JP6817648B1 - 電子部品の処理装置 - Google Patents

電子部品の処理装置 Download PDF

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Publication number
JP6817648B1
JP6817648B1 JP2019171910A JP2019171910A JP6817648B1 JP 6817648 B1 JP6817648 B1 JP 6817648B1 JP 2019171910 A JP2019171910 A JP 2019171910A JP 2019171910 A JP2019171910 A JP 2019171910A JP 6817648 B1 JP6817648 B1 JP 6817648B1
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JP
Japan
Prior art keywords
electronic component
component holding
displacement
swivel
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019171910A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021050046A (ja
Inventor
正一 永里
正一 永里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ueno Seiki Co Ltd
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Priority to JP2019171910A priority Critical patent/JP6817648B1/ja
Priority to CN202080007027.7A priority patent/CN113196896B/zh
Priority to SG11202106623QA priority patent/SG11202106623QA/en
Priority to MYPI2021003251A priority patent/MY192594A/en
Priority to PCT/JP2020/035053 priority patent/WO2021054354A1/ja
Priority to TW109132035A priority patent/TWI746170B/zh
Application granted granted Critical
Publication of JP6817648B1 publication Critical patent/JP6817648B1/ja
Publication of JP2021050046A publication Critical patent/JP2021050046A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Specific Conveyance Elements (AREA)
  • Manipulator (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2019171910A 2019-09-20 2019-09-20 電子部品の処理装置 Active JP6817648B1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019171910A JP6817648B1 (ja) 2019-09-20 2019-09-20 電子部品の処理装置
CN202080007027.7A CN113196896B (zh) 2019-09-20 2020-09-16 电子零件处理装置
SG11202106623QA SG11202106623QA (en) 2019-09-20 2020-09-16 Processing device of electronic component
MYPI2021003251A MY192594A (en) 2019-09-20 2020-09-16 Processing device of electronic component
PCT/JP2020/035053 WO2021054354A1 (ja) 2019-09-20 2020-09-16 電子部品の処理装置
TW109132035A TWI746170B (zh) 2019-09-20 2020-09-17 電子零件的處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019171910A JP6817648B1 (ja) 2019-09-20 2019-09-20 電子部品の処理装置

Publications (2)

Publication Number Publication Date
JP6817648B1 true JP6817648B1 (ja) 2021-01-20
JP2021050046A JP2021050046A (ja) 2021-04-01

Family

ID=74164645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019171910A Active JP6817648B1 (ja) 2019-09-20 2019-09-20 電子部品の処理装置

Country Status (6)

Country Link
JP (1) JP6817648B1 (zh)
CN (1) CN113196896B (zh)
MY (1) MY192594A (zh)
SG (1) SG11202106623QA (zh)
TW (1) TWI746170B (zh)
WO (1) WO2021054354A1 (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2845161B2 (ja) * 1995-04-28 1999-01-13 ニチデン機械株式会社 コレット及びそれを用いたダイボンダ
US6269846B1 (en) * 1998-01-13 2001-08-07 Genetic Microsystems, Inc. Depositing fluid specimens on substrates, resulting ordered arrays, techniques for deposition of arrays
JP3817207B2 (ja) * 2002-08-21 2006-09-06 Ｔｄｋ株式会社 実装処理装置及び該実装処理装置の制御装置
JP5011720B2 (ja) * 2005-12-19 2012-08-29 シンフォニアテクノロジー株式会社 部品供給装置
TWI471971B (zh) * 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
CN103229610B (zh) * 2010-11-30 2016-01-20 上野精机株式会社 电子零件的保持装置、检查装置以及分类装置
JP5370949B1 (ja) * 2013-03-11 2013-12-18 アキム株式会社 ワーク搬送方法および装置
JP5828943B1 (ja) * 2014-08-11 2015-12-09 株式会社新川 電子部品の実装装置
JP6516132B1 (ja) * 2018-02-09 2019-05-22 上野精機株式会社 電子部品の処理装置

Also Published As

Publication number Publication date
TW202122331A (zh) 2021-06-16
TWI746170B (zh) 2021-11-11
WO2021054354A1 (ja) 2021-03-25
MY192594A (en) 2022-08-29
CN113196896A (zh) 2021-07-30
JP2021050046A (ja) 2021-04-01
CN113196896B (zh) 2022-08-23
SG11202106623QA (en) 2021-07-29

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