TW202000989A - 無電鍍銅組成物及用於在基材上無電鍍銅之方法 - Google Patents

無電鍍銅組成物及用於在基材上無電鍍銅之方法 Download PDF

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Publication number
TW202000989A
TW202000989A TW108119024A TW108119024A TW202000989A TW 202000989 A TW202000989 A TW 202000989A TW 108119024 A TW108119024 A TW 108119024A TW 108119024 A TW108119024 A TW 108119024A TW 202000989 A TW202000989 A TW 202000989A
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TW
Taiwan
Prior art keywords
electroless copper
composition
plating
copper
electroless
Prior art date
Application number
TW108119024A
Other languages
English (en)
Chinese (zh)
Inventor
艾萊霍M 利夫希茲阿里比歐
帕特里夏 岡布利
麥克 利普舒茲
風 劉
凱瑟琳 默勒
莎拉 溫
Original Assignee
美商羅門哈斯電子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商羅門哈斯電子材料有限公司 filed Critical 美商羅門哈斯電子材料有限公司
Publication of TW202000989A publication Critical patent/TW202000989A/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW108119024A 2018-06-15 2019-05-31 無電鍍銅組成物及用於在基材上無電鍍銅之方法 TW202000989A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862685351P 2018-06-15 2018-06-15
US62/685351 2018-06-15

Publications (1)

Publication Number Publication Date
TW202000989A true TW202000989A (zh) 2020-01-01

Family

ID=66793926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119024A TW202000989A (zh) 2018-06-15 2019-05-31 無電鍍銅組成物及用於在基材上無電鍍銅之方法

Country Status (6)

Country Link
US (1) US20190382900A1 (https=)
EP (1) EP3581678A1 (https=)
JP (1) JP6814844B2 (https=)
KR (1) KR20190142236A (https=)
CN (1) CN110607521B (https=)
TW (1) TW202000989A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793798B (zh) * 2020-10-21 2023-02-21 日商旭化成股份有限公司 附導電性圖案之構造體的製造方法及導電性圖案構造體的製造套組

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
CN114959664A (zh) * 2021-02-24 2022-08-30 超特国际股份有限公司 用于化学电镀处理非导电区域的活化溶液及方法
CN113133225B (zh) * 2021-04-13 2021-10-26 广州皓悦新材料科技有限公司 一种用于多层板和hdi板的水平沉铜工艺
CN114774899A (zh) * 2022-04-28 2022-07-22 合肥工业大学 一种铜纳米晶薄膜材料及其制备方法和应用
CN115418632B (zh) * 2022-07-27 2023-11-17 深圳市富利特科技有限公司 一种适用于水平线设备的高速高延展性化学铜及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5204576B2 (ja) * 2007-09-04 2013-06-05 三菱製紙株式会社 無電解銅めっき液用添加剤及びそれを用いた無電解銅めっき液
JP5622678B2 (ja) * 2011-07-14 2014-11-12 石原ケミカル株式会社 イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴
JP6100178B2 (ja) * 2014-01-06 2017-03-22 四国化成工業株式会社 銅被膜形成剤および銅被膜の形成方法
US9869026B2 (en) * 2014-07-15 2018-01-16 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
KR20180034615A (ko) * 2015-07-30 2018-04-04 바스프 에스이 금속화를 위한 플라스틱 표면의 전처리 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793798B (zh) * 2020-10-21 2023-02-21 日商旭化成股份有限公司 附導電性圖案之構造體的製造方法及導電性圖案構造體的製造套組

Also Published As

Publication number Publication date
CN110607521A (zh) 2019-12-24
KR20190142236A (ko) 2019-12-26
EP3581678A1 (en) 2019-12-18
CN110607521B (zh) 2021-08-27
JP2019218627A (ja) 2019-12-26
JP6814844B2 (ja) 2021-01-20
US20190382900A1 (en) 2019-12-19

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