JP6912801B2 - フィルム状ワーク吸着装置 - Google Patents

フィルム状ワーク吸着装置 Download PDF

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JP6912801B2
JP6912801B2 JP2017089933A JP2017089933A JP6912801B2 JP 6912801 B2 JP6912801 B2 JP 6912801B2 JP 2017089933 A JP2017089933 A JP 2017089933A JP 2017089933 A JP2017089933 A JP 2017089933A JP 6912801 B2 JP6912801 B2 JP 6912801B2
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suction
film
work
split
opening
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Japanese (ja)
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JP2018188243A (ja
Inventor
弘明 栗原
弘明 栗原
茂美 千葉
茂美 千葉
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株式会社日本設計工業
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Priority to JP2017089933A priority Critical patent/JP6912801B2/ja
Priority to CN201710811283.1A priority patent/CN108807255B/zh
Publication of JP2018188243A publication Critical patent/JP2018188243A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Manipulator (AREA)
JP2017089933A 2017-04-28 2017-04-28 フィルム状ワーク吸着装置 Active JP6912801B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017089933A JP6912801B2 (ja) 2017-04-28 2017-04-28 フィルム状ワーク吸着装置
CN201710811283.1A CN108807255B (zh) 2017-04-28 2017-09-11 膜状工件吸附装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017089933A JP6912801B2 (ja) 2017-04-28 2017-04-28 フィルム状ワーク吸着装置

Publications (2)

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JP2018188243A JP2018188243A (ja) 2018-11-29
JP6912801B2 true JP6912801B2 (ja) 2021-08-04

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JP2017089933A Active JP6912801B2 (ja) 2017-04-28 2017-04-28 フィルム状ワーク吸着装置

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JP (1) JP6912801B2 (zh)
CN (1) CN108807255B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7030215B2 (ja) * 2019-01-23 2022-03-04 本田技研工業株式会社 積層ワーク成形方法及びその装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105949U (zh) * 1985-12-23 1987-07-06
JPH051780U (ja) * 1991-06-24 1993-01-14 住友金属鉱山株式会社 吸着保持具
JP5303744B2 (ja) * 2008-07-23 2013-10-02 東亜工業株式会社 Ａｌｃ板の自動搬送装置
JP2011042471A (ja) * 2009-08-21 2011-03-03 Canon Inc 画像形成装置
JP5201642B2 (ja) * 2011-07-19 2013-06-05 株式会社日本製鋼所 吸着装置および処理装置
JP5543988B2 (ja) * 2012-02-21 2014-07-09 富士フイルム株式会社 用紙搬送装置及びインクジェット記録装置
JP6378530B2 (ja) * 2014-05-03 2018-08-22 株式会社半導体エネルギー研究所 フィルム吸着機構

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CN108807255A (zh) 2018-11-13
CN108807255B (zh) 2023-12-12
JP2018188243A (ja) 2018-11-29

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