JP6886904B2 - ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器 - Google Patents

ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器 Download PDF

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Publication number
JP6886904B2
JP6886904B2 JP2017180367A JP2017180367A JP6886904B2 JP 6886904 B2 JP6886904 B2 JP 6886904B2 JP 2017180367 A JP2017180367 A JP 2017180367A JP 2017180367 A JP2017180367 A JP 2017180367A JP 6886904 B2 JP6886904 B2 JP 6886904B2
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Japan
Prior art keywords
heat pipe
condenser
heat
evaporator
working fluid
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Application number
JP2017180367A
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English (en)
Japanese (ja)
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JP2019056511A5 (enExample
JP2019056511A (ja
Inventor
洋弘 町田
洋弘 町田
倉嶋 信幸
信幸 倉嶋
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2017180367A priority Critical patent/JP6886904B2/ja
Priority to CN201810908528.7A priority patent/CN109520340B/zh
Priority to US16/114,864 priority patent/US10524388B2/en
Priority to EP18192738.5A priority patent/EP3460375B1/en
Publication of JP2019056511A publication Critical patent/JP2019056511A/ja
Publication of JP2019056511A5 publication Critical patent/JP2019056511A5/ja
Application granted granted Critical
Publication of JP6886904B2 publication Critical patent/JP6886904B2/ja
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09Heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225Microheat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2017180367A 2017-09-20 2017-09-20 ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器 Active JP6886904B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017180367A JP6886904B2 (ja) 2017-09-20 2017-09-20 ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器
CN201810908528.7A CN109520340B (zh) 2017-09-20 2018-08-10 环型热管、环型热管的制造方法、电子设备
US16/114,864 US10524388B2 (en) 2017-09-20 2018-08-28 Loop heat pipe and electronic device
EP18192738.5A EP3460375B1 (en) 2017-09-20 2018-09-05 Loop heat pipe, method for manufacturing loop heat pipe, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017180367A JP6886904B2 (ja) 2017-09-20 2017-09-20 ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器

Publications (3)

Publication Number Publication Date
JP2019056511A JP2019056511A (ja) 2019-04-11
JP2019056511A5 JP2019056511A5 (enExample) 2020-04-16
JP6886904B2 true JP6886904B2 (ja) 2021-06-16

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JP2017180367A Active JP6886904B2 (ja) 2017-09-20 2017-09-20 ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器

Country Status (4)

Country Link
US (1) US10524388B2 (enExample)
EP (1) EP3460375B1 (enExample)
JP (1) JP6886904B2 (enExample)
CN (1) CN109520340B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019106762A1 (ja) * 2017-11-29 2019-06-06 富士通株式会社 ループヒートパイプ及び電子機器
US10718558B2 (en) * 2017-12-11 2020-07-21 Global Cooling, Inc. Independent auxiliary thermosiphon for inexpensively extending active cooling to additional freezer interior walls
JP6920231B2 (ja) 2018-02-06 2021-08-18 新光電気工業株式会社 ループ型ヒートパイプ
JP6801698B2 (ja) * 2018-09-04 2020-12-16 セイコーエプソン株式会社 冷却装置及びプロジェクター
JP7210379B2 (ja) * 2019-05-31 2023-01-23 新光電気工業株式会社 ループ型ヒートパイプ
JP7305512B2 (ja) * 2019-10-17 2023-07-10 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP7353132B2 (ja) 2019-10-31 2023-09-29 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP7372185B2 (ja) * 2020-03-17 2023-10-31 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP7390252B2 (ja) * 2020-05-12 2023-12-01 新光電気工業株式会社 ループ型ヒートパイプ
WO2021228576A1 (en) 2020-05-15 2021-11-18 Signify Holding B.V. Vapor chamber cooled high lumen device with improved cooling solution
JP7394708B2 (ja) * 2020-06-18 2023-12-08 新光電気工業株式会社 ループ型ヒートパイプ
JP7427564B2 (ja) * 2020-09-07 2024-02-05 新光電気工業株式会社 電子機器
JP7631133B2 (ja) 2021-07-14 2025-02-18 新光電気工業株式会社 ループ型ヒートパイプ
JP7273116B2 (ja) 2021-08-27 2023-05-12 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
JP2023068386A (ja) * 2021-11-02 2023-05-17 新光電気工業株式会社 電子機器
JP2023120521A (ja) * 2022-02-18 2023-08-30 新光電気工業株式会社 ループ型ヒートパイプ

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277963A (ja) * 1999-03-24 2000-10-06 Fujikura Ltd パソコンの冷却装置
US7775261B2 (en) * 2002-02-26 2010-08-17 Mikros Manufacturing, Inc. Capillary condenser/evaporator
JP4057455B2 (ja) 2002-05-08 2008-03-05 古河電気工業株式会社 薄型シート状ヒートパイプ
EP1531384A3 (en) * 2003-11-14 2006-12-06 LG Electronics Inc. Cooling apparatus for portable computer
CN100343785C (zh) * 2005-01-10 2007-10-17 富准精密工业(深圳)有限公司 脉动式热传输装置
JP4496999B2 (ja) * 2005-03-18 2010-07-07 ソニー株式会社 熱輸送装置及び電子機器
TWI262285B (en) * 2005-06-03 2006-09-21 Foxconn Tech Co Ltd Loop-type heat exchange apparatus
US8720530B2 (en) * 2006-05-17 2014-05-13 The Boeing Company Multi-layer wick in loop heat pipe
JP4719079B2 (ja) * 2006-05-19 2011-07-06 株式会社東芝 電子機器
US20090323276A1 (en) * 2008-06-25 2009-12-31 Mongia Rajiv K High performance spreader for lid cooling applications
JP4811460B2 (ja) 2008-12-24 2011-11-09 ソニー株式会社 熱輸送デバイス及び電子機器
JP2010151352A (ja) * 2008-12-24 2010-07-08 Sony Corp 熱輸送デバイスの製造方法及び熱輸送デバイス
WO2011007604A1 (ja) 2009-07-13 2011-01-20 富士通株式会社 ループ型ヒートパイプ及びその起動方法
JP5471119B2 (ja) 2009-07-24 2014-04-16 富士通株式会社 ループ型ヒートパイプ、電子装置
WO2013027737A1 (ja) * 2011-08-25 2013-02-28 日本電気株式会社 電子基板および電子装置
JP6182449B2 (ja) * 2013-12-13 2017-08-16 昭和電工株式会社 Led照明用放熱装置
JP6146484B2 (ja) 2013-12-13 2017-06-14 富士通株式会社 ループ型ヒートパイプとその製造方法、及び電子機器
US9968003B2 (en) * 2014-01-16 2018-05-08 Nec Corporation Cooling device and electronic device
JP6233125B2 (ja) * 2014-03-20 2017-11-22 富士通株式会社 ループ型ヒートパイプとその製造方法、及び電子機器
JP6327029B2 (ja) * 2014-07-14 2018-05-23 富士通株式会社 内部に連通空間を備える積層構造体及びその製造方法
JP2016090204A (ja) 2014-11-11 2016-05-23 富士通株式会社 ループ型ヒートパイプ及び電子機器
CN205430849U (zh) * 2015-11-26 2016-08-03 富葵精密组件(深圳)有限公司 柔性均温板
JP6291000B2 (ja) * 2016-09-01 2018-03-07 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP6886877B2 (ja) * 2017-07-12 2021-06-16 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
CN207729869U (zh) * 2017-12-28 2018-08-14 广东志高暖通设备股份有限公司 一种空调换热器及一种空调设备
JP6951267B2 (ja) * 2018-01-22 2021-10-20 新光電気工業株式会社 ヒートパイプ及びその製造方法
JP7028659B2 (ja) * 2018-01-30 2022-03-02 新光電気工業株式会社 ループ型ヒートパイプ、ループ型ヒートパイプの製造方法
US11573055B2 (en) * 2019-12-27 2023-02-07 Intel Corporation Vapor chamber and means of attachment

Also Published As

Publication number Publication date
US20190090385A1 (en) 2019-03-21
CN109520340A (zh) 2019-03-26
EP3460375B1 (en) 2022-03-16
JP2019056511A (ja) 2019-04-11
CN109520340B (zh) 2022-10-14
US10524388B2 (en) 2019-12-31
EP3460375A1 (en) 2019-03-27

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