JP6915544B2 - 接着剤組成物及び構造体 - Google Patents

接着剤組成物及び構造体 Download PDF

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Publication number
JP6915544B2
JP6915544B2 JP2017548820A JP2017548820A JP6915544B2 JP 6915544 B2 JP6915544 B2 JP 6915544B2 JP 2017548820 A JP2017548820 A JP 2017548820A JP 2017548820 A JP2017548820 A JP 2017548820A JP 6915544 B2 JP6915544 B2 JP 6915544B2
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Japan
Prior art keywords
mass
group
adhesive composition
silane compound
parts
Prior art date
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Active
Application number
JP2017548820A
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English (en)
Japanese (ja)
Other versions
JPWO2017078087A1 (ja
Inventor
智樹 森尻
智樹 森尻
潤 竹田津
潤 竹田津
田中　勝
勝 田中
立澤　貴
貴 立澤
直 工藤
直 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2017078087A1 publication Critical patent/JPWO2017078087A1/ja
Priority to JP2021110078A priority Critical patent/JP7124936B2/ja
Application granted granted Critical
Publication of JP6915544B2 publication Critical patent/JP6915544B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
JP2017548820A 2015-11-04 2016-11-02 接着剤組成物及び構造体 Active JP6915544B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021110078A JP7124936B2 (ja) 2015-11-04 2021-07-01 接着剤組成物及び構造体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015216516 2015-11-04
JP2015216516 2015-11-04
PCT/JP2016/082645 WO2017078087A1 (ja) 2015-11-04 2016-11-02 接着剤組成物及び構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021110078A Division JP7124936B2 (ja) 2015-11-04 2021-07-01 接着剤組成物及び構造体

Publications (2)

Publication Number Publication Date
JPWO2017078087A1 JPWO2017078087A1 (ja) 2018-09-06
JP6915544B2 true JP6915544B2 (ja) 2021-08-04

Family

ID=58662435

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017548820A Active JP6915544B2 (ja) 2015-11-04 2016-11-02 接着剤組成物及び構造体
JP2021110078A Active JP7124936B2 (ja) 2015-11-04 2021-07-01 接着剤組成物及び構造体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021110078A Active JP7124936B2 (ja) 2015-11-04 2021-07-01 接着剤組成物及び構造体

Country Status (5)

Country Link
JP (2) JP6915544B2 (zh)
KR (1) KR102608218B1 (zh)
CN (1) CN108350320B (zh)
TW (1) TWI786036B (zh)
WO (1) WO2017078087A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671921B (zh) 2018-09-14 2019-09-11 頎邦科技股份有限公司 晶片封裝構造及其晶片

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002285103A (ja) * 2001-03-26 2002-10-03 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP4004333B2 (ja) * 2001-06-05 2007-11-07 松下電器産業株式会社 半導体モジュール
JP2004067908A (ja) * 2002-08-07 2004-03-04 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JP4146747B2 (ja) * 2003-03-26 2008-09-10 積水化学工業株式会社 硬化性組成物
JP2006022231A (ja) * 2004-07-08 2006-01-26 Sumitomo Bakelite Co Ltd 異方導電性接着剤および異方導電性接着剤フィルム
KR101081263B1 (ko) * 2006-05-09 2011-11-08 히다치 가세고교 가부시끼가이샤 접착 시트, 이를 이용한 회로 부재의 접속 구조 및 반도체 장치
JP4941554B2 (ja) * 2007-05-09 2012-05-30 日立化成工業株式会社 フィルム状回路接続材料及び回路部材の接続構造
JPWO2009063827A1 (ja) 2007-11-12 2011-03-31 日立化成工業株式会社 回路接続材料、及び回路部材の接続構造
WO2010110107A1 (ja) * 2009-03-23 2010-09-30 セメダイン株式会社 硬化性組成物
JP2011199097A (ja) * 2010-03-23 2011-10-06 Sumitomo Bakelite Co Ltd 半導体装置の製造方法
JP2012072305A (ja) * 2010-09-29 2012-04-12 Hitachi Chemical Co Ltd 樹脂ペースト組成物
JP5909911B2 (ja) * 2011-07-29 2016-04-27 住友ベークライト株式会社 液状樹脂組成物および半導体装置
CN108676520A (zh) * 2011-09-06 2018-10-19 日立化成株式会社 各向异性导电粘接剂、粘接剂组合物的应用以及连接体
JP5934528B2 (ja) 2012-03-12 2016-06-15 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
JP6250265B2 (ja) * 2012-03-16 2017-12-20 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP6090311B2 (ja) * 2012-04-25 2017-03-08 日立化成株式会社 回路接続材料、回路接続構造体及び接着フィルム
JP2013253151A (ja) * 2012-06-06 2013-12-19 Hitachi Chemical Co Ltd 回路接続用接着フィルム、並びに回路部材の接続構造体及びその製造方法
CN103131336B (zh) * 2013-03-22 2015-06-10 苏州度辰新材料有限公司 一种硅烷交联的乙烯醋酸乙烯共聚物胶膜的制备方法
CN103360956B (zh) * 2013-06-18 2015-06-03 明基材料有限公司 一种用于电子元件间电性导通的粘着剂
JP6398570B2 (ja) * 2013-10-09 2018-10-03 日立化成株式会社 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法
JP6437323B2 (ja) * 2014-02-14 2018-12-12 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料

Also Published As

Publication number Publication date
KR20180079370A (ko) 2018-07-10
CN108350320A (zh) 2018-07-31
TW201724924A (zh) 2017-07-01
CN108350320B (zh) 2021-11-26
JP2021165397A (ja) 2021-10-14
TWI786036B (zh) 2022-12-11
JPWO2017078087A1 (ja) 2018-09-06
KR102608218B1 (ko) 2023-11-30
JP7124936B2 (ja) 2022-08-24
WO2017078087A1 (ja) 2017-05-11

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