JP6888396B2 - 研削盤システム - Google Patents

研削盤システム Download PDF

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Publication number
JP6888396B2
JP6888396B2 JP2017086850A JP2017086850A JP6888396B2 JP 6888396 B2 JP6888396 B2 JP 6888396B2 JP 2017086850 A JP2017086850 A JP 2017086850A JP 2017086850 A JP2017086850 A JP 2017086850A JP 6888396 B2 JP6888396 B2 JP 6888396B2
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Prior art keywords
grinding
workpiece
surface roughness
sensor
grindstone
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JP2017086850A
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Japanese (ja)
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JP2018024077A5 (enExample
JP2018024077A (ja
Inventor
森田　浩
浩 森田
英二 福田
英二 福田
光晴 石原
光晴 石原
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JTEKT Corp
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JTEKT Corp
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  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2017086850A 2016-08-09 2017-04-26 研削盤システム Active JP6888396B2 (ja)

Applications Claiming Priority (2)

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JP2016156934 2016-08-09
JP2016156934 2016-08-09

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JP2018024077A JP2018024077A (ja) 2018-02-15
JP2018024077A5 JP2018024077A5 (enExample) 2020-07-09
JP6888396B2 true JP6888396B2 (ja) 2021-06-16

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JP2017086850A Active JP6888396B2 (ja) 2016-08-09 2017-04-26 研削盤システム

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113118880A (zh) * 2021-04-23 2021-07-16 苏州健雄职业技术学院 一种用于磨床的高精度加工方法
CN118357797B (zh) * 2024-06-18 2024-09-20 德新钢管（中国）有限公司 一种用于无缝钢管修磨的智能控制系统及方法
CN120382430B (zh) * 2025-06-27 2025-08-22 保定乐凯包装材料有限公司 一种纸管外层打磨装置控制方法及系统
CN120516525B (zh) * 2025-07-23 2025-11-18 成都合信恒泰工程技术有限公司 一种用于确定地应力方向的测量装置及测量方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295543A (ja) * 1988-09-30 1990-04-06 Omron Tateisi Electron Co 研削盤制御装置
JPH031758U (enExample) * 1989-05-29 1991-01-09
JP2005059141A (ja) * 2003-08-12 2005-03-10 Kazuhito Ohashi 研削方法および研削盤の制御装置

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Publication number Publication date
JP2018024077A (ja) 2018-02-15

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