JP6905153B2 - リフトピンホルダー - Google Patents
リフトピンホルダー Download PDFInfo
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- JP6905153B2 JP6905153B2 JP2020523778A JP2020523778A JP6905153B2 JP 6905153 B2 JP6905153 B2 JP 6905153B2 JP 2020523778 A JP2020523778 A JP 2020523778A JP 2020523778 A JP2020523778 A JP 2020523778A JP 6905153 B2 JP6905153 B2 JP 6905153B2
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- lift pin
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- 239000000758 substrate Substances 0.000 claims description 39
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/005—Lifting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20221—Translation
- H01J2237/20235—Z movement or adjustment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
Claims (15)
- 上部及び下部を有するハウジング部材であって、上部は中央空間を画定する環状壁を含むハウジング部材と、
少なくとも部分的に中央空間内に配置され、基部とリフトピンを支持するように構成された上方突出部分とを有する支持部材と、
支持部材の上に配置され、自身の本体から上方に突出する第1の複数のプロングを有する第1のグリッパーであって、
第1の複数のプロングの間に配置され、第1のグリッパーの本体を介して延びる第1の中央開口部を含み、
第1の複数のプロングは、第1の中央開口部に延在する時にリフトピンを把持するように構成され、
支持部材の上方突出部分は第1の中央開口部に延在する第1のグリッパーと、
支持部材の基部の上に配置され、自身の本体から上方に突出する第2の複数のプロングを有する第2のグリッパーであって、
第2の複数のプロングの間に配置された第2の中央開口部と、第2のグリッパーの本体を介して延び、第2の中央開口部に開口する第3の中央開口部を含み、
第2の複数のプロングは、第2の中央開口部に延在する時にリフトピンを把持するように構成され、
第1のグリッパーは第3の中央開口部内に配置された第2のグリッパーを含む、リフトピンホルダー。 - 第1のグリッパー及び支持部材を介して配置され、第1のグリッパーを支持部材に固定する第1のロッキングピンを含む請求項1記載のリフトピンホルダー。
- 第2のグリッパー及び支持部材を介して配置され、第2のグリッパーを支持部材に固定する第2のロッキングピンを含む請求項2記載のリフトピンホルダー。
- ハウジング部材の環状チャネルに配置され、支持部材、第1のグリッパー、及び第2のグリッパーがハウジング部材から脱落するのを防止するように構成された環状保持リングを更に含む請求項1記載のリフトピンホルダー。
- 第1の複数のプロングが第1の複数のスロットにより分離され、第1の中央開口部がリフトピンの直径よりも小さい第1の内径を有し、
第2の複数のプロングが第2の複数のスロットにより分離され、第2の中央開口部がリフトピンの直径よりも小さい第2の内径を有する請求項1〜4のいずれか1項記載のリフトピンホルダー。 - 第1のグリッパーは、第1の複数のスロットの底部にあり、第1の複数のスロットに開口する第1の複数のリリーフ穴を含み、第2のグリッパーは、第2の複数のスロットの底部にあり、第2の複数のスロットに開口する第2の複数のリリーフ穴を含む請求項5記載のリフトピンホルダー。
- ハウジング部材の下部は、リフトピンアセンブリの支持要素を受容し、内部で支持要素の相対的回転を防止するように構成された凹部を含む請求項1〜4のいずれか1項記載のリフトピンホルダー。
- ハウジング部材は、ハウジング部材の下部の穴を介して凹部内に延びる固定要素を含み、固定要素は支持要素をハウジング部材に結合するように構成される請求項7記載のリフトピンホルダー。
- 固定要素はねじである請求項8に記載のリフトピンホルダー。
- ハウジング部材及び支持部材はステンレス鋼で形成される請求項1〜4のいずれか1項記載のリフトピンホルダー。
- 支持部材の表面仕上げは22Ra未満である請求項10記載のリフトピンホルダー。
- 第1及び第2のグリッパーはプロセス適合性プラスチックで形成される請求項1〜4のいずれか1項記載のリフトピンホルダー。
- 基部と、
基部から上方に延びる複数の支持要素と、
複数の支持要素の対応するものの上部に結合された複数のリフトピンホルダーであって、各々が請求項1〜4のいずれか1項記載されているリフトピンホルダーと、
複数のリフトピンホルダーに対応する複数のリフトピンであって、各々の底部が複数のリフトピンホルダーの対応するもの内に配置された複数のリフトピンを含むリフトピンアセンブリ。 - 複数のリフトピンホルダーは、
第1のグリッパーに配置され、第1の複数のプロングを分離する第1の複数のスロットと、第2のグリッパーに配置され、第2の複数のプロングを分離する第2の複数のスロットであって、第1の中央開口部は、リフトピンの直径より小さい第1の内径を有し、第2の中央開口部は、リフトピンの直径より小さい第2の内径を有する第1及び第2の複数のスロット、又は
ハウジング部材の下部の穴を介して凹部内に延び、支持要素をハウジング部材に結合する固定要素の少なくとも1つを有する請求項13記載のリフトピンアセンブリ。 - チャンバ本体と、
チャンバ本体の上に配置された蓋であって、蓋及びチャンバ本体は内部容積を画定する蓋と、
内部容積内に配置された基板支持体と、
基板支持体内に配置された複数のリフトピンブッシングと、
リフトピンアセンブリであって、
基部と、
基部から上方に延びる複数の支持要素と、
複数の支持要素の対応するものの上部に結合された複数のリフトピンホルダーであって、各々が請求項1〜4のいずれか1項記載されているリフトピンホルダーを含むリフトピンアセンブリと、
複数のリフトピンホルダーに対応する複数のリフトピンであって、各々のリフトピンは複数のリフトピンブッシングの対応するものを介して通過し、複数のリフトピンの各々の底部は複数のリフトピンホルダーの対応するものの内部に配置された複数のリフトピンを含む、処理チャンバ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/796,242 US10535549B2 (en) | 2017-10-27 | 2017-10-27 | Lift pin holder |
US15/796,242 | 2017-10-27 | ||
PCT/US2018/057457 WO2019084235A1 (en) | 2017-10-27 | 2018-10-25 | LIFTING ROD HOLDING MEMBER |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021501474A JP2021501474A (ja) | 2021-01-14 |
JP6905153B2 true JP6905153B2 (ja) | 2021-07-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020523778A Active JP6905153B2 (ja) | 2017-10-27 | 2018-10-25 | リフトピンホルダー |
Country Status (6)
Country | Link |
---|---|
US (1) | US10535549B2 (ja) |
JP (1) | JP6905153B2 (ja) |
KR (1) | KR102404531B1 (ja) |
CN (1) | CN111279464B (ja) |
TW (1) | TWI785137B (ja) |
WO (1) | WO2019084235A1 (ja) |
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US10784142B2 (en) * | 2018-01-09 | 2020-09-22 | Varian Semiconductor Equipment Associates, Inc. | Lift pin system for wafer handling |
KR102201887B1 (ko) * | 2019-07-02 | 2021-01-13 | 세메스 주식회사 | 기판 지지 유닛 및 이를 가지는 기판 처리 장치 |
KR20210076345A (ko) | 2019-12-16 | 2021-06-24 | 삼성전자주식회사 | 리프트 핀 모듈 |
US11753245B1 (en) | 2020-11-10 | 2023-09-12 | Express Scripts Strategic Development, Inc. | Pharmaceutical container holder |
CN114843164A (zh) * | 2021-02-02 | 2022-08-02 | 中微半导体设备(上海)股份有限公司 | 升降销固定器、升降销组件及等离子体处理装置 |
CN113488370B (zh) * | 2021-07-06 | 2024-05-31 | 北京屹唐半导体科技股份有限公司 | 用于等离子体处理设备的升降销组件 |
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WO2019084235A1 (en) | 2019-05-02 |
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