JP6926018B2 - 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 - Google Patents

転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 Download PDF

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JP6926018B2
JP6926018B2 JP2018061743A JP2018061743A JP6926018B2 JP 6926018 B2 JP6926018 B2 JP 6926018B2 JP 2018061743 A JP2018061743 A JP 2018061743A JP 2018061743 A JP2018061743 A JP 2018061743A JP 6926018 B2 JP6926018 B2 JP 6926018B2
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Prior art keywords
transfer
chip component
substrate
board
chip
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JP2018061743A
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Japanese (ja)
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JP2019175978A (ja
JP2019175978A5 (https=
Inventor
靖典 橋本
靖典 橋本
昇 朝日
昇 朝日
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Priority to JP2018061743A priority Critical patent/JP6926018B2/ja
Priority to PCT/JP2019/009222 priority patent/WO2019188105A1/ja
Priority to TW108110276A priority patent/TWI758594B/zh
Publication of JP2019175978A publication Critical patent/JP2019175978A/ja
Publication of JP2019175978A5 publication Critical patent/JP2019175978A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)
JP2018061743A 2018-03-28 2018-03-28 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 Active JP6926018B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018061743A JP6926018B2 (ja) 2018-03-28 2018-03-28 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法
PCT/JP2019/009222 WO2019188105A1 (ja) 2018-03-28 2019-03-08 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法
TW108110276A TWI758594B (zh) 2018-03-28 2019-03-25 轉印基板及使用其之安裝方法、以及圖像顯示裝置之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018061743A JP6926018B2 (ja) 2018-03-28 2018-03-28 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

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JP2019175978A JP2019175978A (ja) 2019-10-10
JP2019175978A5 JP2019175978A5 (https=) 2021-02-04
JP6926018B2 true JP6926018B2 (ja) 2021-08-25

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JP (1) JP6926018B2 (https=)
TW (1) TWI758594B (https=)
WO (1) WO2019188105A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11749585B2 (en) * 2020-02-28 2023-09-05 Intel Corporation High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package
JP7463153B2 (ja) * 2020-03-23 2024-04-08 東レエンジニアリング株式会社 実装方法および実装装置
JP2022115687A (ja) * 2021-01-28 2022-08-09 東レエンジニアリング株式会社 転写装置
CN115335974A (zh) * 2020-03-23 2022-11-11 东丽工程株式会社 安装方法、安装装置以及转印装置
TWI744181B (zh) * 2021-01-28 2021-10-21 台灣愛司帝科技股份有限公司 晶片移轉模組以及晶片移轉與固晶裝置與方法
US20220302339A1 (en) * 2021-03-16 2022-09-22 Applied Materials, Inc. Led transfer materials and processes

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130861A (ja) * 2006-11-22 2008-06-05 Sony Corp シリコーンゴム層積層体及びその製造方法、突当て装置、実装用基板への物品の実装方法、並びに、発光ダイオード表示装置の製造方法
TWI590498B (zh) * 2013-06-03 2017-07-01 財團法人工業技術研究院 電子元件的轉移方法及電子元件陣列
JP6002334B2 (ja) * 2013-11-05 2016-10-05 千住金属工業株式会社 はんだ転写シート
JP2015130476A (ja) * 2013-12-04 2015-07-16 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、封止型光半導体素子ならびに光半導体装置
JP6446951B2 (ja) * 2014-09-26 2019-01-09 日亜化学工業株式会社 素子の実装方法及び発光装置の製造方法
KR101990227B1 (ko) * 2014-12-05 2019-06-17 히타치가세이가부시끼가이샤 반도체용 접착제, 및, 반도체 장치 및 그 제조 방법
JP2016167544A (ja) * 2015-03-10 2016-09-15 ソニー株式会社 電子部品、電子部品実装基板及び電子部品の実装方法
JP6504263B2 (ja) * 2015-10-29 2019-04-24 日立化成株式会社 半導体用接着剤、半導体装置及びそれを製造する方法
CN108603028B (zh) * 2016-02-08 2021-05-07 东丽株式会社 树脂组合物、树脂层、临时粘贴粘接剂、层叠膜、晶片加工体及其应用
WO2017195517A1 (ja) * 2016-05-09 2017-11-16 日立化成株式会社 半導体装置の製造方法

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JP2019175978A (ja) 2019-10-10
WO2019188105A1 (ja) 2019-10-03
TWI758594B (zh) 2022-03-21
TW202004933A (zh) 2020-01-16

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