JP6814844B2 - 無電解銅めっき用組成物および基材上に銅を無電解めっきするための方法 - Google Patents

無電解銅めっき用組成物および基材上に銅を無電解めっきするための方法 Download PDF

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Publication number
JP6814844B2
JP6814844B2 JP2019103419A JP2019103419A JP6814844B2 JP 6814844 B2 JP6814844 B2 JP 6814844B2 JP 2019103419 A JP2019103419 A JP 2019103419A JP 2019103419 A JP2019103419 A JP 2019103419A JP 6814844 B2 JP6814844 B2 JP 6814844B2
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JP
Japan
Prior art keywords
electroless copper
copper plating
composition
ion
alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2019103419A
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English (en)
Japanese (ja)
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JP2019218627A (ja
JP2019218627A5 (https=
Inventor
アレホ・エム・リフシッツ・アッリビオ
パトリシア・ガンブレー
マイケル・リプシャッツ
フェン・リウ
キャサリン・ムルツァー
サラ・ウェン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
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Publication of JP2019218627A publication Critical patent/JP2019218627A/ja
Publication of JP2019218627A5 publication Critical patent/JP2019218627A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2019103419A 2018-06-15 2019-06-03 無電解銅めっき用組成物および基材上に銅を無電解めっきするための方法 Expired - Fee Related JP6814844B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862685351P 2018-06-15 2018-06-15
US62/685,351 2018-06-15

Publications (3)

Publication Number Publication Date
JP2019218627A JP2019218627A (ja) 2019-12-26
JP2019218627A5 JP2019218627A5 (https=) 2020-10-15
JP6814844B2 true JP6814844B2 (ja) 2021-01-20

Family

ID=66793926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019103419A Expired - Fee Related JP6814844B2 (ja) 2018-06-15 2019-06-03 無電解銅めっき用組成物および基材上に銅を無電解めっきするための方法

Country Status (6)

Country Link
US (1) US20190382900A1 (https=)
EP (1) EP3581678A1 (https=)
JP (1) JP6814844B2 (https=)
KR (1) KR20190142236A (https=)
CN (1) CN110607521B (https=)
TW (1) TW202000989A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
EP4234758A4 (en) * 2020-10-21 2024-06-19 Asahi Kasei Kabushiki Kaisha METHOD FOR PRODUCING A STRUCTURE WITH CONDUCTIVE PATTERNS
CN114959664A (zh) * 2021-02-24 2022-08-30 超特国际股份有限公司 用于化学电镀处理非导电区域的活化溶液及方法
CN113133225B (zh) * 2021-04-13 2021-10-26 广州皓悦新材料科技有限公司 一种用于多层板和hdi板的水平沉铜工艺
CN114774899A (zh) * 2022-04-28 2022-07-22 合肥工业大学 一种铜纳米晶薄膜材料及其制备方法和应用
CN115418632B (zh) * 2022-07-27 2023-11-17 深圳市富利特科技有限公司 一种适用于水平线设备的高速高延展性化学铜及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5204576B2 (ja) * 2007-09-04 2013-06-05 三菱製紙株式会社 無電解銅めっき液用添加剤及びそれを用いた無電解銅めっき液
JP5622678B2 (ja) * 2011-07-14 2014-11-12 石原ケミカル株式会社 イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴
JP6100178B2 (ja) * 2014-01-06 2017-03-22 四国化成工業株式会社 銅被膜形成剤および銅被膜の形成方法
US9869026B2 (en) * 2014-07-15 2018-01-16 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
KR20180034615A (ko) * 2015-07-30 2018-04-04 바스프 에스이 금속화를 위한 플라스틱 표면의 전처리 방법

Also Published As

Publication number Publication date
CN110607521A (zh) 2019-12-24
KR20190142236A (ko) 2019-12-26
EP3581678A1 (en) 2019-12-18
CN110607521B (zh) 2021-08-27
TW202000989A (zh) 2020-01-01
JP2019218627A (ja) 2019-12-26
US20190382900A1 (en) 2019-12-19

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