JP6884015B2 - 基板の研磨装置および研磨方法 - Google Patents

基板の研磨装置および研磨方法 Download PDF

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Publication number
JP6884015B2
JP6884015B2 JP2017055976A JP2017055976A JP6884015B2 JP 6884015 B2 JP6884015 B2 JP 6884015B2 JP 2017055976 A JP2017055976 A JP 2017055976A JP 2017055976 A JP2017055976 A JP 2017055976A JP 6884015 B2 JP6884015 B2 JP 6884015B2
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Japan
Prior art keywords
polishing
substrate
conditioning
polishing pad
partial
Prior art date
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JP2017055976A
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English (en)
Japanese (ja)
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JP2018158399A5 (ko
JP2018158399A (ja
Inventor
安田　穂積
穂積 安田
小畠　厳貴
厳貴 小畠
高橋　信行
信行 高橋
卓 作川
卓 作川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
Priority to JP2017055976A priority Critical patent/JP6884015B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to PCT/JP2018/000233 priority patent/WO2018173421A1/ja
Priority to SG11201908381R priority patent/SG11201908381RA/en
Priority to CN201880018928.9A priority patent/CN110461542A/zh
Priority to KR1020197028236A priority patent/KR102482181B1/ko
Priority to US16/495,010 priority patent/US20200269383A1/en
Priority to TW107101152A priority patent/TWI763765B/zh
Publication of JP2018158399A publication Critical patent/JP2018158399A/ja
Publication of JP2018158399A5 publication Critical patent/JP2018158399A5/ja
Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2017055976A 2017-03-22 2017-03-22 基板の研磨装置および研磨方法 Active JP6884015B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法
SG11201908381R SG11201908381RA (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method
CN201880018928.9A CN110461542A (zh) 2017-03-22 2018-01-10 基板的研磨装置及研磨方法
KR1020197028236A KR102482181B1 (ko) 2017-03-22 2018-01-10 기판의 연마 장치 및 연마 방법
PCT/JP2018/000233 WO2018173421A1 (ja) 2017-03-22 2018-01-10 基板の研磨装置および研磨方法
US16/495,010 US20200269383A1 (en) 2017-03-22 2018-01-10 Substrate polishing device and substrate polishing method
TW107101152A TWI763765B (zh) 2017-03-22 2018-01-12 基板的研磨裝置及研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017055976A JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Publications (3)

Publication Number Publication Date
JP2018158399A JP2018158399A (ja) 2018-10-11
JP2018158399A5 JP2018158399A5 (ko) 2020-03-19
JP6884015B2 true JP6884015B2 (ja) 2021-06-09

Family

ID=63584243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017055976A Active JP6884015B2 (ja) 2017-03-22 2017-03-22 基板の研磨装置および研磨方法

Country Status (7)

Country Link
US (1) US20200269383A1 (ko)
JP (1) JP6884015B2 (ko)
KR (1) KR102482181B1 (ko)
CN (1) CN110461542A (ko)
SG (1) SG11201908381RA (ko)
TW (1) TWI763765B (ko)
WO (1) WO2018173421A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020129714A1 (ja) * 2018-12-19 2020-06-25 東京エレクトロン株式会社 基板処理装置、および基板処理方法
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7387471B2 (ja) * 2020-02-05 2023-11-28 株式会社荏原製作所 基板処理装置および基板処理方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
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US4974368A (en) * 1987-03-19 1990-12-04 Canon Kabushiki Kaisha Polishing apparatus
JPH0818241B2 (ja) * 1987-03-19 1996-02-28 キヤノン株式会社 研磨工具の製造方法
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US6478977B1 (en) * 1995-09-13 2002-11-12 Hitachi, Ltd. Polishing method and apparatus
US6191038B1 (en) * 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP3011168B2 (ja) * 1997-12-19 2000-02-21 日本電気株式会社 半導体基板研磨装置
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JPH11320384A (ja) * 1998-05-13 1999-11-24 Sony Corp 化学的機械研磨方法及びこれを使った化学的機械研磨装置
JP2001054864A (ja) * 1999-08-11 2001-02-27 Ishikawajima Harima Heavy Ind Co Ltd 研削加工方法及びそれを用いる研削盤
US6227956B1 (en) * 1999-10-28 2001-05-08 Strasbaugh Pad quick release device for chemical mechanical polishing
JP2001170856A (ja) * 1999-12-14 2001-06-26 Kawasaki Heavy Ind Ltd 曲面仕上げ装置
JP2002018662A (ja) * 2000-06-30 2002-01-22 Toshiba Mach Co Ltd 磨き加工用工具
JP3762248B2 (ja) * 2001-04-24 2006-04-05 キヤノン株式会社 回折光学素子用金型加工方法
US6561880B1 (en) * 2002-01-29 2003-05-13 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for cleaning the polishing pad of a linear polisher
JP2009246240A (ja) * 2008-03-31 2009-10-22 Tokyo Seimitsu Co Ltd 半導体ウェーハ裏面の研削方法及びそれに用いる半導体ウェーハ裏面研削装置
US8915768B2 (en) * 2008-07-31 2014-12-23 Mitsubishi Heavy Industries, Ltd. Method of phasing threaded grinding stone, as well as device therefor
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
JP2010076080A (ja) * 2008-09-29 2010-04-08 Nikon Corp 研磨装置および研磨方法
JP5589427B2 (ja) * 2010-02-19 2014-09-17 株式会社ジェイテクト カップ型ドレッサ及びツルーイング・ドレッシング方法
JP2011177842A (ja) * 2010-03-02 2011-09-15 Ebara Corp 研磨装置及び研磨方法
US10065288B2 (en) 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
JPWO2015050185A1 (ja) * 2013-10-04 2017-03-09 株式会社フジミインコーポレーテッド 研磨装置、研磨部材の加工方法、研磨部材の修正方法、形状加工用切削工具及び表面修正用工具
KR102431971B1 (ko) * 2014-04-18 2022-08-16 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
JP2015205359A (ja) * 2014-04-18 2015-11-19 株式会社荏原製作所 基板処理装置
JP6307428B2 (ja) * 2014-12-26 2018-04-04 株式会社荏原製作所 研磨装置およびその制御方法
CN205363593U (zh) * 2016-02-22 2016-07-06 中芯国际集成电路制造(北京)有限公司 一种研磨垫调整器
US10589399B2 (en) * 2016-03-24 2020-03-17 Applied Materials, Inc. Textured small pad for chemical mechanical polishing
JP2018134710A (ja) * 2017-02-22 2018-08-30 株式会社荏原製作所 基板の研磨装置および研磨方法

Also Published As

Publication number Publication date
KR20190131501A (ko) 2019-11-26
TWI763765B (zh) 2022-05-11
SG11201908381RA (en) 2019-10-30
CN110461542A (zh) 2019-11-15
TW201834786A (zh) 2018-10-01
WO2018173421A1 (ja) 2018-09-27
KR102482181B1 (ko) 2022-12-29
US20200269383A1 (en) 2020-08-27
JP2018158399A (ja) 2018-10-11

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