JP3116829B2 - Chip feeder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip supply device for supplying chips by a jig.

[0002]

2. Description of the Related Art In a manufacturing process of an electronic component, a chip supply device using a jig (a wafer or a tray) for holding a chip in a plane is used.

FIG. 6 is a plan view of a conventional chip supply device. In FIG. 6, reference numeral 1 denotes a θ table that rotates by an index in the θ direction, 2 denotes a wafer having chips, and the wafer 2 is mounted on a chip supply table 3.

In this apparatus, when the supply stage is at a position 90 degrees to the right, the θ table 1 is driven to position a chip supply table 3 having necessary chips on the supply stage. .

[0005]

However, if a plurality of chip supply tables 3 are radially arranged and the chip supply table 3 is supplied by rotation as described above, the wafer 2
When the area of the jig increases, the occupied floor area of the chip supply device increases in proportion thereto. In particular, jigs tend to be large in recent years, and chip supply devices
Since it is provided in a facility having a high facility cost per floor area such as a clean room, a chip supply device capable of reducing the occupied floor area is required.

Accordingly, an object of the present invention is to provide a compact chip supply device.

[0007]

According to a first aspect of the present invention, there is provided a chip supply apparatus comprising:
A rail, a chip supply table which detachably holds a jig provided with chips, and is slidably held with respect to each of the first rails; and a second rail arranged beside the first rails. And a lifting device that raises and lowers a lifting plate to make one of the first rails the same height as the second rail, and moves the chip supply table between the first rail and the second rail that have the same height. Transfer device, a pickup head for picking up chips from the chip supply table transferred to the second rail, and a horizontal movement mechanism for moving the chip supply table transferred to the second rail to a position where pickup by the pickup head becomes possible. And

[0008]

1 is a perspective view showing a first embodiment of a chip supply device according to the present invention;
A rail, a chip supply table which detachably holds a jig provided with chips, and is slidably held with respect to each of the first rails; and a second rail arranged beside the first rails. And a lifting device that raises and lowers a lifting plate to make one of the first rails the same height as the second rail, and moves the chip supply table between the first rail and the second rail that have the same height. Transfer device, a pickup head for picking up chips from the chip supply table transferred to the second rail, and a horizontal movement mechanism for moving the chip supply table transferred to the second rail to a position where pickup by the pickup head becomes possible. And

Accordingly, the chip supply table provided with the jig can be supported three-dimensionally up and down, and the exclusive floor area can be reduced accordingly. In addition, even when the first and second rails are supported in this manner, the chips can be smoothly supplied to the pickup head by effectively utilizing the first rail and the second rail.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a chip supply device according to an embodiment of the present invention.

In FIG. 1, reference numeral 4 denotes a substrate transfer rail for transferring and positioning the substrate 5, and reference numeral 6 denotes a pickup head for picking up chips and transferring them to the substrate 5, as shown in FIG.

Reference numeral 8 denotes a base, and on both sides of the base 8 in the X direction, a vertically elongated first elevating device 9 and a second elevating device 1 are provided.
0 are erected so as to face each other. Here, the first lifting device 9 connects the vertical lifting plate 11 to the second lifting device 10.
Is for raising and lowering the lift plates 12 independently of each other.

As shown in FIG. 2, first horizontal rails 13 to 16 are mounted on the elevating plate 11 in a plurality of steps at regular intervals. Similarly, third rails 18 to 21 are attached.

A horizontal second rail 17 is provided between the first rails 13 to 16 and the third rails 18 to 21 so as to be at a certain level L. In particular,
As shown in FIG. 2, the second rail 17 is horizontally fixed on the upper part of the moving table 22, and the moving table 22 is placed on the base 8 by an X table 33 and a Y table 32 as a horizontal moving mechanism. Can be moved in the X direction.

Since the second rail 17 is on the fixed level L as described above, one of the first rails 13 to 16 or the third rails 18 to 21 is placed at the same height as the second rail 17. In order to achieve this, it is necessary to drive the first lifting device 9 or the second lifting device 10 to adjust the target rail to a certain level L. Incidentally, in the state shown in FIG. 2, the first rail 14 and the third rail 19 are at this constant level L.

As shown in FIGS. 1 to 4, units having the same configuration as described below are engaged with the first rails 13 to 16 and the third rails 18 to 21. That is, reference numeral 24 denotes a wafer holder as a jig provided with the chips 23. The wafer holder 24 adhesively holds a plurality of chips 23 on an adhesive sheet 24a. Although only the case where the wafer holder 24 is used will be described below, a tray may be employed as a jig.

The wafer holder 24 is detachably mounted on a horizontal chip supply table 25. A slider 26 is fixed to a rear portion of the chip supply table 25, and the slider 26 is slidably engaged with the first rails 13 to 16 or the third rails 18 to 21. For this reason,
The chip supply table 25 can slide horizontally with respect to the first rails 13 to 16 or the third rails 18 to 21.

At the rear of the chip supply table 25, a cantilevered arm 27 is extended, and a U-shaped block 28 that opens downward and is adjacent to the slider 26 is fixed. At the center of the block 28, a cylindrical pin is mounted in parallel with the arm 27.

In FIG. 1, reference numeral 30 denotes a transfer device which is horizontally (X direction) mounted on the first lifting device 9 and the second lifting device 10. The transfer device 30 includes a U-shaped engagement member 31.
Can be moved in the X direction. When any one of the first rails 13 to 16 or the third rails 18 to 21 is at the above-mentioned fixed level L, the engaging member 31 is located at the rear of the chip supply table 25 at this level L. The distal end of the arm 27 can be clamped.

When this clamping is performed, the clamped arms 27,
That is, the chip supply table 25 is connected to the first rail and the second rail 17.
And the third rail can be freely moved (see a chain line in FIG. 3).

Next, the fixing mechanism will be described with reference to FIGS. In the moving table 22 described above,
In addition to the second rail 17, a cylinder 34 is fixed upward. A U-shaped fixing member 36 is connected to the tip of the rod 35 of the cylinder 34, and a roller 37 projects from both sides into a notch 36 a at the center of the tip of the fixing member 36. It is provided.

Then, as shown by a chain line in FIG. 4, when the cylinder 34 is driven to raise the fixing member 36, the block 28 adjacent to the slider 26 engaged with the second rail 17 is moved to the fixing member 36. Can be secured.

That is, the pin 29 of the block 28 is gripped from both sides by the rollers 37, and the block 28 is fixed. Of course, if the block 28 is fixed, the block 28
The upper chip supply table 25 and the wafer holder 24 are also fixed.

While the fixing is effective, when the X table 33 and the Y table 32 are driven, the fixed wafer holder 24 can be freely moved in the X and Y directions, as shown in FIG. The predetermined chip 23 on the wafer holder 24 can be positioned at the position (pickup position S1) of the chip lifting device 7.

The chip supply device of this embodiment has the above-described configuration, and its operation will be described next. Here, it is assumed that the chips 23 are supplied from the chip supply table 25 of the first rail 14.

First, the first elevating device 9 is driven to set the arm 27 on the first rail 14 to a height that does not interfere with the engaging member 31, and the engaging member 31 is placed directly below or directly above the arm 27. Move. Then, the first rail 14 is moved up and down to set the first rail 14 to a constant level L and the engaging member 3
1, the tip of the arm 27 is engaged.

Next, the second rail 17 is positioned right beside the first rail 13 (the position indicated by the chain line in FIG. 3), and the engaging member 31 is moved to the position shown in FIG.
By moving to the solid line position, the target chip
The slider 26 related to 5 is moved from the first rail 13 to the second rail 17 (the position indicated by the chain line in FIG. 4).

Next, as described with reference to FIG. 5, the fixing member 36 is engaged with the block 28 of the chip supply table 25 moved to the second rail 17 by driving the cylinder 34.
The target chip supply table 25 is fixed to the moving table 22.

Thereafter, the X table 33 and the Y table 32
To move the target chip supply table 25 to the pickup position S1, as shown by the solid line in FIG.

Then, the chip at the pickup position S1 is pushed up by the chip push-up device 7 and the pickup head 6
Then, the pickup head 6 is reciprocated between the pickup position S1 and the mounting position on the substrate 5 to transfer chips.

When the pickup operation is completed, the chip supply table 25 is returned to the first rail 14 in the reverse procedure.

In this embodiment, two lifting devices 9, 10 and the like are symmetrically disposed on the left and right sides of the second rail 17, so that they are used alternately to reduce the switching time and further increase production. Performance can be improved.

[0033]

The chip supply device of the present invention holds a first rail which is mounted on a lift plate in a plurality of stages in a horizontal position, a jig provided with chips in a detachable manner, and a first rail for each of the first rails. A chip supply table slidably held with respect to the first rail, a second rail disposed on a side of the first rail, and an elevating plate which is raised and lowered to make one of the first rails the same height as the second rail. The first device, which is the same height as the lifting device
A transfer device for moving the chip supply table between the rail and the second rail, a pickup head for picking up the chip from the chip supply table transferred to the second rail, and a second position for enabling the pickup by the pickup head. A horizontal moving mechanism for moving the chip supply table transferred to the rail. Therefore, the chip supply tables can be arranged vertically and the chip supply tables can be switched smoothly, and the occupied floor area can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip supply device according to an embodiment of the present invention.

FIG. 2 is a front view of the chip supply device according to the embodiment of the present invention;

FIG. 3 is a plan view of a chip supply device according to an embodiment of the present invention.

FIG. 4 is an AA cross-sectional view of the chip supply device according to the embodiment of the present invention.

FIG. 5 is a partially enlarged view of a chip supply device according to an embodiment of the present invention.

FIG. 6 is a plan view of a conventional chip supply device.

[Explanation of symbols]

 Reference Signs List 6 pickup head 9 first lifting device 11 lifting plate 13, 14, 15 first rail 17 second rail 23 chip 24 wafer holder 25 chip supply table 30 transfer device 32 Y table 33 X table

Claims (3)

(57) [Claims] 1. A first rail which is mounted on an elevating plate in a plurality of stages in a horizontal posture and a jig provided with a chip are detachably held and slidably held on each of the first rails. And a second rail disposed on the side of the first rail, and raising and lowering the lifting plate to raise one of the first rails to the same height as the second rail. An apparatus, a transfer device for moving the chip supply table between the first rail and the second rail having the same height, and a pickup head for picking up chips from the chip supply table transferred to the second rail. ,
And a horizontal moving mechanism for moving the chip supply table transferred to the second rail to a position where the pickup by the pickup head becomes possible. 2. The chip supply device according to claim 1, wherein the pickup head transfers the picked-up chip to a substrate. 3. The second rail is fixed to a moving table that is moved by the horizontal moving mechanism, and the moving table is provided with a fixing mechanism that fixes the chip supply table to the second rail. 2. The method according to claim 1, wherein
The chip supply device as described in the above.