JP6936672B2 - インプリント装置、インプリント方法および物品製造方法 - Google Patents

インプリント装置、インプリント方法および物品製造方法 Download PDF

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Publication number
JP6936672B2
JP6936672B2 JP2017179008A JP2017179008A JP6936672B2 JP 6936672 B2 JP6936672 B2 JP 6936672B2 JP 2017179008 A JP2017179008 A JP 2017179008A JP 2017179008 A JP2017179008 A JP 2017179008A JP 6936672 B2 JP6936672 B2 JP 6936672B2
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Japan
Prior art keywords
substrate
imprint material
light
shot region
mold
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JP2017179008A
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English (en)
Japanese (ja)
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JP2019054212A (ja
JP2019054212A5 (https=
Inventor
直記 村里
直記 村里
賢 箕田
賢 箕田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2017179008A priority Critical patent/JP6936672B2/ja
Priority to KR1020180107756A priority patent/KR20190032208A/ko
Priority to US16/130,298 priority patent/US11187977B2/en
Publication of JP2019054212A publication Critical patent/JP2019054212A/ja
Publication of JP2019054212A5 publication Critical patent/JP2019054212A5/ja
Application granted granted Critical
Publication of JP6936672B2 publication Critical patent/JP6936672B2/ja
Priority to KR1020210153591A priority patent/KR102459131B1/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0961—Lens arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017179008A 2017-09-19 2017-09-19 インプリント装置、インプリント方法および物品製造方法 Active JP6936672B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017179008A JP6936672B2 (ja) 2017-09-19 2017-09-19 インプリント装置、インプリント方法および物品製造方法
KR1020180107756A KR20190032208A (ko) 2017-09-19 2018-09-10 임프린트 장치, 임프린트 방법 및 물품 제조 방법
US16/130,298 US11187977B2 (en) 2017-09-19 2018-09-13 Imprint apparatus, imprint method, and method of manufacturing article
KR1020210153591A KR102459131B1 (ko) 2017-09-19 2021-11-10 임프린트 장치, 임프린트 방법 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017179008A JP6936672B2 (ja) 2017-09-19 2017-09-19 インプリント装置、インプリント方法および物品製造方法

Publications (3)

Publication Number Publication Date
JP2019054212A JP2019054212A (ja) 2019-04-04
JP2019054212A5 JP2019054212A5 (https=) 2020-10-15
JP6936672B2 true JP6936672B2 (ja) 2021-09-22

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JP2017179008A Active JP6936672B2 (ja) 2017-09-19 2017-09-19 インプリント装置、インプリント方法および物品製造方法

Country Status (3)

Country Link
US (1) US11187977B2 (https=)
JP (1) JP6936672B2 (https=)
KR (2) KR20190032208A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7292479B2 (ja) * 2018-12-20 2023-06-16 キヤノン株式会社 インプリント装置および物品製造方法
JP7358192B2 (ja) * 2019-10-25 2023-10-10 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7486335B2 (ja) 2020-03-30 2024-05-17 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法
JP7769515B2 (ja) 2021-11-04 2025-11-13 キヤノン株式会社 インプリント装置
JP2024090242A (ja) * 2022-12-22 2024-07-04 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2073798A (en) * 1933-12-08 1937-03-16 Hillman Albert George Production of cinematographic effects in color and means therefor
US4712910A (en) * 1984-01-05 1987-12-15 Nippon Kogaku K.K. Exposure method and apparatus for semiconductor fabrication equipment
JPH09204050A (ja) * 1995-11-24 1997-08-05 Sanei Denki Seisakusho:Kk 光照射装置
JPH11233423A (ja) * 1998-02-06 1999-08-27 Canon Inc 露光用シャッタおよび露光装置ならびにディバイス製造方法
JP4481698B2 (ja) * 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
JP5002211B2 (ja) * 2005-08-12 2012-08-15 キヤノン株式会社 インプリント装置およびインプリント方法
US8202075B2 (en) * 2005-08-12 2012-06-19 Canon Kabushiki Kaisha Imprint apparatus and imprint method
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
JP5127875B2 (ja) * 2010-04-28 2013-01-23 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
KR20140033201A (ko) * 2011-07-08 2014-03-17 도요세이칸 그룹 홀딩스 가부시키가이샤 열 가소성 수지 제품의 성형 방법 및 그 성형 장치
JP6200135B2 (ja) 2012-07-24 2017-09-20 キヤノン株式会社 インプリント装置、インプリント方法、および、物品製造方法
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
JP6415057B2 (ja) * 2014-02-07 2018-10-31 キヤノン株式会社 露光装置、および物品の製造方法
JP5773024B2 (ja) * 2014-04-25 2015-09-02 大日本印刷株式会社 ナノインプリントによるパターン形成装置
JP6632270B2 (ja) * 2014-09-08 2020-01-22 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
WO2017203727A1 (ja) * 2016-05-26 2017-11-30 ホロニクス・インターナショナル株式会社 樹脂硬化用光源装置

Also Published As

Publication number Publication date
KR20190032208A (ko) 2019-03-27
KR20210138531A (ko) 2021-11-19
JP2019054212A (ja) 2019-04-04
US20190086796A1 (en) 2019-03-21
KR102459131B1 (ko) 2022-10-27
US11187977B2 (en) 2021-11-30

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