KR102286169B1 - 플렉시블 커넥터 - Google Patents
플렉시블 커넥터 Download PDFInfo
- Publication number
- KR102286169B1 KR102286169B1 KR1020197015946A KR20197015946A KR102286169B1 KR 102286169 B1 KR102286169 B1 KR 102286169B1 KR 1020197015946 A KR1020197015946 A KR 1020197015946A KR 20197015946 A KR20197015946 A KR 20197015946A KR 102286169 B1 KR102286169 B1 KR 102286169B1
- Authority
- KR
- South Korea
- Prior art keywords
- connector
- board
- delete delete
- facing
- substrate surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/377,670 | 2016-12-13 | ||
| US15/377,670 US20180168042A1 (en) | 2016-12-13 | 2016-12-13 | Flexible connector |
| PCT/US2017/060867 WO2018111460A1 (en) | 2016-12-13 | 2017-11-09 | Flexible connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190077499A KR20190077499A (ko) | 2019-07-03 |
| KR102286169B1 true KR102286169B1 (ko) | 2021-08-06 |
Family
ID=60409491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197015946A Active KR102286169B1 (ko) | 2016-12-13 | 2017-11-09 | 플렉시블 커넥터 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20180168042A1 (enExample) |
| EP (1) | EP3556185B1 (enExample) |
| JP (1) | JP6834000B2 (enExample) |
| KR (1) | KR102286169B1 (enExample) |
| AU (1) | AU2017377926B2 (enExample) |
| CA (1) | CA3046344C (enExample) |
| WO (1) | WO2018111460A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102337901B1 (ko) * | 2018-08-28 | 2021-12-08 | 주식회사 엘지에너지솔루션 | 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법 |
| IT201800009268A1 (it) * | 2018-10-09 | 2020-04-09 | Te Connectivity Italia Distrib Srl | Dispositivo di connessione |
| CN209376018U (zh) | 2018-11-14 | 2019-09-10 | 奥特斯(中国)有限公司 | 具有改进的弯曲性能的部件承载件 |
| CN110022644B (zh) * | 2019-05-16 | 2020-04-03 | 广州市宝米勒电气技术有限公司 | Pcb及其连接具有不同平面触点的元器件的方法、电子装置 |
| GB201910805D0 (en) * | 2019-07-29 | 2019-09-11 | Leonardo Mw Ltd | Circuit board assembly |
| CN114207949A (zh) * | 2019-07-31 | 2022-03-18 | 惠普发展公司,有限责任合伙企业 | 板对板连接器 |
| US11075486B1 (en) | 2020-03-02 | 2021-07-27 | Northrop Grumman Systems Corporation | Signal connector system |
| CN111369945B (zh) * | 2020-04-30 | 2021-05-04 | 京东方科技集团股份有限公司 | 电路板组件、显示装置、终端和信号处理系统 |
| US11038594B1 (en) | 2020-05-13 | 2021-06-15 | Northrop Grumman Systems Corporation | Self-insulating high bandwidth connector |
| US11569608B2 (en) | 2021-03-30 | 2023-01-31 | Northrop Grumman Systems Corporation | Electrical connector system |
| US11688962B2 (en) * | 2021-05-13 | 2023-06-27 | Veoneer Us, Llc | Scalable electronic modules having a common form factor |
| KR20230005654A (ko) * | 2021-07-01 | 2023-01-10 | 삼성전자주식회사 | 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치 |
| CN114496358A (zh) * | 2022-01-21 | 2022-05-13 | 武汉衷华脑机融合科技发展有限公司 | 一种连接线结构及其形成方法 |
| WO2024077529A1 (zh) * | 2022-10-12 | 2024-04-18 | 锐捷网络股份有限公司 | 一种芯片到面板的线缆组件及pcb板电路 |
| US12494599B2 (en) * | 2022-12-20 | 2025-12-09 | Northrop Grumman Systems Corporation | Silicon flexible connectors |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002064271A (ja) | 2000-06-09 | 2002-02-28 | Matsushita Electric Ind Co Ltd | 複合配線基板及びその製造方法 |
| WO2006132108A1 (ja) | 2005-06-06 | 2006-12-14 | Fci Connectors Singapore Pte Ltd. | 電気コネクタ |
| US20100112833A1 (en) * | 2008-10-31 | 2010-05-06 | Myoungsoo Jeon | PCB bridge connector for connecting PCB devices |
| US20160014893A1 (en) * | 2013-07-30 | 2016-01-14 | Murata Manufacturing Co., Ltd. | Multilayer board |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2946726C2 (de) | 1979-11-20 | 1982-05-19 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung |
| US4466184A (en) * | 1981-04-21 | 1984-08-21 | General Dynamics, Pomona Division | Method of making pressure point contact system |
| US4687695A (en) * | 1985-09-27 | 1987-08-18 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
| US4715928A (en) * | 1985-09-27 | 1987-12-29 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
| US5160269A (en) * | 1991-12-19 | 1992-11-03 | Precision Interconnect Corporation | Hydrostatic connector for flex circuits |
| US5161981A (en) * | 1992-03-10 | 1992-11-10 | Amp Incorporated | Foldable stacking connector |
| US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
| US5419038A (en) * | 1993-06-17 | 1995-05-30 | Fujitsu Limited | Method for fabricating thin-film interconnector |
| US6040624A (en) * | 1997-10-02 | 2000-03-21 | Motorola, Inc. | Semiconductor device package and method |
| US6603079B2 (en) * | 1999-02-05 | 2003-08-05 | Mack Technologies Florida, Inc. | Printed circuit board electrical interconnects |
| US6721189B1 (en) * | 2002-03-13 | 2004-04-13 | Rambus, Inc. | Memory module |
| US6712620B1 (en) * | 2002-09-12 | 2004-03-30 | High Connection Density, Inc. | Coaxial elastomeric connector system |
| JP4196743B2 (ja) * | 2003-06-12 | 2008-12-17 | 沖電気工業株式会社 | 半導体記憶装置 |
| JP2005322878A (ja) * | 2004-04-09 | 2005-11-17 | Dainippon Printing Co Ltd | 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法 |
| US7438582B2 (en) * | 2006-12-22 | 2008-10-21 | Amphenol Corporation | Flexible circuit connector assembly |
| US8178789B2 (en) * | 2007-07-17 | 2012-05-15 | Ibiden Co., Ltd. | Wiring board and method of manufacturing wiring board |
| KR101051491B1 (ko) * | 2009-10-28 | 2011-07-22 | 삼성전기주식회사 | 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법 |
| EP2728983A1 (de) * | 2012-10-30 | 2014-05-07 | Continental Automotive GmbH | Leiterplattenbaugruppe für ein Steuergerät, Steuergerät für ein Kraftfahrzeug und Signalverarbeitungsanordnung |
| US8878353B2 (en) | 2012-12-20 | 2014-11-04 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
| TW201448688A (zh) * | 2013-06-03 | 2014-12-16 | Mutual Tek Ind Co Ltd | 複合式電路板及其製作方法 |
| JP6270344B2 (ja) | 2013-06-05 | 2018-01-31 | ソニーセミコンダクタソリューションズ株式会社 | 伝送モジュール、シールド方法及びコネクタ |
-
2016
- 2016-12-13 US US15/377,670 patent/US20180168042A1/en not_active Abandoned
-
2017
- 2017-11-09 EP EP17801291.0A patent/EP3556185B1/en active Active
- 2017-11-09 AU AU2017377926A patent/AU2017377926B2/en active Active
- 2017-11-09 CA CA3046344A patent/CA3046344C/en active Active
- 2017-11-09 WO PCT/US2017/060867 patent/WO2018111460A1/en not_active Ceased
- 2017-11-09 KR KR1020197015946A patent/KR102286169B1/ko active Active
- 2017-11-09 JP JP2019528086A patent/JP6834000B2/ja active Active
-
2019
- 2019-06-12 US US16/439,415 patent/US10681812B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002064271A (ja) | 2000-06-09 | 2002-02-28 | Matsushita Electric Ind Co Ltd | 複合配線基板及びその製造方法 |
| WO2006132108A1 (ja) | 2005-06-06 | 2006-12-14 | Fci Connectors Singapore Pte Ltd. | 電気コネクタ |
| US20100112833A1 (en) * | 2008-10-31 | 2010-05-06 | Myoungsoo Jeon | PCB bridge connector for connecting PCB devices |
| US20160014893A1 (en) * | 2013-07-30 | 2016-01-14 | Murata Manufacturing Co., Ltd. | Multilayer board |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2017377926A1 (en) | 2019-05-23 |
| JP6834000B2 (ja) | 2021-02-24 |
| EP3556185A1 (en) | 2019-10-23 |
| AU2017377926B2 (en) | 2020-06-18 |
| EP3556185B1 (en) | 2024-10-09 |
| JP2019536294A (ja) | 2019-12-12 |
| CA3046344A1 (en) | 2018-06-21 |
| US20180168042A1 (en) | 2018-06-14 |
| KR20190077499A (ko) | 2019-07-03 |
| US10681812B2 (en) | 2020-06-09 |
| WO2018111460A1 (en) | 2018-06-21 |
| CA3046344C (en) | 2021-04-27 |
| US20190313530A1 (en) | 2019-10-10 |
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Legal Events
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| A201 | Request for examination | ||
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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St.27 status event code: A-2-3-E10-E13-lim-X000 |
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St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E701 | Decision to grant or registration of patent right | ||
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