JP6889452B1 - イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 - Google Patents
イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 Download PDFInfo
- Publication number
- JP6889452B1 JP6889452B1 JP2020559579A JP2020559579A JP6889452B1 JP 6889452 B1 JP6889452 B1 JP 6889452B1 JP 2020559579 A JP2020559579 A JP 2020559579A JP 2020559579 A JP2020559579 A JP 2020559579A JP 6889452 B1 JP6889452 B1 JP 6889452B1
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- sensor chip
- cover glass
- gap
- sensor module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000006059 cover glass Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004840 adhesive resin Substances 0.000 claims description 21
- 229920006223 adhesive resin Polymers 0.000 claims description 21
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/044651 WO2021095193A1 (ja) | 2019-11-14 | 2019-11-14 | イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6889452B1 true JP6889452B1 (ja) | 2021-06-18 |
JPWO2021095193A1 JPWO2021095193A1 (ja) | 2021-11-25 |
Family
ID=75912978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020559579A Active JP6889452B1 (ja) | 2019-11-14 | 2019-11-14 | イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6889452B1 (zh) |
CN (1) | CN114651324B (zh) |
WO (1) | WO2021095193A1 (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332680A (ja) * | 2005-05-27 | 2006-12-07 | Avago Technologies General Ip (Singapore) Private Ltd | イメージセンサをパッケージングするための方法及びパッケージングされたイメージセンサ |
WO2008032404A1 (en) * | 2006-09-15 | 2008-03-20 | Fujitsu Microelectronics Limited | Semiconductor device and method for manufacturing same |
US8072083B1 (en) * | 2006-02-17 | 2011-12-06 | Amkor Technology, Inc. | Stacked electronic component package having film-on-wire spacer |
JP2014075480A (ja) * | 2012-10-04 | 2014-04-24 | Seiko Instruments Inc | 光学デバイス及び光学デバイスの製造方法 |
JP2017538933A (ja) * | 2014-12-11 | 2017-12-28 | フィンガープリント カーズ アクティエボラーグ | 指紋感知装置 |
WO2018030140A1 (ja) * | 2016-08-08 | 2018-02-15 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子、製造方法、および電子機器 |
JP2019036704A (ja) * | 2017-08-15 | 2019-03-07 | キングパック テクノロジー インコーポレイテッドKingpak Technology Inc. | 積層型センサ実装構造 |
-
2019
- 2019-11-14 WO PCT/JP2019/044651 patent/WO2021095193A1/ja active Application Filing
- 2019-11-14 JP JP2020559579A patent/JP6889452B1/ja active Active
- 2019-11-14 CN CN201980102115.2A patent/CN114651324B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006332680A (ja) * | 2005-05-27 | 2006-12-07 | Avago Technologies General Ip (Singapore) Private Ltd | イメージセンサをパッケージングするための方法及びパッケージングされたイメージセンサ |
US8072083B1 (en) * | 2006-02-17 | 2011-12-06 | Amkor Technology, Inc. | Stacked electronic component package having film-on-wire spacer |
WO2008032404A1 (en) * | 2006-09-15 | 2008-03-20 | Fujitsu Microelectronics Limited | Semiconductor device and method for manufacturing same |
JP2014075480A (ja) * | 2012-10-04 | 2014-04-24 | Seiko Instruments Inc | 光学デバイス及び光学デバイスの製造方法 |
JP2017538933A (ja) * | 2014-12-11 | 2017-12-28 | フィンガープリント カーズ アクティエボラーグ | 指紋感知装置 |
WO2018030140A1 (ja) * | 2016-08-08 | 2018-02-15 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子、製造方法、および電子機器 |
JP2019036704A (ja) * | 2017-08-15 | 2019-03-07 | キングパック テクノロジー インコーポレイテッドKingpak Technology Inc. | 積層型センサ実装構造 |
Also Published As
Publication number | Publication date |
---|---|
CN114651324B (zh) | 2024-05-07 |
CN114651324A (zh) | 2022-06-21 |
JPWO2021095193A1 (ja) | 2021-11-25 |
WO2021095193A1 (ja) | 2021-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9455358B2 (en) | Image pickup module and image pickup unit | |
KR100691398B1 (ko) | 미소소자 패키지 및 그 제조방법 | |
EP2666193B1 (en) | Led package comprising encapsulation | |
US20080297645A1 (en) | Camera module with compact packaging of image sensor chip and method of manufacturing the same | |
JP2006332680A (ja) | イメージセンサをパッケージングするための方法及びパッケージングされたイメージセンサ | |
JP4170950B2 (ja) | 光学デバイスおよびその製造方法 | |
WO2008032404A1 (en) | Semiconductor device and method for manufacturing same | |
JP2008092417A (ja) | 半導体撮像素子およびその製造方法並びに半導体撮像装置および半導体撮像モジュール | |
JP4184371B2 (ja) | 半導体チップ、半導体装置およびそれらの製造方法 | |
JP2002329850A (ja) | チップサイズパッケージおよびその製造方法 | |
US20080272473A1 (en) | Optical device and method of manufacturing the same | |
JP4391585B1 (ja) | カメラモジュール及びその製造方法 | |
US20110083322A1 (en) | Optical device and method for manufacturing the same | |
CN108039355B (zh) | 一种光学指纹芯片的封装结构以及封装方法 | |
US7592197B2 (en) | Image sensor chip package fabrication method | |
JP6889452B1 (ja) | イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 | |
US10680033B2 (en) | Chip packaging method and chip package | |
JP2009158873A (ja) | 光学デバイスおよび光学デバイスの製造方法 | |
KR100956381B1 (ko) | 웨이퍼 레벨 카메라 모듈의 제조 방법 | |
JP2006005612A (ja) | 撮像モジュール | |
KR20100027857A (ko) | 웨이퍼 레벨 카메라 모듈 및 이의 제조방법 | |
TW201941447A (zh) | 半導體裝置 | |
JP2008103460A (ja) | 半導体パッケージ及びその製造方法 | |
TW202117593A (zh) | 光學式影像辨識裝置及其製作方法 | |
JP2014179470A (ja) | 撮像センサのパッケージ構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201020 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20201020 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20210119 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210126 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210202 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210427 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210512 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6889452 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |