JP2019536294A5 - - Google Patents

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Publication number
JP2019536294A5
JP2019536294A5 JP2019528086A JP2019528086A JP2019536294A5 JP 2019536294 A5 JP2019536294 A5 JP 2019536294A5 JP 2019528086 A JP2019528086 A JP 2019528086A JP 2019528086 A JP2019528086 A JP 2019528086A JP 2019536294 A5 JP2019536294 A5 JP 2019536294A5
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JP
Japan
Prior art keywords
connector
substrates
block
substrate
facing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019528086A
Other languages
English (en)
Japanese (ja)
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JP6834000B2 (ja
JP2019536294A (ja
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Publication date
Priority claimed from US15/377,670 external-priority patent/US20180168042A1/en
Application filed filed Critical
Publication of JP2019536294A publication Critical patent/JP2019536294A/ja
Publication of JP2019536294A5 publication Critical patent/JP2019536294A5/ja
Application granted granted Critical
Publication of JP6834000B2 publication Critical patent/JP6834000B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019528086A 2016-12-13 2017-11-09 フレキシブルコネクタ Active JP6834000B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/377,670 US20180168042A1 (en) 2016-12-13 2016-12-13 Flexible connector
US15/377,670 2016-12-13
PCT/US2017/060867 WO2018111460A1 (en) 2016-12-13 2017-11-09 Flexible connector

Publications (3)

Publication Number Publication Date
JP2019536294A JP2019536294A (ja) 2019-12-12
JP2019536294A5 true JP2019536294A5 (enExample) 2020-01-30
JP6834000B2 JP6834000B2 (ja) 2021-02-24

Family

ID=60409491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019528086A Active JP6834000B2 (ja) 2016-12-13 2017-11-09 フレキシブルコネクタ

Country Status (7)

Country Link
US (2) US20180168042A1 (enExample)
EP (1) EP3556185B1 (enExample)
JP (1) JP6834000B2 (enExample)
KR (1) KR102286169B1 (enExample)
AU (1) AU2017377926B2 (enExample)
CA (1) CA3046344C (enExample)
WO (1) WO2018111460A1 (enExample)

Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
KR102337901B1 (ko) 2018-08-28 2021-12-08 주식회사 엘지에너지솔루션 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
IT201800009268A1 (it) * 2018-10-09 2020-04-09 Te Connectivity Italia Distrib Srl Dispositivo di connessione
CN209376018U (zh) 2018-11-14 2019-09-10 奥特斯(中国)有限公司 具有改进的弯曲性能的部件承载件
CN110022644B (zh) * 2019-05-16 2020-04-03 广州市宝米勒电气技术有限公司 Pcb及其连接具有不同平面触点的元器件的方法、电子装置
GB201910805D0 (en) 2019-07-29 2019-09-11 Leonardo Mw Ltd Circuit board assembly
WO2021021190A1 (en) * 2019-07-31 2021-02-04 Hewlett-Packard Development Company, L.P. Board to board connectors
US11075486B1 (en) 2020-03-02 2021-07-27 Northrop Grumman Systems Corporation Signal connector system
CN111369945B (zh) * 2020-04-30 2021-05-04 京东方科技集团股份有限公司 电路板组件、显示装置、终端和信号处理系统
US11038594B1 (en) 2020-05-13 2021-06-15 Northrop Grumman Systems Corporation Self-insulating high bandwidth connector
US11569608B2 (en) 2021-03-30 2023-01-31 Northrop Grumman Systems Corporation Electrical connector system
US11688962B2 (en) * 2021-05-13 2023-06-27 Veoneer Us, Llc Scalable electronic modules having a common form factor
KR20230005654A (ko) * 2021-07-01 2023-01-10 삼성전자주식회사 경연성 인쇄 회로 기판 및 이를 포함하는 전자 장치
CN114496358A (zh) * 2022-01-21 2022-05-13 武汉衷华脑机融合科技发展有限公司 一种连接线结构及其形成方法
JP7628191B2 (ja) * 2022-10-12 2025-02-07 ルイジェ ネットワークス カンパニー，リミテッド チップツーモジュールのケーブルアセンブリ及びｐｃｂボード回路
US12494599B2 (en) 2022-12-20 2025-12-09 Northrop Grumman Systems Corporation Silicon flexible connectors

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DE2946726C2 (de) 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
US4466184A (en) * 1981-04-21 1984-08-21 General Dynamics, Pomona Division Method of making pressure point contact system
US4715928A (en) * 1985-09-27 1987-12-29 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
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KR101051491B1 (ko) * 2009-10-28 2011-07-22 삼성전기주식회사 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법
EP2728983A1 (de) * 2012-10-30 2014-05-07 Continental Automotive GmbH Leiterplattenbaugruppe für ein Steuergerät, Steuergerät für ein Kraftfahrzeug und Signalverarbeitungsanordnung
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
TW201448688A (zh) * 2013-06-03 2014-12-16 Mutual Tek Ind Co Ltd 複合式電路板及其製作方法
JP6270344B2 (ja) 2013-06-05 2018-01-31 ソニーセミコンダクタソリューションズ株式会社 伝送モジュール、シールド方法及びコネクタ
CN205093052U (zh) * 2013-07-30 2016-03-16 株式会社村田制作所 多层基板

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