JP6901549B2 - 銅インク及びそれから製造された導電性のはんだ付け可能な銅トレース - Google Patents
銅インク及びそれから製造された導電性のはんだ付け可能な銅トレース Download PDFInfo
- Publication number
- JP6901549B2 JP6901549B2 JP2019504746A JP2019504746A JP6901549B2 JP 6901549 B2 JP6901549 B2 JP 6901549B2 JP 2019504746 A JP2019504746 A JP 2019504746A JP 2019504746 A JP2019504746 A JP 2019504746A JP 6901549 B2 JP6901549 B2 JP 6901549B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- ink
- substrate
- traces
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/08—Printing inks based on natural resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/103—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds of aldehydes, e.g. phenol-formaldehyde resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/104—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2467/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Pest Control & Pesticides (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662367810P | 2016-07-28 | 2016-07-28 | |
| US62/367,810 | 2016-07-28 | ||
| PCT/CA2017/050870 WO2018018136A1 (en) | 2016-07-28 | 2017-07-19 | Copper ink and conductive solderable copper traces produced therefrom |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019529599A JP2019529599A (ja) | 2019-10-17 |
| JP2019529599A5 JP2019529599A5 (https=) | 2020-08-20 |
| JP6901549B2 true JP6901549B2 (ja) | 2021-07-14 |
Family
ID=61015482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019504746A Active JP6901549B2 (ja) | 2016-07-28 | 2017-07-19 | 銅インク及びそれから製造された導電性のはんだ付け可能な銅トレース |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10844238B2 (https=) |
| EP (1) | EP3491082B1 (https=) |
| JP (1) | JP6901549B2 (https=) |
| KR (1) | KR102360657B1 (https=) |
| CN (1) | CN109790409B (https=) |
| CA (1) | CA3032252C (https=) |
| TW (1) | TWI752986B (https=) |
| WO (1) | WO2018018136A1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11993719B2 (en) | 2017-10-27 | 2024-05-28 | National Research Council Of Canada | Boron nitride nanotube coated substrates for sintering of metallic traces by intense pulse light |
| EP3830200A4 (en) * | 2018-08-03 | 2022-07-27 | National Research Council of Canada | UV-SINTERABLE MOLECULAR INK AND PROCESSING THEREOF USING BROAD-SPECTRUM UV LIGHT |
| TWI853828B (zh) * | 2018-08-07 | 2024-09-01 | 加拿大國家研究委員會 | 包覆成型的印刷電子零件和其製造方法 |
| WO2020076326A1 (en) * | 2018-10-11 | 2020-04-16 | Hewlett-Packard Development Company, L.P. | Generation of metals in textiles |
| JP7269565B2 (ja) * | 2019-03-29 | 2023-05-09 | 学校法人 関西大学 | 導電性インキ組成物及び導電性積層体 |
| KR102213925B1 (ko) * | 2019-10-31 | 2021-02-08 | (주)쎄미시스코 | 실리카 입자를 포함하는 광소결용 잉크 조성물 |
| CN111269615A (zh) * | 2020-03-20 | 2020-06-12 | 辽宁大学 | 一种抗氧化无颗粒型铜导电墨水及其制备方法 |
| CN114799613B (zh) * | 2021-01-28 | 2023-11-07 | 深圳先进电子材料国际创新研究院 | 一种铜焊膏及其制备方法和应用 |
| CN114231092A (zh) * | 2021-12-15 | 2022-03-25 | 深圳先进技术研究院 | 一种铜导电油墨、柔性基底及柔性基底的制备方法 |
| CN114540889B (zh) * | 2022-03-25 | 2023-03-24 | 江阴纳力新材料科技有限公司 | 镀铜添加剂、镀铜液及其应用 |
| CN115171945A (zh) * | 2022-05-31 | 2022-10-11 | 宁波柔印电子科技有限责任公司 | 一种可用于大面积制备的铜浆及制作方法 |
| WO2025189292A1 (en) * | 2024-03-12 | 2025-09-18 | National Research Council Of Canada | System and method for lightning strike protection |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2728465C2 (de) | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
| US4396666A (en) | 1981-11-02 | 1983-08-02 | Cts Corporation | Solderable conductive employing an organic binder |
| US4687597A (en) | 1986-01-29 | 1987-08-18 | E. I. Du Pont De Nemours And Company | Copper conductor compositions |
| JPH01168867A (ja) * | 1987-12-24 | 1989-07-04 | Mitsubishi Gas Chem Co Inc | 銅膜形成物品の製造法 |
| JP2619289B2 (ja) | 1989-06-20 | 1997-06-11 | 三井金属鉱業株式会社 | 銅導電性組成物 |
| JP2660937B2 (ja) | 1990-07-16 | 1997-10-08 | 三井金属鉱業株式会社 | 銅導電性組成物 |
| US5882722A (en) | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
| US20030148024A1 (en) | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| US7211205B2 (en) | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
| US7731812B2 (en) | 2004-10-19 | 2010-06-08 | E.I. Du Pont De Nemours And Company | Thick film conductor case compositions for LTCC tape |
| US8017044B2 (en) | 2008-07-08 | 2011-09-13 | Xerox Corporation | Bimodal metal nanoparticle ink and applications therefor |
| KR101276237B1 (ko) | 2010-12-02 | 2013-06-20 | 한국기계연구원 | 저온소결 전도성 금속막 및 이의 제조방법 |
| TWI532059B (zh) * | 2011-03-31 | 2016-05-01 | Taiyo Holdings Co Ltd | Conductive paste, conductive pattern formation method and conductive pattern |
| KR20120132424A (ko) | 2011-05-27 | 2012-12-05 | 한양대학교 산학협력단 | 전도성 구리 나노잉크의 광소결 방법 |
| JP5821551B2 (ja) * | 2011-11-10 | 2015-11-24 | 日立化成株式会社 | 導電粒子、異方導電材料及び導電接続構造体 |
| KR20150006091A (ko) | 2012-02-29 | 2015-01-15 | 이슘 리서치 디벨롭먼트 컴퍼니 오브 더 히브루 유니버시티 오브 예루살렘, 엘티디. | 금속 전구체 나노입자들을 함유한 잉크 |
| CN103382327B (zh) * | 2012-05-02 | 2015-11-25 | 比亚迪股份有限公司 | 一种太阳能电池用铜墨及其制备方法、一种太阳能电池主栅的制造方法及太阳能电池组件 |
| KR20140044743A (ko) | 2012-10-04 | 2014-04-15 | 한양대학교 산학협력단 | 전도성 하이브리드 구리잉크 및 이를 이용한 광소결 방법 |
| KR101350507B1 (ko) | 2013-01-09 | 2014-01-17 | (주)쎄미시스코 | 금속 나노입자를 포함하는 전기전도성 잉크 및 이의 광 소결 방법 |
| JP2014182913A (ja) * | 2013-03-19 | 2014-09-29 | Fujifilm Corp | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
| JP2014196427A (ja) * | 2013-03-29 | 2014-10-16 | 富士フイルム株式会社 | 導電膜形成用組成物およびこれを用いる導電膜の製造方法 |
| KR20150045605A (ko) | 2013-10-21 | 2015-04-29 | 전자부품연구원 | 구리 잉크 조성물 및 이를 이용한 도전 패턴 형성 방법 |
| KR101597651B1 (ko) | 2013-12-30 | 2016-02-25 | 전자부품연구원 | 고내열성을 갖는 나노산화구리 잉크 조성물 및 이를 이용한 전극 형성방법 |
| EP2918371A1 (en) | 2014-03-11 | 2015-09-16 | Heraeus Precious Metals North America Conshohocken LLC | Solderable conductive polymer thick film composition |
| KR20150134728A (ko) * | 2014-05-22 | 2015-12-02 | 주식회사 동진쎄미켐 | 전도성 조성물 |
| JP6135687B2 (ja) * | 2014-07-15 | 2017-05-31 | 東洋インキScホールディングス株式会社 | レーザー加工用導電性ペースト |
-
2017
- 2017-07-19 EP EP17833137.7A patent/EP3491082B1/en active Active
- 2017-07-19 KR KR1020197005617A patent/KR102360657B1/ko active Active
- 2017-07-19 WO PCT/CA2017/050870 patent/WO2018018136A1/en not_active Ceased
- 2017-07-19 CA CA3032252A patent/CA3032252C/en active Active
- 2017-07-19 US US16/321,076 patent/US10844238B2/en active Active
- 2017-07-19 CN CN201780059065.5A patent/CN109790409B/zh active Active
- 2017-07-19 JP JP2019504746A patent/JP6901549B2/ja active Active
- 2017-07-26 TW TW106125020A patent/TWI752986B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190042586A (ko) | 2019-04-24 |
| TW201815994A (zh) | 2018-05-01 |
| CN109790409B (zh) | 2022-03-04 |
| JP2019529599A (ja) | 2019-10-17 |
| WO2018018136A1 (en) | 2018-02-01 |
| CN109790409A (zh) | 2019-05-21 |
| KR102360657B1 (ko) | 2022-02-08 |
| US10844238B2 (en) | 2020-11-24 |
| EP3491082B1 (en) | 2022-03-30 |
| EP3491082A1 (en) | 2019-06-05 |
| CA3032252A1 (en) | 2018-02-01 |
| EP3491082A4 (en) | 2020-06-03 |
| TWI752986B (zh) | 2022-01-21 |
| CA3032252C (en) | 2025-07-08 |
| US20190177565A1 (en) | 2019-06-13 |
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