SG11202001500VA - Mounting apparatus and temperature measurement method - Google Patents

Mounting apparatus and temperature measurement method

Info

Publication number
SG11202001500VA
SG11202001500VA SG11202001500VA SG11202001500VA SG11202001500VA SG 11202001500V A SG11202001500V A SG 11202001500VA SG 11202001500V A SG11202001500V A SG 11202001500VA SG 11202001500V A SG11202001500V A SG 11202001500VA SG 11202001500V A SG11202001500V A SG 11202001500VA
Authority
SG
Singapore
Prior art keywords
measurement method
temperature measurement
mounting apparatus
mounting
temperature
Prior art date
Application number
SG11202001500VA
Inventor
Shoji Wada
Hiroshi Kikuchi
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202001500VA publication Critical patent/SG11202001500VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
SG11202001500VA 2017-08-22 2018-08-22 Mounting apparatus and temperature measurement method SG11202001500VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017159714 2017-08-22
PCT/JP2018/030986 WO2019039508A1 (en) 2017-08-22 2018-08-22 Mounting device and temperature measuring method

Publications (1)

Publication Number Publication Date
SG11202001500VA true SG11202001500VA (en) 2020-03-30

Family

ID=65439084

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202001500VA SG11202001500VA (en) 2017-08-22 2018-08-22 Mounting apparatus and temperature measurement method

Country Status (7)

Country Link
US (1) US11562916B2 (en)
JP (1) JP6923958B2 (en)
KR (1) KR102388058B1 (en)
CN (1) CN111033705B (en)
SG (1) SG11202001500VA (en)
TW (1) TWI682152B (en)
WO (1) WO2019039508A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7368962B2 (en) * 2019-07-09 2023-10-25 芝浦メカトロニクス株式会社 mounting equipment
NL2023792B1 (en) 2019-08-16 2021-03-24 Illumina Inc Method for measuring thermal resistance at interface between consumable and thermocycler
TWI717056B (en) * 2019-10-15 2021-01-21 萬潤科技股份有限公司 Temperature control method and device for heat sink pressing process
CN111913099B (en) * 2020-10-13 2021-01-08 天津金海通自动化设备制造有限公司 Temperature control device and temperature control method of test equipment
TW202349012A (en) * 2022-06-01 2023-12-16 美商瓦特洛威電子製造公司 Method and system for calibrating a controller that determines a resistance of a load

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01189526A (en) * 1988-01-25 1989-07-28 Nec Niigata Ltd Electronic clinical thermometer
JPH08111385A (en) * 1994-10-11 1996-04-30 Nissin Electric Co Ltd Substrate heating controller for vapor growth device
JPH113911A (en) * 1997-06-12 1999-01-06 Matsushita Electric Ind Co Ltd Method and device for jointing electronic components
JPH11186338A (en) 1997-12-24 1999-07-09 Casio Comput Co Ltd Bonding device
JP3178518B2 (en) * 1998-03-30 2001-06-18 芝浦メカトロニクス株式会社 Lead frame heating device
JP2000036501A (en) * 1998-05-12 2000-02-02 Sharp Corp Die bond device
TW533316B (en) * 1998-12-08 2003-05-21 Advantest Corp Testing device for electronic device
US7577493B2 (en) * 2004-12-27 2009-08-18 Hitachi Kokusai Electric Inc. Temperature regulating method, thermal processing system and semiconductor device manufacturing method
TW200822253A (en) * 2006-10-02 2008-05-16 Matsushita Electric Ind Co Ltd Component crimping apparatus control method, component crimping apparatus, and measuring tool
JP5259116B2 (en) * 2007-04-17 2013-08-07 キヤノンマシナリー株式会社 Die bonder
US9658118B2 (en) * 2012-11-16 2017-05-23 Linear Technology Corporation Precision temperature measurement devices, sensors, and methods
JP6581389B2 (en) * 2015-05-12 2019-09-25 東芝メモリ株式会社 Semiconductor device manufacturing apparatus and manufacturing method
JP6639915B2 (en) * 2016-01-08 2020-02-05 東レエンジニアリング株式会社 Semiconductor mounting apparatus and semiconductor mounting method

Also Published As

Publication number Publication date
US20200365432A1 (en) 2020-11-19
CN111033705A (en) 2020-04-17
WO2019039508A1 (en) 2019-02-28
JPWO2019039508A1 (en) 2020-07-27
KR20200019237A (en) 2020-02-21
TWI682152B (en) 2020-01-11
TW201920920A (en) 2019-06-01
CN111033705B (en) 2023-09-08
US11562916B2 (en) 2023-01-24
KR102388058B1 (en) 2022-04-19
JP6923958B2 (en) 2021-08-25

Similar Documents

Publication Publication Date Title
IL272735A (en) Measuring apparatus and measuring method
HK1246622A1 (en) Measurement device and measurement method
PT3488660T (en) Method and apparatus for measurement report
EP2952135A4 (en) Temperature measurement device and temperature measurement method
SG11202001500VA (en) Mounting apparatus and temperature measurement method
SG11201702286WA (en) Residual-stress measurement device and residual-stress measurement method
PL3270104T3 (en) Shape measuring apparatus and shape measuring method
GB2562452B (en) Sensing apparatus and method
SG11201701130TA (en) Mounting device and measurement method
GB2546522B (en) Method and apparatus for measuring flows
PL3609015T3 (en) Apparatus and method for estimating battery temperature
GB201600445D0 (en) Methods and apparatuses for temperature measurement
PL3675555T3 (en) Cell measurement method and apparatus
GB201802976D0 (en) An apparatus and method
GB201809631D0 (en) Measurement method and apparatus
GB201707898D0 (en) Thermocouple arrangement and method for measuring
GB201714067D0 (en) Sensing apparatus and method
GB201500918D0 (en) Measuring apparatus and method
GB201615307D0 (en) Measurement method and apparatus
GB201616787D0 (en) Measurement apparatus and methods
GB2554578B (en) Viscosity measuring method and viscosity measuring apparatus
EP3450941C0 (en) Temperature measuring device and measurement alignment method thereof
GB201505999D0 (en) Measurement method and apparatus
GB201715634D0 (en) Mounting apparatus and method
GB2546799B (en) Mounting method and apparatus