KR102286169B1 - 플렉시블 커넥터 - Google Patents

플렉시블 커넥터 Download PDF

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Publication number
KR102286169B1
KR102286169B1 KR1020197015946A KR20197015946A KR102286169B1 KR 102286169 B1 KR102286169 B1 KR 102286169B1 KR 1020197015946 A KR1020197015946 A KR 1020197015946A KR 20197015946 A KR20197015946 A KR 20197015946A KR 102286169 B1 KR102286169 B1 KR 102286169B1
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KR
South Korea
Prior art keywords
connector
board
delete delete
facing
substrate surface
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KR1020197015946A
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English (en)
Korean (ko)
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KR20190077499A (ko
Inventor
제프리 데이비드 하트먼
Original Assignee
노스롭 그루먼 시스템즈 코포레이션
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/0278Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4688Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/058Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
KR1020197015946A 2016-12-13 2017-11-09 플렉시블 커넥터 Active KR102286169B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/377,670 2016-12-13
US15/377,670 US20180168042A1 (en) 2016-12-13 2016-12-13 Flexible connector
PCT/US2017/060867 WO2018111460A1 (en) 2016-12-13 2017-11-09 Flexible connector

Publications (2)

Publication Number Publication Date
KR20190077499A KR20190077499A (ko) 2019-07-03
KR102286169B1 true KR102286169B1 (ko) 2021-08-06

Family

ID=60409491

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197015946A Active KR102286169B1 (ko) 2016-12-13 2017-11-09 플렉시블 커넥터

Country Status (7)

Country Link
US (2) US20180168042A1 (enExample)
EP (1) EP3556185B1 (enExample)
JP (1) JP6834000B2 (enExample)
KR (1) KR102286169B1 (enExample)
AU (1) AU2017377926B2 (enExample)
CA (1) CA3046344C (enExample)
WO (1) WO2018111460A1 (enExample)

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KR102337901B1 (ko) * 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
IT201800009268A1 (it) * 2018-10-09 2020-04-09 Te Connectivity Italia Distrib Srl Dispositivo di connessione
CN209376018U (zh) 2018-11-14 2019-09-10 奥特斯(中国)有限公司 具有改进的弯曲性能的部件承载件
CN110022644B (zh) * 2019-05-16 2020-04-03 广州市宝米勒电气技术有限公司 Pcb及其连接具有不同平面触点的元器件的方法、电子装置
GB201910805D0 (en) * 2019-07-29 2019-09-11 Leonardo Mw Ltd Circuit board assembly
CN114207949A (zh) * 2019-07-31 2022-03-18 惠普发展公司,有限责任合伙企业 板对板连接器
US11075486B1 (en) 2020-03-02 2021-07-27 Northrop Grumman Systems Corporation Signal connector system
CN111369945B (zh) * 2020-04-30 2021-05-04 京东方科技集团股份有限公司 电路板组件、显示装置、终端和信号处理系统
US11038594B1 (en) 2020-05-13 2021-06-15 Northrop Grumman Systems Corporation Self-insulating high bandwidth connector
US11569608B2 (en) 2021-03-30 2023-01-31 Northrop Grumman Systems Corporation Electrical connector system
US11688962B2 (en) * 2021-05-13 2023-06-27 Veoneer Us, Llc Scalable electronic modules having a common form factor
KR20230005654A (ko) * 2021-07-01 2023-01-10 삼성전자주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치
CN114496358A (zh) * 2022-01-21 2022-05-13 武汉衷华脑机融合科技发展有限公司 一种连接线结构及其形成方法
WO2024077529A1 (zh) * 2022-10-12 2024-04-18 锐捷网络股份有限公司 一种芯片到面板的线缆组件及pcb板电路
US12494599B2 (en) * 2022-12-20 2025-12-09 Northrop Grumman Systems Corporation Silicon flexible connectors

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JP2002064271A (ja) 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
WO2006132108A1 (ja) 2005-06-06 2006-12-14 Fci Connectors Singapore Pte Ltd. 電気コネクタ
US20100112833A1 (en) * 2008-10-31 2010-05-06 Myoungsoo Jeon PCB bridge connector for connecting PCB devices
US20160014893A1 (en) * 2013-07-30 2016-01-14 Murata Manufacturing Co., Ltd. Multilayer board

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Publication number Priority date Publication date Assignee Title
JP2002064271A (ja) 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
WO2006132108A1 (ja) 2005-06-06 2006-12-14 Fci Connectors Singapore Pte Ltd. 電気コネクタ
US20100112833A1 (en) * 2008-10-31 2010-05-06 Myoungsoo Jeon PCB bridge connector for connecting PCB devices
US20160014893A1 (en) * 2013-07-30 2016-01-14 Murata Manufacturing Co., Ltd. Multilayer board

Also Published As

Publication number Publication date
AU2017377926A1 (en) 2019-05-23
JP6834000B2 (ja) 2021-02-24
EP3556185A1 (en) 2019-10-23
AU2017377926B2 (en) 2020-06-18
EP3556185B1 (en) 2024-10-09
JP2019536294A (ja) 2019-12-12
CA3046344A1 (en) 2018-06-21
US20180168042A1 (en) 2018-06-14
KR20190077499A (ko) 2019-07-03
US10681812B2 (en) 2020-06-09
WO2018111460A1 (en) 2018-06-21
CA3046344C (en) 2021-04-27
US20190313530A1 (en) 2019-10-10

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