JP6897497B2 - シリコンブロックの品質判定方法、シリコンブロックの品質判定プログラム、およびシリコン単結晶の製造方法 - Google Patents
シリコンブロックの品質判定方法、シリコンブロックの品質判定プログラム、およびシリコン単結晶の製造方法 Download PDFInfo
- Publication number
- JP6897497B2 JP6897497B2 JP2017210658A JP2017210658A JP6897497B2 JP 6897497 B2 JP6897497 B2 JP 6897497B2 JP 2017210658 A JP2017210658 A JP 2017210658A JP 2017210658 A JP2017210658 A JP 2017210658A JP 6897497 B2 JP6897497 B2 JP 6897497B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- quality
- silicon block
- defect
- single crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 137
- 229910052710 silicon Inorganic materials 0.000 title claims description 137
- 239000010703 silicon Substances 0.000 title claims description 137
- 238000000034 method Methods 0.000 title claims description 72
- 239000013078 crystal Substances 0.000 title claims description 67
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000007547 defect Effects 0.000 claims description 75
- 235000012431 wafers Nutrition 0.000 claims description 61
- 239000011800 void material Substances 0.000 claims description 27
- 238000013441 quality evaluation Methods 0.000 claims description 22
- 238000009826 distribution Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 claims description 4
- 230000002950 deficient Effects 0.000 description 16
- 239000000047 product Substances 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000007789 gas Substances 0.000 description 7
- 238000012790 confirmation Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000002244 precipitate Substances 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000008710 crystal-8 Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 238000004627 transmission electron microscopy Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011867 re-evaluation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003325 tomography Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017210658A JP6897497B2 (ja) | 2017-10-31 | 2017-10-31 | シリコンブロックの品質判定方法、シリコンブロックの品質判定プログラム、およびシリコン単結晶の製造方法 |
TW107119816A TWI679317B (zh) | 2017-10-31 | 2018-06-08 | 矽塊的品質判斷方法、矽塊的品質判斷程式及單晶矽的製造方法 |
CN201880070815.3A CN111601916A (zh) | 2017-10-31 | 2018-07-10 | 硅块的品质判定方法、硅块的品质判定程序及单晶硅的制造方法 |
PCT/JP2018/026099 WO2019087469A1 (ja) | 2017-10-31 | 2018-07-10 | シリコンブロックの品質判定方法、シリコンブロックの品質判定プログラム、およびシリコン単結晶の製造方法 |
KR1020207014051A KR102369392B1 (ko) | 2017-10-31 | 2018-07-10 | 실리콘 블럭의 품질 판정 방법, 실리콘 블럭의 품질 판정 프로그램 및 실리콘 단결정의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017210658A JP6897497B2 (ja) | 2017-10-31 | 2017-10-31 | シリコンブロックの品質判定方法、シリコンブロックの品質判定プログラム、およびシリコン単結晶の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019081680A JP2019081680A (ja) | 2019-05-30 |
JP6897497B2 true JP6897497B2 (ja) | 2021-06-30 |
Family
ID=66331574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017210658A Active JP6897497B2 (ja) | 2017-10-31 | 2017-10-31 | シリコンブロックの品質判定方法、シリコンブロックの品質判定プログラム、およびシリコン単結晶の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6897497B2 (ko) |
KR (1) | KR102369392B1 (ko) |
CN (1) | CN111601916A (ko) |
TW (1) | TWI679317B (ko) |
WO (1) | WO2019087469A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7238815B2 (ja) * | 2020-01-30 | 2023-03-14 | 株式会社Sumco | 単結晶製造管理システム |
US11618971B2 (en) * | 2020-09-29 | 2023-04-04 | Sumco Corporation | Method and apparatus for manufacturing defect-free monocrystalline silicon crystal |
JP7375716B2 (ja) * | 2020-09-30 | 2023-11-08 | 株式会社Sumco | 単結晶シリコンブロックの結晶欠陥に関する品質評価方法、単結晶シリコンブロックの品質評価プログラム、単結晶シリコンブロックの製造方法およびシリコンウェーハの製造方法 |
CN114897402A (zh) * | 2022-05-26 | 2022-08-12 | 西安奕斯伟材料科技有限公司 | 晶棒制造管理方法和晶棒制造管理系统 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4537643B2 (ja) | 2002-01-24 | 2010-09-01 | 信越半導体株式会社 | シリコン単結晶ウェーハの製造方法 |
JP2006045007A (ja) * | 2004-08-05 | 2006-02-16 | Komatsu Electronic Metals Co Ltd | シリコン単結晶の品質評価方法 |
JP4701738B2 (ja) * | 2005-02-17 | 2011-06-15 | 株式会社Sumco | 単結晶の引上げ方法 |
JP4792903B2 (ja) | 2005-10-04 | 2011-10-12 | 信越半導体株式会社 | 半導体ウエーハの製造方法及び半導体インゴットの切断位置決定システム |
JP5204415B2 (ja) * | 2006-03-03 | 2013-06-05 | 国立大学法人 新潟大学 | CZ法によるSi単結晶インゴットの製造方法 |
CN101437988A (zh) * | 2006-03-03 | 2009-05-20 | 国立大学法人新潟大学 | 通过CZ法生产Si单晶锭料的方法 |
JP4640504B2 (ja) * | 2006-06-09 | 2011-03-02 | 株式会社Sumco | 単結晶シリコンウェーハのcop評価方法 |
US8771415B2 (en) * | 2008-10-27 | 2014-07-08 | Sumco Corporation | Method of manufacturing silicon single crystal, silicon single crystal ingot, and silicon wafer |
JP2010116271A (ja) * | 2008-11-11 | 2010-05-27 | Sumco Corp | シリコン単結晶の育成方法及びシリコン単結晶インゴット |
JP5552875B2 (ja) * | 2010-04-12 | 2014-07-16 | 株式会社Sumco | 単結晶の製造方法および半導体ウェーハの製造方法 |
US9777394B2 (en) * | 2013-02-22 | 2017-10-03 | Shin-Etsu Handotai Co., Ltd. | Method of producing silicon single crystal ingot |
-
2017
- 2017-10-31 JP JP2017210658A patent/JP6897497B2/ja active Active
-
2018
- 2018-06-08 TW TW107119816A patent/TWI679317B/zh active
- 2018-07-10 KR KR1020207014051A patent/KR102369392B1/ko active IP Right Grant
- 2018-07-10 CN CN201880070815.3A patent/CN111601916A/zh active Pending
- 2018-07-10 WO PCT/JP2018/026099 patent/WO2019087469A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR102369392B1 (ko) | 2022-03-02 |
WO2019087469A1 (ja) | 2019-05-09 |
CN111601916A (zh) | 2020-08-28 |
TWI679317B (zh) | 2019-12-11 |
KR20200073264A (ko) | 2020-06-23 |
TW201918593A (zh) | 2019-05-16 |
JP2019081680A (ja) | 2019-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6897497B2 (ja) | シリコンブロックの品質判定方法、シリコンブロックの品質判定プログラム、およびシリコン単結晶の製造方法 | |
JP5946001B2 (ja) | シリコン単結晶棒の製造方法 | |
US20130323153A1 (en) | Silicon single crystal wafer | |
JP4193610B2 (ja) | 単結晶の製造方法 | |
JP2005015312A (ja) | 単結晶の製造方法及び単結晶 | |
JP5381558B2 (ja) | シリコン単結晶の引上げ方法 | |
JP2005015313A (ja) | 単結晶の製造方法及び単結晶 | |
JP6044530B2 (ja) | シリコン単結晶の育成方法 | |
JP4151474B2 (ja) | 単結晶の製造方法及び単結晶 | |
JP4457584B2 (ja) | 単結晶の製造方法及び単結晶 | |
JP4158237B2 (ja) | 高品質シリコン単結晶の育成方法 | |
JP6263999B2 (ja) | シリコン単結晶の育成方法 | |
JP2005015290A (ja) | 単結晶の製造方法及び単結晶 | |
JP4461776B2 (ja) | シリコン単結晶の製造方法 | |
JP2005015287A (ja) | 単結晶の製造方法及び単結晶製造装置 | |
JP2003327494A (ja) | シリコン単結晶製造方法およびシリコン単結晶製造操業用プログラムならびにシリコン単結晶製造装置 | |
TWI671440B (zh) | 矽單結晶的製造方法、矽單結晶及矽晶圓 | |
JP4881539B2 (ja) | 単結晶の製造方法及び単結晶 | |
CN109478512B (zh) | 硅晶片的制造方法 | |
JP2005015297A (ja) | 単結晶の製造方法及び単結晶 | |
JP2005015298A (ja) | 単結晶の製造方法及び単結晶 | |
JP6544275B2 (ja) | シリコン単結晶の加工方法 | |
JP2005015288A (ja) | 単結晶の製造方法及び単結晶 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191101 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201027 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201208 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210511 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210524 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6897497 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |