JP6923958B2 - 実装装置および温度測定方法 - Google Patents
実装装置および温度測定方法 Download PDFInfo
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- JP6923958B2 JP6923958B2 JP2019537653A JP2019537653A JP6923958B2 JP 6923958 B2 JP6923958 B2 JP 6923958B2 JP 2019537653 A JP2019537653 A JP 2019537653A JP 2019537653 A JP2019537653 A JP 2019537653A JP 6923958 B2 JP6923958 B2 JP 6923958B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75824—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Description
Claims (7)
- 実装体を被実装体に実装する実装装置であって、
前記被実装体が載置される載置面及び前記載置面を加熱する第一ヒータを有するステージと、
前記被実装体又は前記載置面である被測定物に接触する接触面と、前記接触面を介して前記被測定物の温度を測定する測定素子と、前記接触面を加熱する第二ヒータと、を有し、少なくとも前記載置面に対して直交方向に駆動する測定ヘッドと、
前記被測定物がターゲット温度になると予測されるステージ側目標温度まで前記第一ヒータを加熱するとともに前記接触面が前記ターゲット温度になるまで前記第二ヒータを加熱した後、前記第二ヒータの加熱を停止した状態で前記接触面を前記被測定物に接触させた初期タイミングから一定時間経過するまでの間に得られる前記測定素子の温度検出値の時間変化に基づいて、前記被測定物の前記初期タイミングにおける温度または前記被測定物の前記初期タイミングにおける温度の良否を判断する制御部と、
を備えることを特徴とする実装装置。 - 請求項1に記載の実装装置であって、
前記測定ヘッドは、前記実装体を、前記被実装体にボンディングするボンディングヘッドである、ことを特徴とする実装装置。 - 請求項1に記載の実装装置であって、
前記制御部は、前記測定素子の温度検出値が時間の経過に伴い増加する場合は、前記被測定物の前記初期タイミングにおける温度が前記ターゲット温度より高く、前記測定素子の温度検出値が時間の経過に伴い減少する場合は、前記被測定物の前記初期タイミングにおける温度が前記ターゲット温度より低く、前記測定素子の温度検出値が時間が経過しても変動しない場合は、前記被測定物の前記初期タイミングにおける前記ターゲット温度が目標値と等しい、と判断する、ことを特徴とする実装装置。 - 請求項1から3のいずれか1項に記載の実装装置であって、
前記制御部は、前記被測定物の温度または温度の良否の判断結果に基づいて、前記被測定物の温度が前記ターゲット温度に近づくように、前記第二ヒータの制御パラメータを補正する、ことを特徴とする実装装置。 - 請求項4に記載の実装装置であって、
前記被測定物には、複数の測定ポイントが設定されており、
前記制御部は、前記複数の測定ポイントについて、前記温度の測定を行い、前記複数の測定ポイント間で測定結果が均等になるように、前記制御パラメータを補正する、
ことを特徴とする実装装置。 - 請求項1から5のいずれか1項に記載の実装装置であって、
前記測定ヘッドは、さらに、本体と、前記本体よりも熱容量が小さくかつ断熱材を介して前記本体に取り付けられた測定ブロックと、を有しており、
前記接触面は、前記測定ブロックの端面であり、
前記測定素子は、前記測定ブロック内に設けられる、
ことを特徴とする実装装置。 - 実装装置のステージの載置面に載置された被実装体または前記ステージの載置面である被測定物の温度を測定ヘッドにより測定する温度測定方法であって、
前記被測定物がターゲット温度になると予測されるステージ側目標温度まで前記ステージの内部に設けられた第一ヒータを加熱するとともに前記測定ヘッドのうち前記被測定物に接触する接触面が前記ターゲット温度になるまで前記測定ヘッドに設けられた第二ヒータを加熱するステップと、
前記加熱した後、前記第二ヒータを停止した状態で前記接触面を前記被測定物に接触させるステップと、
前記接触させた初期タイミングから一定時間経過するまでの間に前記測定ヘッドに設けられた温度の測定素子で得られる温度検出値の時間変化に基づいて、前記被測定物の前記初期タイミングにおける温度または前記被測定物の前記初期タイミングにおける温度の良否を判断するステップと、
を備えることを特徴とする温度測定方法
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2017159714 | 2017-08-22 | ||
JP2017159714 | 2017-08-22 | ||
PCT/JP2018/030986 WO2019039508A1 (ja) | 2017-08-22 | 2018-08-22 | 実装装置および温度測定方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2019039508A1 JPWO2019039508A1 (ja) | 2020-07-27 |
JP6923958B2 true JP6923958B2 (ja) | 2021-08-25 |
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JP2019537653A Active JP6923958B2 (ja) | 2017-08-22 | 2018-08-22 | 実装装置および温度測定方法 |
Country Status (7)
Country | Link |
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US (1) | US11562916B2 (ja) |
JP (1) | JP6923958B2 (ja) |
KR (1) | KR102388058B1 (ja) |
CN (1) | CN111033705B (ja) |
SG (1) | SG11202001500VA (ja) |
TW (1) | TWI682152B (ja) |
WO (1) | WO2019039508A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7368962B2 (ja) * | 2019-07-09 | 2023-10-25 | 芝浦メカトロニクス株式会社 | 実装装置 |
NL2023792B1 (en) | 2019-08-16 | 2021-03-24 | Illumina Inc | Method for measuring thermal resistance at interface between consumable and thermocycler |
TWI717056B (zh) * | 2019-10-15 | 2021-01-21 | 萬潤科技股份有限公司 | 散熱片壓合製程之溫度控制方法及裝置 |
CN111913099B (zh) * | 2020-10-13 | 2021-01-08 | 天津金海通自动化设备制造有限公司 | 一种测试设备的温控装置及温控方法 |
WO2023235723A1 (en) * | 2022-06-01 | 2023-12-07 | Watlow Electric Manufacturing Company | Method and system for calibrating a controller that determines a resistance of a load |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01189526A (ja) | 1988-01-25 | 1989-07-28 | Nec Niigata Ltd | 電子体温計 |
JPH08111385A (ja) | 1994-10-11 | 1996-04-30 | Nissin Electric Co Ltd | 気相成長装置用基板加熱制御装置 |
JPH113911A (ja) * | 1997-06-12 | 1999-01-06 | Matsushita Electric Ind Co Ltd | 電子部品接合方法及び装置 |
JPH11186338A (ja) | 1997-12-24 | 1999-07-09 | Casio Comput Co Ltd | ボンディング装置 |
JP3178518B2 (ja) * | 1998-03-30 | 2001-06-18 | 芝浦メカトロニクス株式会社 | リードフレームの加熱装置 |
JP2000036501A (ja) * | 1998-05-12 | 2000-02-02 | Sharp Corp | ダイボンド装置 |
TW533316B (en) * | 1998-12-08 | 2003-05-21 | Advantest Corp | Testing device for electronic device |
US7577493B2 (en) * | 2004-12-27 | 2009-08-18 | Hitachi Kokusai Electric Inc. | Temperature regulating method, thermal processing system and semiconductor device manufacturing method |
TW200822253A (en) * | 2006-10-02 | 2008-05-16 | Matsushita Electric Ind Co Ltd | Component crimping apparatus control method, component crimping apparatus, and measuring tool |
JP5259116B2 (ja) | 2007-04-17 | 2013-08-07 | キヤノンマシナリー株式会社 | ダイボンダ |
US9658118B2 (en) * | 2012-11-16 | 2017-05-23 | Linear Technology Corporation | Precision temperature measurement devices, sensors, and methods |
JP6581389B2 (ja) | 2015-05-12 | 2019-09-25 | 東芝メモリ株式会社 | 半導体装置の製造装置及び製造方法 |
JP6639915B2 (ja) * | 2016-01-08 | 2020-02-05 | 東レエンジニアリング株式会社 | 半導体実装装置および半導体実装方法 |
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2018
- 2018-08-22 SG SG11202001500VA patent/SG11202001500VA/en unknown
- 2018-08-22 KR KR1020207002437A patent/KR102388058B1/ko active IP Right Grant
- 2018-08-22 JP JP2019537653A patent/JP6923958B2/ja active Active
- 2018-08-22 CN CN201880050359.6A patent/CN111033705B/zh active Active
- 2018-08-22 WO PCT/JP2018/030986 patent/WO2019039508A1/ja active Application Filing
- 2018-08-22 US US16/650,381 patent/US11562916B2/en active Active
- 2018-08-22 TW TW107129206A patent/TWI682152B/zh active
Also Published As
Publication number | Publication date |
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CN111033705A (zh) | 2020-04-17 |
SG11202001500VA (en) | 2020-03-30 |
US11562916B2 (en) | 2023-01-24 |
CN111033705B (zh) | 2023-09-08 |
TW201920920A (zh) | 2019-06-01 |
KR102388058B1 (ko) | 2022-04-19 |
JPWO2019039508A1 (ja) | 2020-07-27 |
KR20200019237A (ko) | 2020-02-21 |
TWI682152B (zh) | 2020-01-11 |
US20200365432A1 (en) | 2020-11-19 |
WO2019039508A1 (ja) | 2019-02-28 |
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