CN109520340B - 环型热管、环型热管的制造方法、电子设备 - Google Patents
环型热管、环型热管的制造方法、电子设备 Download PDFInfo
- Publication number
- CN109520340B CN109520340B CN201810908528.7A CN201810908528A CN109520340B CN 109520340 B CN109520340 B CN 109520340B CN 201810908528 A CN201810908528 A CN 201810908528A CN 109520340 B CN109520340 B CN 109520340B
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- Prior art keywords
- condenser
- heat
- pipe
- evaporator
- working fluid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 6
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- 238000010168 coupling process Methods 0.000 claims description 45
- 238000005859 coupling reaction Methods 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 230000008016 vaporization Effects 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
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- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
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- 238000009834 vaporization Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/09—Heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D2015/0225—Microheat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017180367A JP6886904B2 (ja) | 2017-09-20 | 2017-09-20 | ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器 |
| JP2017-180367 | 2017-09-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109520340A CN109520340A (zh) | 2019-03-26 |
| CN109520340B true CN109520340B (zh) | 2022-10-14 |
Family
ID=63517771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810908528.7A Active CN109520340B (zh) | 2017-09-20 | 2018-08-10 | 环型热管、环型热管的制造方法、电子设备 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10524388B2 (enExample) |
| EP (1) | EP3460375B1 (enExample) |
| JP (1) | JP6886904B2 (enExample) |
| CN (1) | CN109520340B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019106762A1 (ja) * | 2017-11-29 | 2019-06-06 | 富士通株式会社 | ループヒートパイプ及び電子機器 |
| US10718558B2 (en) * | 2017-12-11 | 2020-07-21 | Global Cooling, Inc. | Independent auxiliary thermosiphon for inexpensively extending active cooling to additional freezer interior walls |
| JP6920231B2 (ja) | 2018-02-06 | 2021-08-18 | 新光電気工業株式会社 | ループ型ヒートパイプ |
| JP6801698B2 (ja) * | 2018-09-04 | 2020-12-16 | セイコーエプソン株式会社 | 冷却装置及びプロジェクター |
| JP7210379B2 (ja) * | 2019-05-31 | 2023-01-23 | 新光電気工業株式会社 | ループ型ヒートパイプ |
| JP7305512B2 (ja) * | 2019-10-17 | 2023-07-10 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP7353132B2 (ja) | 2019-10-31 | 2023-09-29 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP7372185B2 (ja) * | 2020-03-17 | 2023-10-31 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP7390252B2 (ja) * | 2020-05-12 | 2023-12-01 | 新光電気工業株式会社 | ループ型ヒートパイプ |
| WO2021228576A1 (en) | 2020-05-15 | 2021-11-18 | Signify Holding B.V. | Vapor chamber cooled high lumen device with improved cooling solution |
| JP7394708B2 (ja) * | 2020-06-18 | 2023-12-08 | 新光電気工業株式会社 | ループ型ヒートパイプ |
| JP7427564B2 (ja) * | 2020-09-07 | 2024-02-05 | 新光電気工業株式会社 | 電子機器 |
| JP7631133B2 (ja) | 2021-07-14 | 2025-02-18 | 新光電気工業株式会社 | ループ型ヒートパイプ |
| JP7273116B2 (ja) | 2021-08-27 | 2023-05-12 | レノボ・シンガポール・プライベート・リミテッド | 電子機器及び冷却モジュール |
| JP2023068386A (ja) * | 2021-11-02 | 2023-05-17 | 新光電気工業株式会社 | 電子機器 |
| JP2023120521A (ja) * | 2022-02-18 | 2023-08-30 | 新光電気工業株式会社 | ループ型ヒートパイプ |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000277963A (ja) * | 1999-03-24 | 2000-10-06 | Fujikura Ltd | パソコンの冷却装置 |
| US7775261B2 (en) * | 2002-02-26 | 2010-08-17 | Mikros Manufacturing, Inc. | Capillary condenser/evaporator |
| JP4057455B2 (ja) | 2002-05-08 | 2008-03-05 | 古河電気工業株式会社 | 薄型シート状ヒートパイプ |
| EP1531384A3 (en) * | 2003-11-14 | 2006-12-06 | LG Electronics Inc. | Cooling apparatus for portable computer |
| CN100343785C (zh) * | 2005-01-10 | 2007-10-17 | 富准精密工业(深圳)有限公司 | 脉动式热传输装置 |
| JP4496999B2 (ja) * | 2005-03-18 | 2010-07-07 | ソニー株式会社 | 熱輸送装置及び電子機器 |
| TWI262285B (en) * | 2005-06-03 | 2006-09-21 | Foxconn Tech Co Ltd | Loop-type heat exchange apparatus |
| US8720530B2 (en) * | 2006-05-17 | 2014-05-13 | The Boeing Company | Multi-layer wick in loop heat pipe |
| JP4719079B2 (ja) * | 2006-05-19 | 2011-07-06 | 株式会社東芝 | 電子機器 |
| US20090323276A1 (en) * | 2008-06-25 | 2009-12-31 | Mongia Rajiv K | High performance spreader for lid cooling applications |
| JP4811460B2 (ja) | 2008-12-24 | 2011-11-09 | ソニー株式会社 | 熱輸送デバイス及び電子機器 |
| JP2010151352A (ja) * | 2008-12-24 | 2010-07-08 | Sony Corp | 熱輸送デバイスの製造方法及び熱輸送デバイス |
| WO2011007604A1 (ja) | 2009-07-13 | 2011-01-20 | 富士通株式会社 | ループ型ヒートパイプ及びその起動方法 |
| JP5471119B2 (ja) | 2009-07-24 | 2014-04-16 | 富士通株式会社 | ループ型ヒートパイプ、電子装置 |
| WO2013027737A1 (ja) * | 2011-08-25 | 2013-02-28 | 日本電気株式会社 | 電子基板および電子装置 |
| JP6182449B2 (ja) * | 2013-12-13 | 2017-08-16 | 昭和電工株式会社 | Led照明用放熱装置 |
| JP6146484B2 (ja) | 2013-12-13 | 2017-06-14 | 富士通株式会社 | ループ型ヒートパイプとその製造方法、及び電子機器 |
| US9968003B2 (en) * | 2014-01-16 | 2018-05-08 | Nec Corporation | Cooling device and electronic device |
| JP6233125B2 (ja) * | 2014-03-20 | 2017-11-22 | 富士通株式会社 | ループ型ヒートパイプとその製造方法、及び電子機器 |
| JP6327029B2 (ja) * | 2014-07-14 | 2018-05-23 | 富士通株式会社 | 内部に連通空間を備える積層構造体及びその製造方法 |
| JP2016090204A (ja) | 2014-11-11 | 2016-05-23 | 富士通株式会社 | ループ型ヒートパイプ及び電子機器 |
| CN205430849U (zh) * | 2015-11-26 | 2016-08-03 | 富葵精密组件(深圳)有限公司 | 柔性均温板 |
| JP6291000B2 (ja) * | 2016-09-01 | 2018-03-07 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP6886877B2 (ja) * | 2017-07-12 | 2021-06-16 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| CN207729869U (zh) * | 2017-12-28 | 2018-08-14 | 广东志高暖通设备股份有限公司 | 一种空调换热器及一种空调设备 |
| JP6951267B2 (ja) * | 2018-01-22 | 2021-10-20 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
| JP7028659B2 (ja) * | 2018-01-30 | 2022-03-02 | 新光電気工業株式会社 | ループ型ヒートパイプ、ループ型ヒートパイプの製造方法 |
| US11573055B2 (en) * | 2019-12-27 | 2023-02-07 | Intel Corporation | Vapor chamber and means of attachment |
-
2017
- 2017-09-20 JP JP2017180367A patent/JP6886904B2/ja active Active
-
2018
- 2018-08-10 CN CN201810908528.7A patent/CN109520340B/zh active Active
- 2018-08-28 US US16/114,864 patent/US10524388B2/en active Active
- 2018-09-05 EP EP18192738.5A patent/EP3460375B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20190090385A1 (en) | 2019-03-21 |
| CN109520340A (zh) | 2019-03-26 |
| EP3460375B1 (en) | 2022-03-16 |
| JP2019056511A (ja) | 2019-04-11 |
| US10524388B2 (en) | 2019-12-31 |
| JP6886904B2 (ja) | 2021-06-16 |
| EP3460375A1 (en) | 2019-03-27 |
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