JP2019218627A5 - - Google Patents
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- Publication number
- JP2019218627A5 JP2019218627A5 JP2019103419A JP2019103419A JP2019218627A5 JP 2019218627 A5 JP2019218627 A5 JP 2019218627A5 JP 2019103419 A JP2019103419 A JP 2019103419A JP 2019103419 A JP2019103419 A JP 2019103419A JP 2019218627 A5 JP2019218627 A5 JP 2019218627A5
- Authority
- JP
- Japan
- Prior art keywords
- ion
- ions
- halide
- hydride
- trifluoromethanesulfonyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862685351P | 2018-06-15 | 2018-06-15 | |
| US62/685,351 | 2018-06-15 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019218627A JP2019218627A (ja) | 2019-12-26 |
| JP2019218627A5 true JP2019218627A5 (https=) | 2020-10-15 |
| JP6814844B2 JP6814844B2 (ja) | 2021-01-20 |
Family
ID=66793926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019103419A Expired - Fee Related JP6814844B2 (ja) | 2018-06-15 | 2019-06-03 | 無電解銅めっき用組成物および基材上に銅を無電解めっきするための方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190382900A1 (https=) |
| EP (1) | EP3581678A1 (https=) |
| JP (1) | JP6814844B2 (https=) |
| KR (1) | KR20190142236A (https=) |
| CN (1) | CN110607521B (https=) |
| TW (1) | TW202000989A (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190382901A1 (en) * | 2018-06-15 | 2019-12-19 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10590541B2 (en) * | 2018-06-15 | 2020-03-17 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
| EP4234758A4 (en) * | 2020-10-21 | 2024-06-19 | Asahi Kasei Kabushiki Kaisha | METHOD FOR PRODUCING A STRUCTURE WITH CONDUCTIVE PATTERNS |
| CN114959664A (zh) * | 2021-02-24 | 2022-08-30 | 超特国际股份有限公司 | 用于化学电镀处理非导电区域的活化溶液及方法 |
| CN113133225B (zh) * | 2021-04-13 | 2021-10-26 | 广州皓悦新材料科技有限公司 | 一种用于多层板和hdi板的水平沉铜工艺 |
| CN114774899A (zh) * | 2022-04-28 | 2022-07-22 | 合肥工业大学 | 一种铜纳米晶薄膜材料及其制备方法和应用 |
| CN115418632B (zh) * | 2022-07-27 | 2023-11-17 | 深圳市富利特科技有限公司 | 一种适用于水平线设备的高速高延展性化学铜及其制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5204576B2 (ja) * | 2007-09-04 | 2013-06-05 | 三菱製紙株式会社 | 無電解銅めっき液用添加剤及びそれを用いた無電解銅めっき液 |
| JP5622678B2 (ja) * | 2011-07-14 | 2014-11-12 | 石原ケミカル株式会社 | イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴 |
| JP6100178B2 (ja) * | 2014-01-06 | 2017-03-22 | 四国化成工業株式会社 | 銅被膜形成剤および銅被膜の形成方法 |
| US9869026B2 (en) * | 2014-07-15 | 2018-01-16 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
| KR20180034615A (ko) * | 2015-07-30 | 2018-04-04 | 바스프 에스이 | 금속화를 위한 플라스틱 표면의 전처리 방법 |
-
2019
- 2019-05-01 US US16/400,347 patent/US20190382900A1/en not_active Abandoned
- 2019-05-31 TW TW108119024A patent/TW202000989A/zh unknown
- 2019-06-03 JP JP2019103419A patent/JP6814844B2/ja not_active Expired - Fee Related
- 2019-06-06 CN CN201910495188.4A patent/CN110607521B/zh not_active Expired - Fee Related
- 2019-06-07 EP EP19179174.8A patent/EP3581678A1/en not_active Withdrawn
- 2019-06-13 KR KR1020190069942A patent/KR20190142236A/ko not_active Withdrawn
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