の両側に設けられており、
前記一方向に直交しかつ前記プリント配線板の表面に沿う方向において、前記第1接合部の両側縁の位置は、前記第1ランドの両側縁の位置に揃えられていることを特徴とする電子回路基板。 - 前記第1ランドは、前記外側縁から前記一方向へ突出する突出部を有し、
前記一方向に直交する前記方向における前記突出部の寸法と、前記一方向における前記第2接合部の前記外側縁と前記第2ランドの前記外側縁との間の距離とは、それぞれ自動光学検査においてはんだフィレットの検査に必要な最小限の範囲に設定されていることを特徴とする請求項1に記載の電子回路基板。 - 前記電子部品は、本体部と、該本体部に設けられた放熱部と、前記本体部から前記一方向に延びるリード端子とを備え、
前記第1接合部は、前記第1ランドに対向する前記放熱部の表面であり、
前記第2接合部は、前記第2ランドに対向する前記リード端子の先端部であることを特徴とする請求項4に記載の電子回路基板。 - 前記第1ランドの表面の前記一方向および該一方向に直交する前記方向にそれぞれ帯状に形成されたソルダーレジストと、
前記第1ランドおよび前記プリント配線板を貫通して前記ソルダーレジストによって被覆された領域に開口する複数のサーマルビアと、をさらに備え、
前記第1接合部は、前記突出部、前記ソルダーレジストが形成された領域、および前記サーマルビアの開口を除く部分に対向する前記放熱部の表面であり、複数の領域に分割されていることを特徴とする請求項5に記載の電子回路基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017135509 | 2017-07-11 | ||
JP2017135509 | 2017-07-11 | ||
PCT/JP2018/021133 WO2019012849A1 (ja) | 2017-07-11 | 2018-06-01 | 電子回路基板 |
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JPWO2019012849A1 JPWO2019012849A1 (ja) | 2020-04-02 |
JP6943959B2 true JP6943959B2 (ja) | 2021-10-06 |
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US (1) | US11096285B2 (ja) |
JP (1) | JP6943959B2 (ja) |
WO (1) | WO2019012849A1 (ja) |
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JP7462502B2 (ja) | 2020-07-20 | 2024-04-05 | Fdk株式会社 | 部品実装基板及びその製造方法 |
JP2022120923A (ja) * | 2021-02-08 | 2022-08-19 | 株式会社アイシン | 回路基板 |
WO2024095422A1 (ja) * | 2022-11-02 | 2024-05-10 | 日立Astemo株式会社 | 電子制御装置 |
Family Cites Families (19)
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JPS602873U (ja) * | 1983-06-20 | 1985-01-10 | 三洋電機株式会社 | 面実装トランジスタの半田付け構造 |
JPH10229263A (ja) | 1997-02-17 | 1998-08-25 | Fuji Electric Co Ltd | 表面実装部品搭載用のプリント配線板と、その搭載方法 |
JP3931696B2 (ja) * | 2002-03-14 | 2007-06-20 | 株式会社デンソー | 電子装置 |
JP2005340684A (ja) * | 2004-05-31 | 2005-12-08 | Calsonic Kansei Corp | 基板への電子素子の取付構造 |
JP4416616B2 (ja) * | 2004-09-29 | 2010-02-17 | 株式会社リコー | 電子部品実装体及び電子機器 |
GB2422249A (en) * | 2005-01-15 | 2006-07-19 | Robert John Morse | Power substrate |
KR20080013865A (ko) * | 2005-06-06 | 2008-02-13 | 로무 가부시키가이샤 | 반도체 장치, 기판 및 반도체 장치의 제조 방법 |
EP2337068A1 (en) * | 2009-12-18 | 2011-06-22 | Nxp B.V. | Pre-soldered leadless package |
JP5703500B2 (ja) | 2011-09-13 | 2015-04-22 | アルプス・グリーンデバイス株式会社 | 電子部品の実装構造 |
US8895998B2 (en) * | 2012-03-30 | 2014-11-25 | Cree, Inc. | Ceramic-based light emitting diode (LED) devices, components and methods |
KR20130139011A (ko) * | 2012-06-12 | 2013-12-20 | 한국전자통신연구원 | Dbc 기판 및 전력 반도체 모듈 |
US20160088720A1 (en) * | 2014-09-24 | 2016-03-24 | Hiq Solar, Inc. | Transistor thermal and emi management solution for fast edge rate environment |
US20160141232A1 (en) * | 2014-11-19 | 2016-05-19 | Cambridge Silicon Radio Limited | Integrated circuit package |
US20160172548A1 (en) * | 2014-12-10 | 2016-06-16 | Baskaran A/L Govinda Nair | Method of manufacturing chip-on-board and surface mount device led substrate |
JP6330690B2 (ja) * | 2015-02-19 | 2018-05-30 | 株式会社オートネットワーク技術研究所 | 基板ユニット |
JP6260566B2 (ja) * | 2015-03-25 | 2018-01-17 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP2016213308A (ja) * | 2015-05-08 | 2016-12-15 | キヤノン株式会社 | プリント回路板及びプリント配線板 |
US10211128B2 (en) * | 2017-06-06 | 2019-02-19 | Amkor Technology, Inc. | Semiconductor package having inspection structure and related methods |
US10199312B1 (en) * | 2017-09-09 | 2019-02-05 | Amkor Technology, Inc. | Method of forming a packaged semiconductor device having enhanced wettable flank and structure |
-
2018
- 2018-06-01 WO PCT/JP2018/021133 patent/WO2019012849A1/ja active Application Filing
- 2018-06-01 US US16/619,709 patent/US11096285B2/en active Active
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US11096285B2 (en) | 2021-08-17 |
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US20200205290A1 (en) | 2020-06-25 |
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