AU2017377926B2 - Flexible connector - Google Patents

Flexible connector Download PDF

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Publication number
AU2017377926B2
AU2017377926B2 AU2017377926A AU2017377926A AU2017377926B2 AU 2017377926 B2 AU2017377926 B2 AU 2017377926B2 AU 2017377926 A AU2017377926 A AU 2017377926A AU 2017377926 A AU2017377926 A AU 2017377926A AU 2017377926 B2 AU2017377926 B2 AU 2017377926B2
Authority
AU
Australia
Prior art keywords
connector
board
chosen
facing
substrate surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
AU2017377926A
Other languages
English (en)
Other versions
AU2017377926A1 (en
Inventor
Jeffrey David Hartman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Systems Corp
Original Assignee
Northrop Grumman Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Systems Corp filed Critical Northrop Grumman Systems Corp
Publication of AU2017377926A1 publication Critical patent/AU2017377926A1/en
Application granted granted Critical
Publication of AU2017377926B2 publication Critical patent/AU2017377926B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
AU2017377926A 2016-12-13 2017-11-09 Flexible connector Active AU2017377926B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/377,670 2016-12-13
US15/377,670 US20180168042A1 (en) 2016-12-13 2016-12-13 Flexible connector
PCT/US2017/060867 WO2018111460A1 (en) 2016-12-13 2017-11-09 Flexible connector

Publications (2)

Publication Number Publication Date
AU2017377926A1 AU2017377926A1 (en) 2019-05-23
AU2017377926B2 true AU2017377926B2 (en) 2020-06-18

Family

ID=60409491

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2017377926A Active AU2017377926B2 (en) 2016-12-13 2017-11-09 Flexible connector

Country Status (7)

Country Link
US (2) US20180168042A1 (enExample)
EP (1) EP3556185B1 (enExample)
JP (1) JP6834000B2 (enExample)
KR (1) KR102286169B1 (enExample)
AU (1) AU2017377926B2 (enExample)
CA (1) CA3046344C (enExample)
WO (1) WO2018111460A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102337901B1 (ko) * 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
IT201800009268A1 (it) * 2018-10-09 2020-04-09 Te Connectivity Italia Distrib Srl Dispositivo di connessione
CN209376018U (zh) 2018-11-14 2019-09-10 奥特斯(中国)有限公司 具有改进的弯曲性能的部件承载件
CN110022644B (zh) * 2019-05-16 2020-04-03 广州市宝米勒电气技术有限公司 Pcb及其连接具有不同平面触点的元器件的方法、电子装置
GB201910805D0 (en) * 2019-07-29 2019-09-11 Leonardo Mw Ltd Circuit board assembly
CN114207949A (zh) * 2019-07-31 2022-03-18 惠普发展公司，有限责任合伙企业 板对板连接器
US11075486B1 (en) 2020-03-02 2021-07-27 Northrop Grumman Systems Corporation Signal connector system
CN111369945B (zh) * 2020-04-30 2021-05-04 京东方科技集团股份有限公司 电路板组件、显示装置、终端和信号处理系统
US11038594B1 (en) 2020-05-13 2021-06-15 Northrop Grumman Systems Corporation Self-insulating high bandwidth connector
US11569608B2 (en) 2021-03-30 2023-01-31 Northrop Grumman Systems Corporation Electrical connector system
US11688962B2 (en) * 2021-05-13 2023-06-27 Veoneer Us, Llc Scalable electronic modules having a common form factor
KR20230005654A (ko) * 2021-07-01 2023-01-10 삼성전자주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치
CN114496358A (zh) * 2022-01-21 2022-05-13 武汉衷华脑机融合科技发展有限公司 一种连接线结构及其形成方法
WO2024077529A1 (zh) * 2022-10-12 2024-04-18 锐捷网络股份有限公司 一种芯片到面板的线缆组件及pcb板电路
US12494599B2 (en) * 2022-12-20 2025-12-09 Northrop Grumman Systems Corporation Silicon flexible connectors

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
WO2006132108A1 (ja) * 2005-06-06 2006-12-14 Fci Connectors Singapore Pte Ltd. 電気コネクタ
US20100112833A1 (en) * 2008-10-31 2010-05-06 Myoungsoo Jeon PCB bridge connector for connecting PCB devices
US8359738B2 (en) * 2007-07-17 2013-01-29 Ibiden Co., Ltd. Method of manufacturing wiring board
EP2728983A1 (de) * 2012-10-30 2014-05-07 Continental Automotive GmbH Leiterplattenbaugruppe für ein Steuergerät, Steuergerät für ein Kraftfahrzeug und Signalverarbeitungsanordnung
US20140353014A1 (en) * 2013-06-03 2014-12-04 Mutual-Tek Industries Co., Ltd. Combined circuit board and method of manufacturing the same
US9485860B2 (en) * 2013-07-30 2016-11-01 Murata Manufacturing Co., Ltd. Multilayer board

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DE2946726C2 (de) 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
US4466184A (en) * 1981-04-21 1984-08-21 General Dynamics, Pomona Division Method of making pressure point contact system
US4715928A (en) * 1985-09-27 1987-12-29 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
US5160269A (en) * 1991-12-19 1992-11-03 Precision Interconnect Corporation Hydrostatic connector for flex circuits
US5161981A (en) * 1992-03-10 1992-11-10 Amp Incorporated Foldable stacking connector
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5419038A (en) * 1993-06-17 1995-05-30 Fujitsu Limited Method for fabricating thin-film interconnector
US6040624A (en) * 1997-10-02 2000-03-21 Motorola, Inc. Semiconductor device package and method
US6603079B2 (en) * 1999-02-05 2003-08-05 Mack Technologies Florida, Inc. Printed circuit board electrical interconnects
JP3744383B2 (ja) 2000-06-09 2006-02-08 松下電器産業株式会社 複合配線基板及びその製造方法
US6721189B1 (en) * 2002-03-13 2004-04-13 Rambus, Inc. Memory module
US6712620B1 (en) * 2002-09-12 2004-03-30 High Connection Density, Inc. Coaxial elastomeric connector system
JP4196743B2 (ja) * 2003-06-12 2008-12-17 沖電気工業株式会社 半導体記憶装置
JP2005322878A (ja) * 2004-04-09 2005-11-17 Dainippon Printing Co Ltd 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法
US7438582B2 (en) * 2006-12-22 2008-10-21 Amphenol Corporation Flexible circuit connector assembly
KR101051491B1 (ko) * 2009-10-28 2011-07-22 삼성전기주식회사 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
JP6270344B2 (ja) 2013-06-05 2018-01-31 ソニーセミコンダクタソリューションズ株式会社 伝送モジュール、シールド方法及びコネクタ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
WO2006132108A1 (ja) * 2005-06-06 2006-12-14 Fci Connectors Singapore Pte Ltd. 電気コネクタ
US8359738B2 (en) * 2007-07-17 2013-01-29 Ibiden Co., Ltd. Method of manufacturing wiring board
US20100112833A1 (en) * 2008-10-31 2010-05-06 Myoungsoo Jeon PCB bridge connector for connecting PCB devices
EP2728983A1 (de) * 2012-10-30 2014-05-07 Continental Automotive GmbH Leiterplattenbaugruppe für ein Steuergerät, Steuergerät für ein Kraftfahrzeug und Signalverarbeitungsanordnung
US20140353014A1 (en) * 2013-06-03 2014-12-04 Mutual-Tek Industries Co., Ltd. Combined circuit board and method of manufacturing the same
US9485860B2 (en) * 2013-07-30 2016-11-01 Murata Manufacturing Co., Ltd. Multilayer board

Also Published As

Publication number Publication date
AU2017377926A1 (en) 2019-05-23
JP6834000B2 (ja) 2021-02-24
EP3556185A1 (en) 2019-10-23
KR102286169B1 (ko) 2021-08-06
EP3556185B1 (en) 2024-10-09
JP2019536294A (ja) 2019-12-12
CA3046344A1 (en) 2018-06-21
US20180168042A1 (en) 2018-06-14
KR20190077499A (ko) 2019-07-03
US10681812B2 (en) 2020-06-09
WO2018111460A1 (en) 2018-06-21
CA3046344C (en) 2021-04-27
US20190313530A1 (en) 2019-10-10

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Legal Events

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FGA Letters patent sealed or granted (standard patent)