JP6808839B2 - 基板保持装置、基板保持方法及び成膜装置 - Google Patents
基板保持装置、基板保持方法及び成膜装置 Download PDFInfo
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- JP6808839B2 JP6808839B2 JP2019535965A JP2019535965A JP6808839B2 JP 6808839 B2 JP6808839 B2 JP 6808839B2 JP 2019535965 A JP2019535965 A JP 2019535965A JP 2019535965 A JP2019535965 A JP 2019535965A JP 6808839 B2 JP6808839 B2 JP 6808839B2
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- support
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- Prior art date
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- 239000000758 substrate Substances 0.000 title claims description 263
- 238000000034 method Methods 0.000 title claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 60
- 230000003028 elevating effect Effects 0.000 claims description 28
- 230000001174 ascending effect Effects 0.000 claims description 13
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims 2
- 238000003780 insertion Methods 0.000 description 15
- 230000037431 insertion Effects 0.000 description 15
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000013077 target material Substances 0.000 description 5
- 230000004323 axial length Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005478 sputtering type Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018075870 | 2018-04-11 | ||
| JP2018075870 | 2018-04-11 | ||
| PCT/JP2019/013780 WO2019198537A1 (ja) | 2018-04-11 | 2019-03-28 | 基板保持装置、基板保持方法及び成膜装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2019198537A1 JPWO2019198537A1 (ja) | 2020-04-30 |
| JP6808839B2 true JP6808839B2 (ja) | 2021-01-06 |
Family
ID=68162928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019535965A Active JP6808839B2 (ja) | 2018-04-11 | 2019-03-28 | 基板保持装置、基板保持方法及び成膜装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6808839B2 (zh) |
| CN (1) | CN111373523B (zh) |
| TW (1) | TWI778250B (zh) |
| WO (1) | WO2019198537A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7438018B2 (ja) * | 2020-05-11 | 2024-02-26 | 東京エレクトロン株式会社 | 基板載置方法及び基板載置機構 |
| JP7361080B2 (ja) * | 2021-08-31 | 2023-10-13 | キヤノントッキ株式会社 | 基板昇降装置及び成膜装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06132383A (ja) * | 1992-10-21 | 1994-05-13 | Shibaura Eng Works Co Ltd | 基板用ホルダーの位置決め機構 |
| CN100435312C (zh) * | 2003-11-27 | 2008-11-19 | 株式会社日立国际电气 | 基板处理装置、基板保持器、和半导体装置的制造方法 |
| JP4098283B2 (ja) * | 2004-07-30 | 2008-06-11 | 株式会社アルバック | スパッタリング装置 |
| CN201186950Y (zh) * | 2008-02-03 | 2009-01-28 | 北儒精密股份有限公司 | 基板载具 |
| JP2009280381A (ja) * | 2008-05-26 | 2009-12-03 | Panasonic Corp | ディスプレイパネル製造用搬送プレートおよびディスプレイパネル製造方法 |
| JP6151925B2 (ja) * | 2013-02-06 | 2017-06-21 | ヤマハ発動機株式会社 | 基板固定装置、基板作業装置および基板固定方法 |
| JP6064684B2 (ja) * | 2013-03-05 | 2017-01-25 | 三星ダイヤモンド工業株式会社 | 基板処理システムおよび基板反転装置 |
| KR101981182B1 (ko) * | 2014-12-05 | 2019-05-22 | 가부시키가이샤 알박 | 기판 감시장치 및 기판 감시방법 |
-
2019
- 2019-03-28 CN CN201980005899.7A patent/CN111373523B/zh active Active
- 2019-03-28 WO PCT/JP2019/013780 patent/WO2019198537A1/ja active Application Filing
- 2019-03-28 JP JP2019535965A patent/JP6808839B2/ja active Active
- 2019-04-10 TW TW108112428A patent/TWI778250B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI778250B (zh) | 2022-09-21 |
| JPWO2019198537A1 (ja) | 2020-04-30 |
| WO2019198537A1 (ja) | 2019-10-17 |
| CN111373523B (zh) | 2023-09-08 |
| CN111373523A (zh) | 2020-07-03 |
| TW201944526A (zh) | 2019-11-16 |
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