CN110607521B - 无电镀铜组合物和用于在基材上无电镀铜的方法 - Google Patents

无电镀铜组合物和用于在基材上无电镀铜的方法 Download PDF

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Publication number
CN110607521B
CN110607521B CN201910495188.4A CN201910495188A CN110607521B CN 110607521 B CN110607521 B CN 110607521B CN 201910495188 A CN201910495188 A CN 201910495188A CN 110607521 B CN110607521 B CN 110607521B
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CN
China
Prior art keywords
electroless copper
copper plating
plating
methylimidazolium
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201910495188.4A
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English (en)
Chinese (zh)
Other versions
CN110607521A (zh
Inventor
A·M·里夫希茨阿莱比奥
P·冈布利
M·利普舒兹
F·刘
C·穆尔泽
S·文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
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Publication of CN110607521A publication Critical patent/CN110607521A/zh
Application granted granted Critical
Publication of CN110607521B publication Critical patent/CN110607521B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CN201910495188.4A 2018-06-15 2019-06-06 无电镀铜组合物和用于在基材上无电镀铜的方法 Expired - Fee Related CN110607521B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862685351P 2018-06-15 2018-06-15
US62/685351 2018-06-15

Publications (2)

Publication Number Publication Date
CN110607521A CN110607521A (zh) 2019-12-24
CN110607521B true CN110607521B (zh) 2021-08-27

Family

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Family Applications (1)

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CN201910495188.4A Expired - Fee Related CN110607521B (zh) 2018-06-15 2019-06-06 无电镀铜组合物和用于在基材上无电镀铜的方法

Country Status (6)

Country Link
US (1) US20190382900A1 (https=)
EP (1) EP3581678A1 (https=)
JP (1) JP6814844B2 (https=)
KR (1) KR20190142236A (https=)
CN (1) CN110607521B (https=)
TW (1) TW202000989A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
EP4234758A4 (en) * 2020-10-21 2024-06-19 Asahi Kasei Kabushiki Kaisha METHOD FOR PRODUCING A STRUCTURE WITH CONDUCTIVE PATTERNS
CN114959664A (zh) * 2021-02-24 2022-08-30 超特国际股份有限公司 用于化学电镀处理非导电区域的活化溶液及方法
CN113133225B (zh) * 2021-04-13 2021-10-26 广州皓悦新材料科技有限公司 一种用于多层板和hdi板的水平沉铜工艺
CN114774899A (zh) * 2022-04-28 2022-07-22 合肥工业大学 一种铜纳米晶薄膜材料及其制备方法和应用
CN115418632B (zh) * 2022-07-27 2023-11-17 深圳市富利特科技有限公司 一种适用于水平线设备的高速高延展性化学铜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013023693A (ja) * 2011-07-14 2013-02-04 Ishihara Chem Co Ltd イミダゾール環結合型オキシアルキレン化合物及び当該化合物を含有するメッキ浴
JP2015129318A (ja) * 2014-01-06 2015-07-16 四国化成工業株式会社 銅被膜形成剤および銅被膜の形成方法
CN105274591A (zh) * 2014-07-15 2016-01-27 罗门哈斯电子材料有限责任公司 无电极铜电镀组合物
CN108138323A (zh) * 2015-07-30 2018-06-08 巴斯夫欧洲公司 用于金属化的塑料表面的预处理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5204576B2 (ja) * 2007-09-04 2013-06-05 三菱製紙株式会社 無電解銅めっき液用添加剤及びそれを用いた無電解銅めっき液

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013023693A (ja) * 2011-07-14 2013-02-04 Ishihara Chem Co Ltd イミダゾール環結合型オキシアルキレン化合物及び当該化合物を含有するメッキ浴
JP2015129318A (ja) * 2014-01-06 2015-07-16 四国化成工業株式会社 銅被膜形成剤および銅被膜の形成方法
CN105274591A (zh) * 2014-07-15 2016-01-27 罗门哈斯电子材料有限责任公司 无电极铜电镀组合物
CN108138323A (zh) * 2015-07-30 2018-06-08 巴斯夫欧洲公司 用于金属化的塑料表面的预处理方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
离子液体 1-乙基-3-甲基咪唑四氟硼酸盐对化学镀铜的影响;高琼等;《电镀与精饰》;20120515;第34卷(第5期);第2页"1.1实验方法和流程"部分 *
高琼等.离子液体 1-乙基-3-甲基咪唑四氟硼酸盐对化学镀铜的影响.《电镀与精饰》.2012,第34卷(第5期),第1-4页. *

Also Published As

Publication number Publication date
CN110607521A (zh) 2019-12-24
KR20190142236A (ko) 2019-12-26
EP3581678A1 (en) 2019-12-18
TW202000989A (zh) 2020-01-01
JP2019218627A (ja) 2019-12-26
JP6814844B2 (ja) 2021-01-20
US20190382900A1 (en) 2019-12-19

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