KR20190142236A - 무전해 구리 도금 조성물 및 기판에 구리를 무전해 도금하는 방법 - Google Patents

무전해 구리 도금 조성물 및 기판에 구리를 무전해 도금하는 방법 Download PDF

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Publication number
KR20190142236A
KR20190142236A KR1020190069942A KR20190069942A KR20190142236A KR 20190142236 A KR20190142236 A KR 20190142236A KR 1020190069942 A KR1020190069942 A KR 1020190069942A KR 20190069942 A KR20190069942 A KR 20190069942A KR 20190142236 A KR20190142236 A KR 20190142236A
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KR
South Korea
Prior art keywords
electroless copper
copper plating
electroless
plating
alkyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020190069942A
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English (en)
Korean (ko)
Inventor
엠. 리프시츠 아리비오 알레호
검블리 패트리샤
립슈츠 마이클
리우 펭
물저 캐서린
웬 사라
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 filed Critical 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
Publication of KR20190142236A publication Critical patent/KR20190142236A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
KR1020190069942A 2018-06-15 2019-06-13 무전해 구리 도금 조성물 및 기판에 구리를 무전해 도금하는 방법 Withdrawn KR20190142236A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862685351P 2018-06-15 2018-06-15
US62/685,351 2018-06-15

Publications (1)

Publication Number Publication Date
KR20190142236A true KR20190142236A (ko) 2019-12-26

Family

ID=66793926

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190069942A Withdrawn KR20190142236A (ko) 2018-06-15 2019-06-13 무전해 구리 도금 조성물 및 기판에 구리를 무전해 도금하는 방법

Country Status (6)

Country Link
US (1) US20190382900A1 (https=)
EP (1) EP3581678A1 (https=)
JP (1) JP6814844B2 (https=)
KR (1) KR20190142236A (https=)
CN (1) CN110607521B (https=)
TW (1) TW202000989A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
EP4234758A4 (en) * 2020-10-21 2024-06-19 Asahi Kasei Kabushiki Kaisha METHOD FOR PRODUCING A STRUCTURE WITH CONDUCTIVE PATTERNS
CN114959664A (zh) * 2021-02-24 2022-08-30 超特国际股份有限公司 用于化学电镀处理非导电区域的活化溶液及方法
CN113133225B (zh) * 2021-04-13 2021-10-26 广州皓悦新材料科技有限公司 一种用于多层板和hdi板的水平沉铜工艺
CN114774899A (zh) * 2022-04-28 2022-07-22 合肥工业大学 一种铜纳米晶薄膜材料及其制备方法和应用
CN115418632B (zh) * 2022-07-27 2023-11-17 深圳市富利特科技有限公司 一种适用于水平线设备的高速高延展性化学铜及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5204576B2 (ja) * 2007-09-04 2013-06-05 三菱製紙株式会社 無電解銅めっき液用添加剤及びそれを用いた無電解銅めっき液
JP5622678B2 (ja) * 2011-07-14 2014-11-12 石原ケミカル株式会社 イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴
JP6100178B2 (ja) * 2014-01-06 2017-03-22 四国化成工業株式会社 銅被膜形成剤および銅被膜の形成方法
US9869026B2 (en) * 2014-07-15 2018-01-16 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
KR20180034615A (ko) * 2015-07-30 2018-04-04 바스프 에스이 금속화를 위한 플라스틱 표면의 전처리 방법

Also Published As

Publication number Publication date
CN110607521A (zh) 2019-12-24
EP3581678A1 (en) 2019-12-18
CN110607521B (zh) 2021-08-27
TW202000989A (zh) 2020-01-01
JP2019218627A (ja) 2019-12-26
JP6814844B2 (ja) 2021-01-20
US20190382900A1 (en) 2019-12-19

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Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20190613

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Patent event code: PA02012R01D

Patent event date: 20190613

Comment text: Request for Examination of Application

PG1501 Laying open of application
PC1202 Submission of document of withdrawal before decision of registration

Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment)

Patent event code: PC12021R01D

Patent event date: 20200407

WITB Written withdrawal of application