JP6834000B2 - フレキシブルコネクタ - Google Patents

フレキシブルコネクタ Download PDF

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Publication number
JP6834000B2
JP6834000B2 JP2019528086A JP2019528086A JP6834000B2 JP 6834000 B2 JP6834000 B2 JP 6834000B2 JP 2019528086 A JP2019528086 A JP 2019528086A JP 2019528086 A JP2019528086 A JP 2019528086A JP 6834000 B2 JP6834000 B2 JP 6834000B2
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JP
Japan
Prior art keywords
connector
facing
substrates
substrate
substrate surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019528086A
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English (en)
Japanese (ja)
Other versions
JP2019536294A5 (enExample
JP2019536294A (ja
Inventor
デイビッド ハートマン、ジェフリー
デイビッド ハートマン、ジェフリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Systems Corp
Original Assignee
Northrop Grumman Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Systems Corp filed Critical Northrop Grumman Systems Corp
Publication of JP2019536294A publication Critical patent/JP2019536294A/ja
Publication of JP2019536294A5 publication Critical patent/JP2019536294A5/ja
Application granted granted Critical
Publication of JP6834000B2 publication Critical patent/JP6834000B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
JP2019528086A 2016-12-13 2017-11-09 フレキシブルコネクタ Active JP6834000B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/377,670 US20180168042A1 (en) 2016-12-13 2016-12-13 Flexible connector
US15/377,670 2016-12-13
PCT/US2017/060867 WO2018111460A1 (en) 2016-12-13 2017-11-09 Flexible connector

Publications (3)

Publication Number Publication Date
JP2019536294A JP2019536294A (ja) 2019-12-12
JP2019536294A5 JP2019536294A5 (enExample) 2020-01-30
JP6834000B2 true JP6834000B2 (ja) 2021-02-24

Family

ID=60409491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019528086A Active JP6834000B2 (ja) 2016-12-13 2017-11-09 フレキシブルコネクタ

Country Status (7)

Country Link
US (2) US20180168042A1 (enExample)
EP (1) EP3556185B1 (enExample)
JP (1) JP6834000B2 (enExample)
KR (1) KR102286169B1 (enExample)
AU (1) AU2017377926B2 (enExample)
CA (1) CA3046344C (enExample)
WO (1) WO2018111460A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102337901B1 (ko) 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
IT201800009268A1 (it) * 2018-10-09 2020-04-09 Te Connectivity Italia Distrib Srl Dispositivo di connessione
CN209376018U (zh) 2018-11-14 2019-09-10 奥特斯(中国)有限公司 具有改进的弯曲性能的部件承载件
CN110022644B (zh) * 2019-05-16 2020-04-03 广州市宝米勒电气技术有限公司 Pcb及其连接具有不同平面触点的元器件的方法、电子装置
GB201910805D0 (en) 2019-07-29 2019-09-11 Leonardo Mw Ltd Circuit board assembly
WO2021021190A1 (en) * 2019-07-31 2021-02-04 Hewlett-Packard Development Company, L.P. Board to board connectors
US11075486B1 (en) 2020-03-02 2021-07-27 Northrop Grumman Systems Corporation Signal connector system
CN111369945B (zh) * 2020-04-30 2021-05-04 京东方科技集团股份有限公司 电路板组件、显示装置、终端和信号处理系统
US11038594B1 (en) 2020-05-13 2021-06-15 Northrop Grumman Systems Corporation Self-insulating high bandwidth connector
US11569608B2 (en) 2021-03-30 2023-01-31 Northrop Grumman Systems Corporation Electrical connector system
US11688962B2 (en) * 2021-05-13 2023-06-27 Veoneer Us, Llc Scalable electronic modules having a common form factor
KR20230005654A (ko) * 2021-07-01 2023-01-10 삼성전자주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치
CN114496358A (zh) * 2022-01-21 2022-05-13 武汉衷华脑机融合科技发展有限公司 一种连接线结构及其形成方法
JP7628191B2 (ja) * 2022-10-12 2025-02-07 ルイジェ ネットワークス カンパニー，リミテッド チップツーモジュールのケーブルアセンブリ及びｐｃｂボード回路
US12494599B2 (en) 2022-12-20 2025-12-09 Northrop Grumman Systems Corporation Silicon flexible connectors

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2946726C2 (de) 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
US4466184A (en) * 1981-04-21 1984-08-21 General Dynamics, Pomona Division Method of making pressure point contact system
US4715928A (en) * 1985-09-27 1987-12-29 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
US5160269A (en) * 1991-12-19 1992-11-03 Precision Interconnect Corporation Hydrostatic connector for flex circuits
US5161981A (en) * 1992-03-10 1992-11-10 Amp Incorporated Foldable stacking connector
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5419038A (en) * 1993-06-17 1995-05-30 Fujitsu Limited Method for fabricating thin-film interconnector
US6040624A (en) * 1997-10-02 2000-03-21 Motorola, Inc. Semiconductor device package and method
US6603079B2 (en) * 1999-02-05 2003-08-05 Mack Technologies Florida, Inc. Printed circuit board electrical interconnects
JP3744383B2 (ja) * 2000-06-09 2006-02-08 松下電器産業株式会社 複合配線基板及びその製造方法
US6721189B1 (en) * 2002-03-13 2004-04-13 Rambus, Inc. Memory module
US6712620B1 (en) * 2002-09-12 2004-03-30 High Connection Density, Inc. Coaxial elastomeric connector system
JP4196743B2 (ja) * 2003-06-12 2008-12-17 沖電気工業株式会社 半導体記憶装置
JP2005322878A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法
JP2006339088A (ja) 2005-06-06 2006-12-14 Fci Asia Technology Pte Ltd 電気コネクタ
US7407408B1 (en) * 2006-12-22 2008-08-05 Amphenol Corporation Flexible circuit connector assembly with strain relief
US8178789B2 (en) * 2007-07-17 2012-05-15 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US8118611B2 (en) * 2008-10-31 2012-02-21 Myoungsoo Jeon PCB bridge connector for connecting PCB devices
KR101051491B1 (ko) * 2009-10-28 2011-07-22 삼성전기주식회사 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법
EP2728983A1 (de) * 2012-10-30 2014-05-07 Continental Automotive GmbH Leiterplattenbaugruppe für ein Steuergerät, Steuergerät für ein Kraftfahrzeug und Signalverarbeitungsanordnung
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
TW201448688A (zh) * 2013-06-03 2014-12-16 Mutual Tek Ind Co Ltd 複合式電路板及其製作方法
JP6270344B2 (ja) 2013-06-05 2018-01-31 ソニーセミコンダクタソリューションズ株式会社 伝送モジュール、シールド方法及びコネクタ
CN205093052U (zh) * 2013-07-30 2016-03-16 株式会社村田制作所 多层基板

Also Published As

Publication number Publication date
AU2017377926B2 (en) 2020-06-18
CA3046344C (en) 2021-04-27
CA3046344A1 (en) 2018-06-21
EP3556185A1 (en) 2019-10-23
US10681812B2 (en) 2020-06-09
AU2017377926A1 (en) 2019-05-23
KR102286169B1 (ko) 2021-08-06
EP3556185B1 (en) 2024-10-09
US20180168042A1 (en) 2018-06-14
US20190313530A1 (en) 2019-10-10
JP2019536294A (ja) 2019-12-12
KR20190077499A (ko) 2019-07-03
WO2018111460A1 (en) 2018-06-21

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