JP6901888B2 - タッチセンサ内蔵表示装置 - Google Patents
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- JP6901888B2 JP6901888B2 JP2017061230A JP2017061230A JP6901888B2 JP 6901888 B2 JP6901888 B2 JP 6901888B2 JP 2017061230 A JP2017061230 A JP 2017061230A JP 2017061230 A JP2017061230 A JP 2017061230A JP 6901888 B2 JP6901888 B2 JP 6901888B2
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- 239000011229 interlayer Substances 0.000 claims description 70
- 239000010410 layer Substances 0.000 claims description 39
- 230000002093 peripheral effect Effects 0.000 claims description 35
- 238000007789 sealing Methods 0.000 claims description 29
- 230000001681 protective effect Effects 0.000 claims description 28
- 238000000926 separation method Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 6
- 238000009751 slip forming Methods 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 180
- 239000011810 insulating material Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000002161 passivation Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910004541 SiN Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
Claims (11)
- 下地絶縁膜と、
前記下地絶縁膜の表示領域を覆う封止膜と、
前記封止膜上の前記表示領域に2次元的に配列された複数の第1電極であって、第1方向に隣り合う第1電極は第1接続線を介して接続され、前記第1方向と交差する第2方向に隣り合う第1電極は接続されない、複数の第1電極と、
前記第1電極と同層又は異層で2次元的に配列され、それぞれが平面視で前記第1電極に囲まれた複数の第2電極であって、前記第2方向に隣り合う第2電極は、前記第1接続線と平面視で交差する第2接続線を介して接続され、前記第1方向に隣り合う第2電極は接続されない、複数の第2電極と、
前記第1接続線と前記第2接続線との間に介在するとともに、前記封止膜の外縁と前記下地絶縁膜とで形成される段差を埋める層間絶縁膜と、
前記第1電極に接続され、前記層間絶縁膜の前記段差を埋める部分上を前記層間絶縁膜に接して通る第一の引き出し配線と、
前記第2電極に接続され、前記層間絶縁膜の前記段差を埋める部分上を前記層間絶縁膜に接して通る第二の引き出し配線と、
を備えるタッチセンサ内蔵表示装置。 - 前記層間絶縁膜は、前記第1接続線と前記第2接続線との間に介在する部分と、前記段差を埋める部分とが連続して形成された膜である、
請求項1に記載のタッチセンサ内蔵表示装置。 - 前記層間絶縁膜は、前記第1接続線と前記第2接続線との間に介在する部分と、前記段差を埋める部分とが分離して形成された膜である、
請求項1に記載のタッチセンサ内蔵表示装置。 - 前記下地絶縁膜と前記封止膜との間に形成され、前記下地絶縁膜上の前記表示領域に配置された画素電極と、
前記画素電極の周縁部を覆うと共に、前記画素電極の上面を底とする開口が形成された画素分離膜をさらに備え、
前記封止膜の外縁は、前記画素分離膜の外縁よりも外側で前記下地絶縁膜と接する、
請求項1に記載のタッチセンサ内蔵表示装置。 - 前記封止膜と前記第1電極又は前記第2電極との間に形成された保護絶縁膜をさらに備え、
前記封止膜の外縁は、前記保護絶縁膜の外縁と一致する、
請求項1に記載のタッチセンサ内蔵表示装置。 - 前記第一の引き出し配線及び前記第二の引き出し線は、前記下地絶縁膜の前記表示領域の外側の周辺領域に設けられた第1端子に接続される、
請求項1に記載のタッチセンサ内蔵表示装置。 - 前記層間絶縁膜は、前記第1端子の外縁と前記下地絶縁膜とで形成される別の段差も埋め、
前記第一の引き出し配線及び前記第二の引き出し線は、前記層間絶縁膜の前記別の段差を埋める部分上も通る、
請求項6に記載のタッチセンサ内蔵表示装置。 - 前記層間絶縁膜の前記段差を埋める部分と、前記層間絶縁膜の前記別の段差を埋める部分とが連続している、
請求項7に記載のタッチセンサ内蔵表示装置。 - 前記層間絶縁膜は、前記第1端子を覆い、
前記第一の引き出し配線及び前記第二の引き出し線は、前記層間絶縁膜の前記第1端子を覆う部分に形成された開口を通じて前記第1端子に接続される、
請求項6に記載のタッチセンサ内蔵表示装置。 - 前記周辺領域に設けられ、前記第1端子と電気的に接続された第2端子に接続されるフレキシブル基板をさらに備える、
請求項6に記載のタッチセンサ内蔵表示装置。 - 前記フレキシブル基板は、前記周辺領域に設けられ、前記表示領域に配置された画素電極に電気的に接続された第3端子にも接続される、
請求項10に記載のタッチセンサ内蔵表示装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017061230A JP6901888B2 (ja) | 2017-03-27 | 2017-03-27 | タッチセンサ内蔵表示装置 |
KR1020197027894A KR102237802B1 (ko) | 2017-03-27 | 2018-01-23 | 터치 센서 내장 표시 장치 |
PCT/JP2018/001944 WO2018179728A1 (ja) | 2017-03-27 | 2018-01-23 | タッチセンサ内蔵表示装置 |
CN201880022088.3A CN110462565B (zh) | 2017-03-27 | 2018-01-23 | 内置触摸传感器的显示装置 |
US16/579,358 US10838565B2 (en) | 2017-03-27 | 2019-09-23 | Display device, with touch sensor, to suppress disconnection of lead-out wiring |
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JP2017061230A JP6901888B2 (ja) | 2017-03-27 | 2017-03-27 | タッチセンサ内蔵表示装置 |
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JP2018163309A JP2018163309A (ja) | 2018-10-18 |
JP6901888B2 true JP6901888B2 (ja) | 2021-07-14 |
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JP (1) | JP6901888B2 (ja) |
KR (1) | KR102237802B1 (ja) |
CN (1) | CN110462565B (ja) |
WO (1) | WO2018179728A1 (ja) |
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KR102438256B1 (ko) | 2017-06-07 | 2022-08-30 | 엘지디스플레이 주식회사 | 터치 스크린을 갖는 유기 발광 표시 장치 및 이의 제조 방법 |
JP2019175788A (ja) * | 2018-03-29 | 2019-10-10 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102569929B1 (ko) * | 2018-07-02 | 2023-08-24 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR20210032600A (ko) * | 2019-09-16 | 2021-03-25 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
EP4221484A1 (en) * | 2019-10-23 | 2023-08-02 | BOE Technology Group Co., Ltd. | Display substrate and manufacturing method thereof, and display device |
JP7427969B2 (ja) * | 2020-01-22 | 2024-02-06 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
KR20210116840A (ko) | 2020-03-17 | 2021-09-28 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR20220128506A (ko) * | 2021-03-11 | 2022-09-21 | 삼성디스플레이 주식회사 | 표시 장치 |
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JP5007598B2 (ja) * | 2007-04-12 | 2012-08-22 | ソニー株式会社 | 表示装置およびその製造方法 |
US8629842B2 (en) | 2008-07-11 | 2014-01-14 | Samsung Display Co., Ltd. | Organic light emitting display device |
KR101756656B1 (ko) * | 2010-06-25 | 2017-07-11 | 엘지디스플레이 주식회사 | 터치 패널 내장형 유기발광다이오드 표시 장치 |
WO2012077320A1 (ja) * | 2010-12-09 | 2012-06-14 | シャープ株式会社 | タッチパネル及びそれを備えた表示装置並びにタッチパネルの製造方法 |
JP5840598B2 (ja) * | 2012-12-17 | 2016-01-06 | 株式会社ジャパンディスプレイ | タッチ検出機能付き表示装置、電子機器及びタッチ検出機能付き表示装置の製造方法 |
JP5961543B2 (ja) | 2012-12-19 | 2016-08-02 | 株式会社ジャパンディスプレイ | 液晶表示装置及びその製造方法 |
JP6253923B2 (ja) | 2013-08-30 | 2017-12-27 | 株式会社ジャパンディスプレイ | タッチセンサ内蔵有機エレクトロルミネッセンス装置 |
KR102124906B1 (ko) * | 2013-12-26 | 2020-07-07 | 엘지디스플레이 주식회사 | 터치스크린을 구비한 유기전계 발광소자 및 이의 제조 방법 |
KR102289934B1 (ko) | 2014-11-28 | 2021-08-13 | 삼성디스플레이 주식회사 | 터치 감지 센서를 포함하는 표시 장치 |
CN106449712B (zh) * | 2016-11-07 | 2019-03-29 | 上海天马微电子有限公司 | 一种有机发光显示面板以及有机发光显示装置 |
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