JP6917227B2 - インラインシステム - Google Patents
インラインシステム Download PDFInfo
- Publication number
- JP6917227B2 JP6917227B2 JP2017137670A JP2017137670A JP6917227B2 JP 6917227 B2 JP6917227 B2 JP 6917227B2 JP 2017137670 A JP2017137670 A JP 2017137670A JP 2017137670 A JP2017137670 A JP 2017137670A JP 6917227 B2 JP6917227 B2 JP 6917227B2
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- JP
- Japan
- Prior art keywords
- workpiece
- work piece
- processing apparatus
- opening
- cassette
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Description
2 保護部材貼着装置(第1の加工装置)
21 第1のロボット
3 研削装置(第2の加工装置)
31 第2のロボット
4 受渡手段
6 仮置きカセット
60 棚板(棚)
61 側壁
62 底板
63 天板
64 第1の開口
65 第2の開口
7 テーブル
70 載置面
71 回転手段
W 被加工物
Claims (1)
- 板状の被加工物を加工する第1の加工装置と、
被加工物を加工する第2の加工装置と、
X方向に並べて設置した該第1の加工装置と該第2の加工装置との間に配設し該第1の加工装置から該第2の加工装置へ被加工物の受け渡しをする受渡手段と、を備えたインラインシステムであって、
該第1の加工装置は、該受渡手段を基準に−X方向側に配設され、被加工物を搬送する第1のロボットを備え、
該第2の加工装置は、該受渡手段を基準に+X方向側に配設され、被加工物を搬送する第2のロボットを備え、
該受渡手段は、
被加工物を棚状に収容可能にする仮置きカセットと、
該仮置きカセットを載置する載置面を有するテーブルとを備え、
該仮置きカセットは、
被加工物を載置する段状に形成する複数の棚と、
該テーブルの該載置面方向において該X方向に直交するY方向の該棚の両側辺を連結する側壁と、
該側壁の上辺を連結する天板と、
該側壁の下辺を連結する底板と、
該X方向で−X側面に形成する第1の開口と、
+X側面に形成する第2の開口とを備え、
該テーブルは、該仮置きカセットを載置する該載置面に対して垂直方向を軸方向とし該載置面の中心を軸に該テーブルを±90度回転自在にする回転手段を備え、
該第1のロボットが該第1の開口から被加工物を該棚上に搬入させ、該第2の搬送ロボットが該第2の開口から該棚上の被加工物を搬出させ、該仮置きカセットを介して該第1の加工装置から第2の加工装置へ被加工物を搬送させ、
該回転手段でテーブルを+方向に90度回転させ該第1の開口を+Y方向側に位置づけたり、該回転手段で該テーブルを−方向に90度回転させ該第2の開口を該+Y方向側に位置づけたりして、該+Y方向側から該仮置きカセットに収容されている被加工物の抜き取りを可能するインラインシステム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017137670A JP6917227B2 (ja) | 2017-07-14 | 2017-07-14 | インラインシステム |
TW107119102A TWI757501B (zh) | 2017-07-14 | 2018-06-04 | 在線系統 |
KR1020180078630A KR102517022B1 (ko) | 2017-07-14 | 2018-07-06 | 인라인 시스템 |
CN201810743588.8A CN109256349B (zh) | 2017-07-14 | 2018-07-09 | 在线系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017137670A JP6917227B2 (ja) | 2017-07-14 | 2017-07-14 | インラインシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019021715A JP2019021715A (ja) | 2019-02-07 |
JP6917227B2 true JP6917227B2 (ja) | 2021-08-11 |
Family
ID=65051532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017137670A Active JP6917227B2 (ja) | 2017-07-14 | 2017-07-14 | インラインシステム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6917227B2 (ja) |
KR (1) | KR102517022B1 (ja) |
CN (1) | CN109256349B (ja) |
TW (1) | TWI757501B (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003045931A (ja) * | 2001-07-31 | 2003-02-14 | Sendai Nikon:Kk | 露光装置 |
JP2004207279A (ja) * | 2002-12-20 | 2004-07-22 | Rorze Corp | 薄板状物製造設備 |
JP4665037B2 (ja) * | 2009-02-06 | 2011-04-06 | 東京エレクトロン株式会社 | 基板処理システム |
KR20120015987A (ko) * | 2010-08-12 | 2012-02-22 | 삼성전자주식회사 | 기판 처리 시스템 |
JP2014038929A (ja) | 2012-08-15 | 2014-02-27 | Disco Abrasive Syst Ltd | インラインシステム |
-
2017
- 2017-07-14 JP JP2017137670A patent/JP6917227B2/ja active Active
-
2018
- 2018-06-04 TW TW107119102A patent/TWI757501B/zh active
- 2018-07-06 KR KR1020180078630A patent/KR102517022B1/ko active IP Right Grant
- 2018-07-09 CN CN201810743588.8A patent/CN109256349B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN109256349B (zh) | 2023-12-26 |
KR102517022B1 (ko) | 2023-03-31 |
CN109256349A (zh) | 2019-01-22 |
KR20190008109A (ko) | 2019-01-23 |
TWI757501B (zh) | 2022-03-11 |
TW201911460A (zh) | 2019-03-16 |
JP2019021715A (ja) | 2019-02-07 |
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