JP6808839B2 - Substrate holding device, substrate holding method and film forming device - Google Patents

Description

The present invention relates to a substrate holding device, a substrate holding method, and a film forming apparatus capable of erecting a substrate from a horizontal posture to a vertical posture.

As a film forming apparatus, a vertical sputtering apparatus that forms a predetermined film on the surface of a glass substrate that stands upright in the vertical direction is known. This type of sputtering apparatus generally includes a film forming chamber having a target arranged in the vertical direction and a substrate holding mechanism capable of erecting the substrate from a horizontal posture to a vertical posture in the film forming chamber. is there.

For example, Patent Document 1 describes a substrate holding plate on which a substrate horizontally carried into a film forming chamber is placed, a substrate clamping mechanism for clamping a substrate placed on the substrate holding plate, and a rotating mechanism for erecting the substrate holding plate. A sputtering apparatus having the above is disclosed.

Japanese Unexamined Patent Publication No. 2004-332117

In recent years, from the viewpoint of improving productivity, the development of a sputtering apparatus capable of simultaneously performing a film forming process on a plurality of substrates has been promoted. Therefore, there is a need for a technique capable of stably standing a plurality of substrates from a horizontal posture to a vertical posture while appropriately holding each of the plurality of substrates.

In view of the above circumstances, an object of the present invention is to provide a substrate holding device, a substrate holding method, and a film forming apparatus capable of stably holding a plurality of substrates in a vertical posture.

In order to achieve the above object, the substrate holding device according to one embodiment of the present invention includes a substrate support and a clamp mechanism.
The substrate support base has a support surface and a rotation mechanism portion. The support surface has a plurality of support regions on which a plurality of substrates are individually arranged. The rotation mechanism portion is configured so that the support surface can be erected from a horizontal posture to a vertical posture around an axis parallel to the support surface.
The clamp mechanism has a plurality of clamp portions. The plurality of clamp portions are arranged along the periphery of the plurality of support regions, and are configured to be able to hold peripheral portions of the plurality of substrates. The plurality of clamp portions include a plurality of first clamp portions that are arranged in a gap region between the plurality of support regions and can individually hold peripheral portions of the plurality of substrates.

In the substrate holding mechanism, since the plurality of clamp portions include the plurality of first clamp portions arranged in the gap region between the plurality of support regions, the plurality of substrates while appropriately maintaining the device positions between the substrates. Can be stably held in a vertical posture.

The plurality of support regions may include at least two support regions that are vertically adjacent to each other when the substrate support is in a vertical position.

The plurality of clamp portions may further include a plurality of second clamp portions and a plurality of third clamp portions arranged in a peripheral region around the plurality of support regions excluding the gap region.
The plurality of first and second clamp portions have hook portions facing the peripheral edges of the plurality of substrates with a movement substantially parallel to the support surface.
The plurality of third clamp portions have hook portions facing the peripheral edges of the plurality of substrates with a movement of approaching the support surface from above the support surface.
According to the above configuration, the substrate can be held with a predetermined alignment accuracy with respect to the support surface by the first and second clamp portions, and the flatness of the substrate can be ensured by the third clamp portion.

The plurality of first and second clamp portions may further have a rotational support portion that rotatably supports the hook portion along a curved trajectory having a constant curvature toward the clamp position.
On the other hand, the plurality of third clamp portions move along a curved trajectory having a maximum height from the support surface larger than the plurality of first and second clamp portions with the hook portions directed to the clamp positions. It may further have a link mechanism portion that supports it as possible.

The plurality of first to third clamp portions may further have an urging member for urging the hook portion to the clamp position.

The clamp mechanism holds the peripheral edges of the plurality of substrates by the plurality of first clamp portions and the plurality of second clamp portions, and then holds the peripheral edges of the plurality of substrates by the plurality of third clamp portions. It may be configured to do so.
As a result, the substrate can be appropriately held on the support surface even when the substrate is warped.

As the plurality of substrates, a glass substrate having a rectangular planar shape is typically used. In this case, the plurality of third clamp portions may be arranged at positions closer to the corner portions of the plurality of substrates than the plurality of first clamp portions and the plurality of second clamp portions.
By arranging the third clamp portion at the corner portion of the substrate where warpage or the like is relatively likely to occur, the substrate can be properly held.

The clamp mechanism may further include a drive unit capable of moving the plurality of clamp portions from a clamp position to a non-clamp position when the substrate support is in a horizontal posture.
The drive unit has a first base member and a first elevating unit.
The first base member has a plurality of operating shafts arranged corresponding to the plurality of clamp portions.
The first elevating unit has an ascending position for setting the plurality of clamp portions to the non-clamping position by pushing up the plurality of clamp portions with the plurality of operating shafts, and the plurality of clamp portions with the plurality of operating shafts. By releasing the push-up of the first base member, the first base member is moved up and down between the lowering position where the plurality of clamp portions are set at the clamp position.

The drive unit may further include a second base member and a second elevating unit.
The second base member is arranged parallel to the first base member and has a plurality of support pins capable of penetrating the support surface.
The second elevating unit has an ascending position in which the back surfaces of the plurality of substrates are supported by the plurality of support pins, and a descending position in which the plurality of substrates supported by the plurality of support pins are arranged on the support surface. The second base member is raised and lowered during the period.

The substrate support may further have a suction portion. The suction portion is provided on the support surface and is configured to be capable of electrostatically sucking the plurality of substrates.

The substrate holding method according to one embodiment of the present invention is
The substrates are individually placed in multiple support areas on the support surface maintained in a horizontal position.
The intermediate region between the plurality of support regions and the peripheral region of the plurality of support regions excluding the intermediate region are respectively arranged, and the peripheral portion of the substrate is provided with a movement substantially parallel to the support surface. The substrate is held by a plurality of clamp portions having the first hook portions facing each other.
The substrate is held by a plurality of clamp portions arranged in the peripheral region and having a second hook portion facing the peripheral edge portion of the substrate with a movement of approaching the support surface from above the support surface.
The support surface is erected from a horizontal posture to a vertical posture.

The film forming apparatus according to one embodiment of the present invention includes a film forming chamber, a substrate support, and a clamp mechanism.
The film forming chamber has a film forming source.
The substrate support is arranged in the film forming chamber. The substrate support can have a support surface having a plurality of support regions in which a plurality of substrates are individually arranged, and the support surface can be erected from a horizontal posture to a vertical posture around an axis parallel to the support surface. It has a rotation mechanism unit.
The clamp mechanism has a plurality of clamp portions. The plurality of clamp portions are arranged along the periphery of the plurality of support regions, and are configured to be able to hold peripheral portions of the plurality of substrates. The plurality of clamp portions include a plurality of first clamp portions that are arranged in a gap region between the plurality of support regions and can individually hold peripheral portions of the plurality of substrates.

As described above, according to the present invention, a plurality of substrates can be stably held in a vertical posture.

It is a schematic perspective view which shows the structure of the substrate holding apparatus which concerns on one Embodiment of this invention. It is a schematic side view of the film forming apparatus provided with the said substrate holding apparatus. It is a top view of the substrate support in the said substrate holding apparatus. It is sectional drawing of the main part of the substrate support which shows the structure of the 1st and 2nd clamp portions in the said substrate holding apparatus. It is sectional drawing of the main part of the substrate support which shows the structure of the 3rd clamp part in the said substrate holding apparatus. It is a perspective view of the drive part in the said substrate holding device. It is a top view of the drive part. FIG. 8 is a side view showing an example of the operation. It is a side view which shows an example of the operation of the said drive part. It is a side view of the main part of the support pin in the said substrate holding device. It is a side view of the main part of the positioning pin in the said substrate holding device. It is sectional drawing of the main part of the substrate support which shows the structure of the suction part in the said substrate holding apparatus.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a schematic perspective view showing a configuration of a substrate holding device according to an embodiment of the present invention, and FIG. 2 is a schematic side view of a film forming apparatus provided with the substrate holding device.
In the figure, the X-axis, the Y-axis, and the Z-axis show three directions orthogonal to each other, the X-axis and the Y-axis correspond to the horizontal direction (horizontal direction), and the Z-axis corresponds to the vertical direction (vertical direction). ..

[overall structure]
The substrate holding device 100 of the present embodiment includes a substrate support base 10 having a support surface 10s capable of supporting a plurality of substrates. The substrate support base 10 has a housing 11, a platen 12 having a support surface 10s formed on the upper surface, and a rotation mechanism portion 13 that rotatably supports the platen 12 with respect to the housing 11. The substrate holding device 100 is configured to support two glass substrates W1 and W2 as a plurality of substrates and to hold the respective substrates W1 and W2 on the support surface 10s via a clamp mechanism described later. To.

The substrate support base 10 is configured so that the platen 12 (support surface 10s) can be erected from the horizontal posture shown in FIG. 2A to the vertical posture shown in FIG. 2B via the rotation mechanism unit 13. The rotation mechanism unit 13 has a rotation shaft 131 parallel to the Y-axis direction, and a drive source 132 that rotates the platen 12 around the rotation shaft 131 between a horizontal posture and a vertical posture. The housing 11 accommodates a drive unit 50 (see FIGS. 2B, 6 to 8) that forms a part of the clamp mechanism.

The film forming apparatus 200 includes a substrate holding device 100, a film forming chamber 210, and a controller 90 that controls these in an integrated manner.
The substrate holding device 100 is installed inside the film forming chamber 210 as shown in FIGS. 2A and 2B. The film forming chamber 210 is configured as a sputtering chamber, and has a vacuum chamber 211 and a target unit 212 as a film forming source installed inside the vacuum chamber 211.

The vacuum chamber 211 is connected to a vacuum exhaust line (not shown), and is configured to be able to exhaust or maintain the inside in a predetermined depressurized atmosphere. The target unit 212 includes a target material made of a material to be formed and a backing plate that supports the target material, and further includes a magnetic circuit that forms a magnetic field on the surface of the target material in the case of the magnetron sputtering method. Although not shown, the film forming chamber 210 further carries in a gas introduction line for introducing a sputtering gas or a reactive gas into the vacuum chamber 211, a power supply line for supplying predetermined power to the target unit 212, and substrates W1 and W2. It also has a gate valve for carrying out.

The target unit 212 is vertically arranged so that the surface of the target material is parallel to the YZ plane, and faces the support surface 10s of the platen 12 whose posture has been changed to the upright position in the X-axis direction at a predetermined interval. .. The target material typically has an area larger than the support surface 10s. In the film forming apparatus 200, a predetermined film forming process is performed on the substrates W1 and W2 on the support surface 10s in a state where the platen 12 is erected so that one substrate W1 is on the lower side and the other substrate W2 is on the upper side. Is configured to be possible. A mask member (not shown) that defines a film-forming region of the substrates W1 and W2 may be installed in the film-forming chamber 210.

The substrates W1 and W2 are typically rectangular glass substrates, but are not limited to these, and may be ceramic substrates, resin substrates, or metal substrates other than glass. Various functional layers including a metal layer and an insulating layer may be formed in advance on the film-forming surfaces of the substrates W1 and W2. The substrate size is not particularly limited and can be appropriately set according to the size of the support surface 10s and the number of processed sheets. For example, a substrate having a size half that of G6 size (1850 mm × 1500 mm) is used.

[Board support]
FIG. 3 is a plan view of the substrate support base 10.

The support surface 10s has a rectangular planar shape and is typically formed of a flat surface. The support surface 10s is made of a metal material such as copper, aluminum, or stainless steel. The support surface 10s may be composed of a single plate material, or may be composed of an array of a plurality of plate materials. The support surface 10s may have a circulation passage or a heater inside which the refrigerant or the hot medium can circulate so that the substrates W1 and W2 can be cooled or heated to a predetermined temperature.

The support surface 10s has a plurality of (two in this example) support regions S1 and S2 in which a plurality of (two in this example) substrates W1 and W2 are individually arranged. The support areas S1 and S2 are laid out so that one side on each long side is adjacent to each other with a vertical interval when the platen 12 is in the vertical posture.

The support surface 10s further has an intermediate region 10M located between the support regions S1 and S2 and a peripheral region 10C (excluding the intermediate region 10M) located around the support regions S1 and S2. Each of the support areas S1 and S2 is provided with a plurality of first insertion holes V1 through which a plurality of support pins VP1 (see FIGS. 6 to 8) for raising and lowering the substrates W1 and W2 can be inserted with respect to the support surface 10s. ing. A plurality of second insertion holes V2 into which a plurality of positioning pins VP2 (see FIGS. 6 to 8) for positioning the substrates W1 and W2 with respect to the support surface 10s can be inserted are provided in the intermediate region 10M and the peripheral region 10C. Has been done.

The first insertion holes V1 are a plurality of insertion holes V11 formed in one support region S1 (three in this example) and a plurality of insertion holes V11 formed in the other support region S2 (three in this example). Includes an insertion hole V12. The second insertion holes V2 are a plurality of insertion holes V21 formed along the periphery of one support region S1 (10 in this example) and a plurality of insertion holes V21 formed along the periphery of the other support region S2. In the example, 10) insertion holes V22 are included. In the present embodiment, two insertion holes V21 and V22 are arranged on both long sides of the substrates W1 and W2, and three are arranged on both short sides of the substrates W1 and W2 (see FIG. 3).

[Clamp mechanism]
The substrate holding device 100 includes a clamp mechanism for holding the substrates W1 and W2 arranged on the support surface 10s. The clamp mechanism includes a plurality of clamp portions (first clamp portion C1, second clamp portion C2, and third clamp portion C3) arranged along the periphery of each of the support areas S1 and S2, and a drive for driving these clamp portions. It has a part 50 and. Each clamp portion is configured to be able to hold the peripheral portions of the substrates W1 and W2 on the support regions S1 and S2.

As shown in FIG. 3, the first clamp portion C1 is arranged in the intermediate region 10M between the two support regions S1 and S2. The second and third clamp portions C2 and C3 are arranged in the peripheral regions 10C around the support regions S1 and S2, respectively.

The first clamp portion C1 includes a plurality of clamp portions C11 capable of holding one side of the intermediate region 10M side of the substrate W1 arranged in the support region S1 and one of the intermediate region 10M side of the substrate W2 arranged in the support region S2. It is composed of a plurality of clamp portions C12 capable of holding the long side of the above. The positions and numbers of these clamp portions C11 and C12 are not particularly limited, and in the present embodiment, a total of two clamp portions C11 and a total of four clamp portions are located near both ends of one of the long sides of the substrates W1 and W2. Each C12 is arranged (see FIG. 3). Hereinafter, the clamp portions C11 and C12 are collectively referred to as the first clamp portion C1 unless they are described individually.

The second clamp portion C2 has a plurality of clamp portions C21 capable of holding three sides on the peripheral region 10C side of the substrate W1 arranged in the support region S1 and a peripheral region 10C side of the substrate W2 arranged in the support region S2. It is composed of a plurality of clamp portions C22 capable of holding three sides. The positions and numbers of the clamp portions C21 and C22 are not particularly limited, and in the present embodiment, two are each on the other long side of the substrates W1 and W2, and one is on both short sides of the substrates W1 and W2. They are arranged one by one (see FIG. 3). Hereinafter, the clamp portions C21 and C22 are collectively referred to as the second clamp portion C2, except for the cases described individually.

The third clamp portion C3 has a plurality of clamp portions C31 capable of holding three sides on the peripheral region 10C side of the substrate W1 arranged in the support region S1 and a peripheral region 10C side of the substrate W2 arranged in the support region S2. It is composed of a plurality of clamp portions C32 capable of holding three sides. The positions and numbers of the clamp portions C31 and C32 are not particularly limited, and in the present embodiment, one clamp portion is arranged in the vicinity of the corner portions (four corner portions) of the substrates W1 and W2 (see FIG. 3). Hereinafter, the clamp portions C31 and C32 are collectively referred to as a third clamp portion C3, except when individually described.

(1st and 2nd clamps)
The first and second clamp portions C1 (C11, C12) and C2 (C21, C22) have hook portions 21 facing the peripheral edges of the substrates W1 and W2 with a movement substantially parallel to the support surface 10s (FIG. 4). As a result, even when the substrates W1 and W2 are placed with respect to the support regions S1 and S2 with a misalignment, the substrates W1 and W2 are positioned in the process of the clamping operation by the first and second clamp portions C1 and C2. Since it can be moved in a direction in which the deviation is eliminated, a predetermined alignment accuracy of the substrates W1 and W2 is ensured at the time of clamping.

Here, the "movement substantially parallel to the support surface 10s" means not only the movement parallel to the support surface 10s but also the movement substantially parallel to the support surface 10s. Substantially parallel movements include movements of the hook portion 21 along a linear or curved trajectory.

FIG. 4 shows a configuration example of the first and second clamp portions C1 and C2. FIG. 4 is a cross-sectional view of a main part of the substrate support 10 showing the configurations of the first and second clamp portions C1 and C2.

As shown in FIG. 4, the first and second clamp portions C1 and C2 have a hook member 20 having a hook portion 21 protruding from the support surface 10s at the tip portion, and the hook portion 21 having a constant curvature toward the clamp position. Each has a rotation support portion 23 that supports the hook member 20 so that it can be rotated along a curved trajectory.

The hook member 20 is made of a metal plate material long in the Z-axis direction having a hook portion 21 and a base end portion 22. The hook portion 21 is formed by extending one end of a hook member 20 projecting from the support surface 10s to the support regions S1 and S2 via an opening 10g formed in the support surface 10s. The base end portion 22 is formed by extending the other end of the hook member 20 in the same direction as the hook portion 21. The hook member 20 is supported by the platen 12 via the rotation support portion 23, and can rotate from the clamp position to the non-clamp position by receiving a push-up operation of the operation shafts CP1 and CP2 (described later) with respect to the base end portion 22. It is composed.

The non-clamping position of the hook portion 21 is set to a position facing the peripheral edges of the substrates W1 and W2 on the support regions S1 and S2 in a direction parallel to the support surface 10s (see FIG. 4). As a result, the hook portion 21 can be moved to the clamp position facing the peripheral portions of the substrates W1 and W2 in the direction perpendicular to the support surface 10s with a movement substantially parallel to the support surface 10s.

The rotation support portion 23 has a rotation shaft 231 penetrating the hook member 20 and a connecting member 232 connecting the rotation shaft 231 and the platen 12, and the hook portion 21 has a clamp position shown by a solid line in FIG. , It is rotatably supported between the non-clamped position shown by the alternate long and short dash line in FIG. The position of the shaft support of the hook member 20 by the rotation support portion 23 is not particularly limited, but it is preferable that the rotation locus of the hook portion 21 is set to a position as parallel as possible to the support surface 10s. This makes it possible to finely adjust the positions of the substrates W1 and W2 in the process of moving the hook portion 21 to the clamp position while keeping the rotation angle range of the hook member 20 small.

At the clamp position, the hook portions 21 face each other with a slight gap directly above the peripheral edges of the substrates W1 and W2 mounted on the support regions S1 and S2, and can prevent the substrate W1 from being separated from the support surface 10s. , W2 is held. In the non-clamped position, the hook portion 21 retracts to the outside of the peripheral edges of the substrates W1 and W2 placed on the support regions S1 and S2 so as not to hinder the ascending / descending operation of the substrates W1 and W2 with respect to the support surface 10s. ..

The first and second clamp portions C1 and C2 further have an urging member 24 that urges the hook portion 21 to the clamp position. In the present embodiment, the urging member 24 is composed of a coil spring attached between the platen 12 and the hook member 20, but is not limited to this, and is attached around the rotation shaft 231 of the rotation support portion 23, for example. It may be composed of a vine winding spring or the like. Since the hook portion 21 is constantly urged to the clamp position by the urging member 24, the holding operation of the substrates W1 and W2 can be maintained regardless of the posture of the platen 12.

In the support areas S1 and S2, a plurality of protrusions 10d for supporting the substrates W1 and W2 at multiple points are installed. The position and number of the protrusions 10d are not particularly limited, but are typically arranged at positions offset from the clamp positions of the substrate W by the clamp portions C1 to C3. The protrusion 10d is for forming a predetermined gap between the back surfaces (non-deposited surface) of the substrates W1 and W2 and the support surface 10s, but may be omitted if necessary.

(3rd clamp part)
On the other hand, the third clamp portion C3 (C31, C32) has a hook portion 31 (see FIG. 5) facing the peripheral edges of the substrates W1 and W2 with a movement of approaching the support surface 10s from above the support surface 10s. .. As a result, even when the peripheral edges of the substrates W1 and W2 placed on the support regions S1 and S2 are warped, the warp of the peripheral edges can be corrected in the process of the clamping operation by the third clamp portion C3. Therefore, a high flatness of the peripheral portion is ensured at the time of clamping.

Warpage of the peripheral edges of the substrates W1 and W2 tends to occur more easily at the corners (four corners). Therefore, it is preferable that the third clamp portion C3 is arranged at a position closer to the corner portion of the substrates W1 and W2 than the first and second clamp portions C1 and C2.

A configuration example of the third clamp portion C3 is shown in FIG. FIG. 5 is a cross-sectional view of a main part of the substrate support 10 showing the configuration of the third clamp portion C3.

As shown in FIG. 5, the third clamp portion C3 has a hook member 30 having a hook portion 31 protruding from the support surface 10s at the tip portion, and the first and second clamp portions with the hook portion 31 directed to the clamp position. It has a link mechanism portion 33 that supports the hook member 30 so that it can be moved along a curved trajectory having a maximum height (h) from a support surface 10s larger than C1 and C2.

The hook member 30 is made of a metal plate material long in the Z-axis direction having a hook portion 31 and a base end portion 32. The hook portion 31 is formed by extending one end of a hook member 30 projecting from the support surface 10s through an opening 10g formed in the support surface 10s toward the support regions S1 and S2. The base end portion 32 is formed by extending the other end of the hook member 30 in the same direction as the hook portion 31. The hook member 30 is supported by the platen 12 via the link mechanism portion 33, and is configured to be movable from the clamp position to the non-clamp position by receiving a push-up operation of the operation shaft CP3 (described later) with respect to the base end portion 32. ..

Here, the height of the hook portion 31 from the support surface 10s at the non-clamp position of the third clamp portion C3 is the height from the support surface 10s of the hook portion 21 at the non-clamp position of the first and second clamp portions C1 and C2. It is set larger than the height (see FIGS. 4 and 5). As a result, the hook portion 31 can be moved toward the clamp position along a curved track having a maximum height (h) from the support surface 10s larger than the first and second clamp portions C1 and C2. As a result, the hook portion 31 can be moved to the clamp position facing the peripheral portions of the substrates W1 and W2 with the movement of approaching the support surface 10s from above the support surface 10s.

The link mechanism unit 33 has two link members 331 and 332, and is composed of a four-node rotation mechanism in which both ends of the link members 331 and 332 are rotatably connected to the platen 12 and the hook member 30. The link mechanism portion 33 movably supports the hook portion 31 between the clamp position shown by the solid line in FIG. 5 and the non-clamp position shown by the alternate long and short dash line in FIG. The positions and lengths of the link members 331 and 332 constituting the link mechanism portion 33 are not particularly limited, but the hook portion 31 is located directly above the peripheral edge portion at a position higher than the expected warp of the peripheral edge portions of the substrates W1 and W2. It is preferable to set the position and length so that it can pass through.

At the clamp position, the hook portions 31 face each other with a slight gap directly above the peripheral edges of the substrates W1 and W2 mounted on the support regions S1 and S2, and can prevent the substrate W1 from being separated from the support surface 10s. , W2 is held. In the non-clamped position, the hook portion 31 retracts to the outside of the peripheral edges of the substrates W1 and W2 placed on the support regions S1 and S2 so as not to hinder the ascending / descending operation of the substrates W1 and W2 with respect to the support surface 10s. ..

The third clamp portion C3 further includes an urging member 34 that urges the hook portion 31 to the clamp position. In the present embodiment, the urging member 24 is composed of a coil spring attached between the platen 12 and the hook member 20, but is not limited to this, and is attached around an arbitrary rotating shaft of the link mechanism portion 33, for example. It may be composed of a hanging winding spring or the like. Since the hook portion 31 is constantly urged to the clamp position by the urging member 34, the holding operation of the substrates W1 and W2 can be maintained regardless of the posture of the platen 12.

(Drive part)
Subsequently, the details of the drive unit 50 will be described. FIG. 6 is a perspective view of the drive unit 50, FIG. 7 is a plan view thereof, and FIG. 8 is a side view showing an example of the operation.

The drive unit 50 is configured to be able to move the first to third clamp units C1 to C3 from the clamp position to the non-clamp position when the platen 12 is in the horizontal posture. In the present embodiment, the drive unit 50 has a first base member 60 and a first elevating unit 65 as a drive device in the clamp mechanism.

The first base member 60 is housed in the housing 11 (see FIG. 1) and is installed at a position facing the platen 12 in the horizontal posture in the vertical direction. The first base member 60 has a plurality of operating shafts CP1, CP2, and CP3 arranged corresponding to the first clamp portion C1, the second clamp portion C2, and the third clamp portion C3, respectively. The operating shafts CP1 to CP3 are axial members erected parallel to the Z-axis direction on one main surface (upper surface) of the first base member 60, and in the present embodiment, the axial lengths of the operating shafts CP1 to CP3 are Each is the same.

The first base member 60 is composed of a metal frame having a rectangular planar shape having an opening 60a in the plane. The operation shafts CP1 to CP3 are arranged at positions facing the base end portions 22 and 32 of the hook members 20 and 30 forming the clamp portions C1 to C3 directly above them in the Z-axis direction. For example, the operation shaft CP1 corresponding to the first clamp portion C1 is arranged in an intermediate region extending inward from the central portion of each long side of the first base member 60, and corresponds to the second and third clamp portions. The operation shafts CP2 and CP3 are respectively arranged in the peripheral region 62 of the first base member 60.

The first elevating unit 65 is supported by the housing 11 and is configured to be able to elevate and elevate the first base member 60 with respect to the platen 12 in the Z-axis direction. The first elevating unit 65 is composed of a fluid pressure cylinder unit, a ball screw unit, and the like installed on the other main surface (lower surface) of the first base member 60. The number of the first elevating units 65 may be singular or plural (two in this example), and can be determined according to the size of the first base member 60 and the like.

The first elevating unit 65 is configured to be able to elevate and lower the first base member 60 between the ascending position shown in FIGS. 8B and 8C and the descending position shown in FIG. 8A. In the raised position, the operation shafts CP1 to CP3 push up the first to third clamp portions C1 to C3 to set the first to third clamp portions C1 to C3 to the non-clamp position. At the lowering position, the first to third clamp portions C1 to C3 are set to the clamp position by releasing the push-up of the first to third clamp portions C1 to C3 by the operation shafts CP1 to CP3.

Here, for example, if the holding operation by the third clamp portion C3 precedes in a state where the peripheral corner portions of the substrates W1 and W2 are warped, the substrates W1 and W2 act as a reaction of the warp correction operation by the third clamp portion C3. Other parts may be lifted, and the substrates W1 and W2 may not be properly held by the first and second clamp portions C1 and C2.

Therefore, the drive unit 50 in the present embodiment holds the peripheral edges of the substrates W1 and W2 by the first and second clamp portions C1 and C2, and then holds the peripheral edges of the substrates W1 and W2 by the third clamp portions C3. It is composed of. As a result, even when the peripheral edge corners of the substrates W1 and W2 are warped, all the clamp portions C1 to C3 can properly hold the peripheral edges of the substrates W1 and W2 with respect to the support surface 10s. It becomes.

The structure for realizing such a configuration is not particularly limited, and in the present embodiment, as shown in FIGS. 4 and 5, the base end of the hook member 20 constituting the first and second clamp portions C1 and C2. The portion 22 has a shape protruding downward (on the drive portion 50 side) from the base end portion 32 of the hook member 30 constituting the third clamp portion C3. As a result, when the first base member 60 moves from the ascending position to the descending position, the operating shaft CP1 required to move the hook portions 21 of the first and second clamp portions C1 and C2 from the non-clamping position to the clamping position. , The stroke amount H3 of the operation shaft CP3 (see FIG. 5) required to move the hook portion 31 of the third clamp portion C3 from the non-clamp position to the clamp position, rather than the stroke amount H1 of CP2 (see FIG. 4). Can be made larger.

[Board lifting mechanism]
The drive unit 50 further has a substrate elevating mechanism for elevating and lowering the substrates W1 and W2 with respect to the support surface 10s of the platen 12. That is, the drive unit 50 has a second base member 70 having a plurality of support pins VP1 capable of penetrating the support surface 10s, and a second elevating unit 75 for raising and lowering the second base member 70.

The second base member 70 has a substantially rectangular main plate 71 arranged in parallel with the first base member 60, and four sub-plates 72 arranged at the four corners of the main plate 71. In the present embodiment, the second base member 70 is arranged directly above the first base member 60 (see FIGS. 6 and 7). For ease of understanding, the second base member 70 is shown by an oblique line in FIG. 7.

Each sub-plate 72 is arranged parallel to the main plate 71, and is integrally fixed to the upper surfaces of the four corners of the main plate 71 via a connector having an appropriate height. The main plate 71 and the sub-plate 72 are located directly below the support surface 10s of the platen 12 in the horizontal posture, and the plurality of support pins VP1 are provided in the plurality of first insertion holes V1 provided on the support surface 10s of the platen 12. Placed in the corresponding position.

In the present embodiment, the plurality of support pins VP1 are erected at predetermined positions of the main plate 71 and the sub plate 72, respectively. In this case, each support pin VP1 has its own axial length set so that the height of the top is constant. Here, the support pin VP1 arranged on the sub-plate 72 is formed shorter than the support pin VP1 arranged on the main plate 71 by a portion corresponding to the difference in height between the main plate 71 and the sub-plate 72. The shape of the tip of the support pin VP1 in contact with the back surfaces (non-deposited surface) of the substrates W1 and W2 is not particularly limited, and is formed into a curved surface shape as shown in FIG. 9, for example.

The second elevating unit 75 is supported by the housing 11 and is configured to be able to elevate and elevate the second base member 70 with respect to the platen 12 in the Z-axis direction. The second elevating unit 75 raises and lowers the second base member 70 with a stroke length larger than the stroke length of the first base member 60 by the first elevating unit 65. The second elevating unit 75 is composed of a fluid pressure cylinder unit, a ball screw unit, and the like installed on the lower surface of the main plate 71. The second elevating unit 75 is installed on the lower surface of the main plate 71 via the opening 60a of the first base member 60.

The second elevating unit 75 is configured to be able to elevate and lower the second base member 70 between the ascending position shown in FIG. 8C and the descending position shown in FIGS. 8A and 8B. In the raised position, the support pin VP1 penetrates the support surface 10s through the first insertion hole V1 and supports the back surfaces of the substrates W1 and W2 so that the substrates W1 and W2 rise from the support surface 10s by a predetermined height. .. In the lowered position, the support pin VP1 is pulled out from the first insertion hole V1 and the substrates W1 and W2 are placed on the support surface 10s.

The second base member 70 further has a plurality of positioning pins VP2 for positioning the substrates W1 and W2 with respect to the support regions S1 and S2 with predetermined accuracy when the substrates W1 and W2 are placed on the support surface 10s. .. The plurality of positioning pins VP2 are arranged at positions corresponding to the plurality of second insertion holes V2 provided on the support surface 10s.

In the present embodiment, the plurality of positioning pins VP2 are erected at predetermined positions of the main plate 71 and the sub plate 72, respectively. In this case, each positioning pin VP2 has its own axial length set so that the height of the top is constant. Here, the positioning pin VP2 arranged on the main plate 71 is installed on the main plate 71 via the support pedestal 74. The height of the support pedestal 74 is set so that the top of the positioning pin VP2 arranged on the main plate 71 has the same height as the top of the positioning pin VP2 arranged on the sub plate 72.

The positioning pin VP2 is driven by the second elevating unit 75 to move up and down between the ascending position and the descending position at the same time as the support pin VP1. The axial length of the positioning pin VP2 is set so that the top of the positioning pin VP2 is located above the top of the support pin VP1. Further, as shown in FIG. 10, a block 73 having a slope 73a capable of guiding the peripheral edges of the substrates W1 and W2 to the support areas S1 and S2 is attached to the top of each positioning pin VP2.

The substrate elevating mechanism described above may be omitted if necessary. Alternatively, either one of the support pin VP1 and the positioning pin VP2 may be omitted.

[Operation of board holding device]
Next, the operation of the substrate holding device 100 of the present embodiment configured as described above will be described together with the operation of the film forming apparatus 200. The operations of the substrate holding device 100 and the film forming apparatus 200 are collectively controlled by the controller 90.

Prior to film formation, the inside of the vacuum chamber 211 is maintained in a predetermined depressurized atmosphere, and the substrate holding device 100 keeps the platen 12 in a horizontal posture. The drive unit 50 of the substrate holding device 100 causes the first base member 60 and the second base member 70 to stand by in the ascending position by the first and second elevating units 65 and 75. As a result, the first to third clamp portions C1 to C3 move to the non-clamp position by pushing up the operation shafts CP1 to CP3, and the support pin VP1 and the positioning pin VP2 project above the support surface 10s.

Two substrates W1 and W2 are placed on a plurality of support pins VP1 on the support regions S1 and S2 of the support surface 10s of the platen 12 by a transfer robot (not shown) via a gate valve (not shown). At this time, when the substrates W1 and W2 are misaligned, the substrates W1 and W2 are guided toward the support regions S1 and S2 by the slope 73a of the block 73 provided at the tip of the positioning pin VP2. As a result, a predetermined alignment accuracy of the substrates W1 and W2 with respect to the support regions S1 and S2 is ensured.

Subsequently, the drive unit 50 of the substrate holding device 100 moves the second base member 70 from the ascending position to the descending position by the second elevating unit 75. As a result, the support pin VP1 and the positioning pin PV2 are pulled down from the support surface 10s, and the substrates W1 and W2 are simultaneously arranged on the support regions S1 and S2.

Subsequently, the drive unit 50 of the substrate holding device 100 moves the first base member 60 from the ascending position to the descending position by the first elevating unit 65. As a result, the hook portions 21 and 31 of the first to third clamp portions C1 to C3 move from the non-clamp position to the clamp position, so that the peripheral portions of the substrates W1 and W2 are held in the support regions S1 and S2.

At this time, since the hook portions 21 of the first and second clamp portions C1 and C2 move to the clamp position with a movement substantially parallel to the support surface 10s, the substrates W1 and W2 move to the support regions S1 and S2. On the other hand, even if the position is displaced, the substrates W1 and W2 are pressed toward the support areas S1 and S2 in the process of moving the hook portion 21 to the clamp position, so that the desired alignment accuracy is ensured. ..

On the other hand, since the hook portion 31 of the third clamp portion C3 moves to the clamp position from above the support surface 10s with a movement approaching the support surface 10s, it warps at the peripheral edges (corners, etc.) of the substrates W1 and W2. Even when such a problem occurs, the warp can be corrected and the substrates W1 and W2 can be held with high flatness. Moreover, since the third clamp portion C3 is configured to hold the peripheral portions of the substrates W1 and W2 behind the operations of the first and second clamp portions C1 and C2, the first and first clamp portions C3 are described above. 2 It is possible to stably secure an appropriate holding operation of the substrates W1 and W2 by the clamp portions C1 and C2.

Subsequently, the substrate holding device 100 raises the platen 12 from the horizontal posture to the vertical posture via the rotation mechanism unit 13 (see FIG. 2B). Then, a predetermined film forming process is performed on the substrates W1 and W2 on the support surface 10s facing the target unit 212.

According to the present embodiment, since the substrates W1 and W2 are stably held on the support surface 10s by the first to third clamp portions C1 to C3, they are prevented from falling off from the support regions S1 and S2.
In particular, according to the present embodiment, since the plurality of clamp portions (first clamp portion C1) are also arranged in the intermediate region 10M of the support surface 10s, the plurality of substrates W1 and W2 can be stably held. Further, the relative position between the substrates W1 and W2 can be stably maintained, and the positional accuracy of the substrates W1 and W2 with respect to the support regions S1 and S2 can be ensured. Therefore, high mask accuracy can be maintained even when the mask is formed.

After the film formation, the substrate holding device 100 converts the platen 12 from the vertical posture to the horizontal posture. Then, the substrate holding device 100 sequentially raises the first base member 60 and the second base member 70 (in the order of FIGS. 8A to 8C) in the reverse operation of the above. As a result, after the holding operations of the substrates W1 and W2 by the first to third clamp portions C1 to C3 are released, the substrates W1 and W2 are simultaneously raised from the support surface 10s by the support pin VP1, and the substrate transfer robot (not shown) is used. Will be reprinted in.

<Second embodiment>
Subsequently, a second embodiment of the present invention will be described. FIG. 11 is a cross-sectional view of a main part of the substrate holding device 101 according to the present embodiment. In the figure, the parts corresponding to the above-described first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 11, the substrate support 10 in the substrate holding device 101 of the present embodiment has a suction portion 80 capable of electrostatically sucking the substrates W1 and W2. The suction unit 80 is an electrostatic chuck mechanism, and is configured to be capable of electrostatically sucking the substrates W1 and W2 on the support surface 10s by receiving power supply from the controller 90.

The suction portion 80 is typically provided over the entire surface of the support surface 10s. Not limited to this, the suction portion 80 may be provided in each of the regions corresponding to the support regions S1 and S2 on the support surface 10s. Further, the suction portions 80 provided on the support regions S1 and S2 may be divided and arranged at a plurality of locations.

The suction unit 80 has a chuck electrode that exerts an electrostatic suction force on the substrate W when a voltage equal to or higher than a predetermined value is applied. The type of electrostatic adsorption force is not particularly limited, and Coulomb force, Johnson-Labeck force, or the like is typically adopted.

In the present embodiment, the suction unit 80 is composed of a bipolar electrostatic chuck, and each chuck region is provided with a chuck electrode for a positive electrode and a chuck electrode for a negative electrode. These two chuck electrodes are arranged adjacent to each other so as to face the support surface 10s. Each electrode is protected by an insulating film and comes into contact with the substrates W1 and W2 via the insulating film. The suction unit 80 may be composed of a unipolar electrostatic chuck. The size (area), number of arrangements, arrangement form, etc. of the chuck electrodes are not particularly limited as long as the substrates W1 and W2 can be stably held in the upright posture.

The controller 90 is configured to synchronously supply electric power to each chuck electrode of the suction unit 80 and shut off the electric power. Instead of this, it may be configured to individually supply power to a predetermined chuck electrode. As a result, it is possible to individually control the suction start / release operation of each chuck electrode, so that high flatness can be ensured even on a substrate on which warpage or bending is likely to occur. For example, by controlling the power supply so that the suction operation starts sequentially from the upper edge side to the lower edge side of the substrates W1 and W2, the substrate W has a desired flatness while also utilizing the own weight of the substrate W. It is possible to hold it stably.

The suction unit 80 receives power from the controller 90 to start the holding operation of the substrates W1 and W2, and the power supply is cut off to release the holding operation of the substrates W1 and W2. The controller 90 may be configured to apply a reverse voltage to each chuck electrode during the dechuck operation in order to quickly hold the substrates W1 and W2.

In the substrate holding device 101 of the present embodiment configured as described above, when the substrates W1 and W2 are held, the substrates are sucked after the substrate holding operations by the first to third clamp portions C1 to C3 described above are executed. The suction operation of the substrates W1 and W2 by the unit 80 is executed. As a result, predetermined alignment accuracy of the substrates W1 and W2 with respect to the support surface 10s is further ensured.

Subsequently, the substrate holding device 101 erects the platen 12 from the horizontal posture to the vertical posture via the rotation mechanism unit 13, and then determines the plates W1 and W2 on the support surface 10s facing the target unit 212. The film forming process is carried out. At this time, the substrates W1 and W2 are stably held on the support surface 10s by the holding action by the first to third clamp portions C1 to C3 and the electrostatic adsorption action by the suction section 80, and are from the support areas S1 and S2. It is prevented from falling off.

After the film forming process is completed, the substrate holding device 101 converts the platen 12 from the standing posture to the horizontal posture via the rotation mechanism unit 13. In the holding release operation of the substrates W1 and W2 with respect to the support surface 10s, after the electrostatic suction operation by the suction unit 80 is released, the substrate holding operation by the first to third clamp portions C1 to C3 is released by the above procedure.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made.

10 ... Board support 10s ... Support surface 10C ... Peripheral area 10M ... Intermediate area 12 ... Platen 13 ... Rotation mechanism part 20, 30 ... Hook member 21, 31 ... Hook part 23 ... Rotation support part 24, 34 ... Biasing member 33 ... Link mechanism unit 50 ... Drive unit 60 ... 1st base member 65 ... 1st elevating unit 70 ... 2nd base member 75 ... 2nd elevating unit 80 ... Suction unit 90 ... Controller 100, 101 ... Substrate holding device 200 ... Film formation Device 211 ... Vacuum chamber 212 ... Target unit C1 ... 1st clamp part C2 ... 2nd clamp part C3 ... 3rd clamp part CP1, CP2, CP3 ... Operation axis VP1 ... Support pin VP2 ... Positioning pin

Claims (12)

It has a support surface having a plurality of support regions on which a plurality of substrates are individually arranged, and a rotation mechanism unit capable of erecting the support surface from a horizontal posture to a vertical posture around an axis parallel to the support surface. Board support and
It has a plurality of clamp portions arranged along the periphery of the plurality of support regions and capable of holding peripheral portions of the plurality of substrates, and the plurality of clamp portions are arranged in an intermediate region between the plurality of support regions. is the comprising a plurality of first clamping portions of the plurality can be held individually peripheral portion of the substrate, and ingredients Bei a clamp mechanism,
The plurality of support regions include at least two support regions that are vertically adjacent to each other when the substrate support is in a vertical position.
Board holding device. The substrate holding device according to claim 1 .
The plurality of clamp portions further include a plurality of second clamp portions and a plurality of third clamp portions arranged in a peripheral region of the plurality of support regions excluding the intermediate region.
The plurality of first and second clamp portions have hook portions facing the peripheral edges of the plurality of substrates with a movement substantially parallel to the support surface.
The plurality of third clamp portions are substrate holding devices having hook portions facing the peripheral edges of the plurality of substrates with a movement of approaching the support surface from above the support surface. The substrate holding device according to claim 2 .
The plurality of first and second clamp portions are substrate holding devices that further include a rotation support portion that rotatably supports the hook portion along a curved trajectory having a constant curvature toward a clamp position. The substrate holding device according to claim 2 or 3 .
The plurality of third clamp portions can move along a curved track having a maximum height from the support surface larger than the plurality of first and second clamp portions with the hook portions directed to the clamp positions. A substrate holding device further having a supporting link mechanism. The substrate holding device according to claim 3 or 4 .
The plurality of first to third clamp portions are substrate holding devices each further having an urging member for urging the hook portion to the clamp position. The substrate holding device according to any one of claims 2 to 5 .
The clamp mechanism holds the peripheral edges of the plurality of substrates by the plurality of first clamp portions and the plurality of second clamp portions, and then holds the peripheral edges of the plurality of substrates by the plurality of third clamp portions. A board holding device configured to do so. The substrate holding device according to any one of claims 2 to 6 .
The planar shape of the plurality of substrates is rectangular,
A substrate holding device in which the plurality of third clamp portions are arranged at positions closer to the corners of the plurality of substrates than the plurality of first clamp portions and the plurality of second clamp portions. The substrate holding device according to any one of claims 1 to 7 .
The clamp mechanism further includes a drive unit capable of moving the plurality of clamp portions from a clamp position to a non-clamp position when the substrate support is in a horizontal posture.
The drive unit
A first base member having a plurality of operating shafts arranged corresponding to the plurality of clamp portions, and
By pushing up the plurality of clamps with the plurality of operating shafts, the ascending position for setting the plurality of clamps to the non-clamping position, and by releasing the pushing up of the plurality of clamps with the plurality of operating shafts. A substrate holding device having a first elevating unit that elevates and elevates the first base member between a descending position for setting the plurality of clamp portions at the clamp position. The substrate holding device according to claim 8 .
The drive unit
A second base member arranged in parallel with the first base member and having a plurality of support pins capable of penetrating the support surface.
The second position extends between an ascending position in which the plurality of support pins support the back surfaces of the plurality of substrates and a descending position in which the plurality of substrates supported by the plurality of support pins are arranged on the support surface. A substrate holding device further including a second elevating unit for elevating and lowering the base member. The substrate holding device according to any one of claims 1 to 9 .
The substrate support is a substrate holding device further comprising an adsorption portion provided on the support surface and capable of electrostatically adsorbing the plurality of substrates. The substrates are individually placed in multiple support areas on the support surface maintained in a horizontal position.
The intermediate region between the plurality of support regions and the peripheral region of the plurality of support regions excluding the intermediate region are respectively arranged, and the peripheral portion of the substrate is provided with a movement substantially parallel to the support surface. The substrate is held by a plurality of clamp portions having the first hook portions facing each other.
The substrate is held by a plurality of clamp portions arranged in the peripheral region and having a second hook portion facing the peripheral edge portion of the substrate with a movement of approaching the support surface from above the support surface.
A substrate holding method in which the support surface is erected from a horizontal posture to a vertical posture. A film forming chamber having a film forming source and
A support surface having a plurality of support regions arranged in the film forming chamber and having a plurality of substrates individually arranged, and the support surface can be erected from a horizontal posture to a vertical posture around an axis parallel to the support surface. A board support with a possible rotation mechanism and
It has a plurality of clamp portions arranged along the periphery of the plurality of support regions and capable of holding peripheral portions of the plurality of substrates, and the plurality of clamp portions are arranged in an intermediate region between the plurality of support regions. is the comprising a plurality of first clamping portions of the plurality can be held individually peripheral portion of the substrate, and ingredients Bei a clamp mechanism,
The plurality of support regions include at least two support regions that are vertically adjacent to each other when the substrate support is in a vertical position.
Film forming apparatus.

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