JPH1032236A - Variable pitch wafer transfer hand - Google Patents

Abstract

PROBLEM TO BE SOLVED: To modify reliably the pitch in the vertical direction of a plurality of wafers by the simple constitution of a wafer transfer hand. SOLUTION: Elevating fingers F1 to F4 are respectively supported by support members S1 to S3 of a shielding block 12, the block 12 is horizontally moved in the width direction of the fingers F1 to F4 the members S1 to S3 are made to retreat from between the fingers F, to F. while being shifted from each other by a constant time and at the same time, the fingers F1 to F4 are made to stack them by the sloped surface parts 15 of the block 12 and are brought into contact with a reference finger F0 , whereby the pitch in the vertical direction of wafers is modified from a standard pitch P1 to a narrow pitch P2 .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a variable-pitch wafer transfer hand in a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art In a semiconductor manufacturing apparatus, a carrier stage apparatus is used to carry a wafer W into the apparatus. In this carrier stage device, as shown in FIG. 11, a plurality of carrier stands 53 are mounted on a carrier column 51 via a carrier table 52 at equal intervals in the circumferential direction, and a large number of wafers W are horizontally mounted. The wafer carrier 54 housed in the state is placed on the carrier stand 53, and the carrier column 51 is rotated by a set angle by a driving means, and the wafer transfer mounted on the distal end of the arm 55 at the distal end of the articulated robot R is moved. The configuration is such that the wafer W in the wafer carrier 54 is taken out by the mounting hand 56 and transferred to the wafer boat 57 by the operation of the articulated robot R. At this time, in order to improve the throughput, a plurality of (usually five) wafers W are simultaneously placed at the standard pitch P ₁ (6.3).
5 mm) from the wafer carrier 54 side, the narrow pitch P
₂ (4.76mm or 5.2mm) wafer boat 5
The method of transferring to the 7 side is performed. For this purpose, it is necessary to provide the wafer transfer hand 56 with a mechanism for changing the vertical pitch of the plurality of wafers W.

Conventionally, as this kind of wafer transfer hand,
There is one described in JP-A-7-37966.
The technology disclosed in this publication is described in “Pitch Conversion Plate (5)
A drive source (8) includes a wafer holding plate mounting block (4) on one surface (9A) or the other surface (9B) of the variable groove (9).
2. A wafer variable pitch wafer holder characterized in that it can cope with two types of wafer pitches by pressing. ". However, according to the technique described in this publication, the pitch conversion plate (5) is attached to the wafer holding plate mounting block (4).
Is pressed and returned by the tension spring (6), which is not stable.

[0004] Another technique is disclosed in Japanese Patent Laid-Open No. 7-106.
The technology described in Japanese Patent Publication No. 403 is disclosed. In this technique, an arm is attached to each movable body of a ball screw which is threaded in a direction opposite to each other, and the movable body is steplessly rotated in the opposite direction by the same amount by rotating the ball screw by a predetermined amount. It is a configuration of moving. However, in this method, since a ball screw is used, the device becomes complicated and large. Moreover, it is expensive. Further, the pitch of the wafers on the wafer boat 57 side is limited, and in most cases, only the two types of pitches (4.76 mm or 5.2 mm) need to be supported.

[0005]

SUMMARY OF THE INVENTION In view of the above-mentioned problems, the present invention has a simple structure in which a vertical pitch of each wafer placed on each finger is reduced in a hand for transferring a plurality of wafers at a time. The task is to be able to make changes in the

[0006]

Means adopted by the present invention to solve this problem is that a plurality of fingers are used when transferring a wafer from a standard pitch wafer carrier to a narrow pitch wafer boat. A variable-pitch wafer transfer hand for changing a vertical pitch of a wafer placed on a plurality of wafers at a time by changing a reference finger and a reference finger, and being arranged in multiple stages with respect to the reference finger. A plurality of lifting fingers provided with a supporting portion for supporting in a cantilevered state, and a lifting operation portion for individually lifting and lowering, and a vertically movable one end in the moving direction thereof Each support member for setting the fingers at a standard pitch is provided in multiple stages, and similarly, a flat portion for setting the narrow pitch by stacking each elevating finger at the other end is provided. A slide block provided with an inclined surface portion between the flat portion and the support member, and by horizontally moving the slide block disposed on the lifting / lowering operation portion of each of the lifting / lowering fingers, the wafer of the reference finger is provided. In other words, the vertical pitch of each other wafer can be changed.

The vertical pitch of each elevating finger with respect to the reference finger of the variable-pitch wafer transfer hand is
The standard pitch is set in advance. Therefore, the pitch of the plurality of wafers placed on each finger is set to a standard pitch. The variable-pitch wafer transfer hand is moved to the standard-pitch wafer carrier side, and each wafer on the wafer carrier side is mounted on the reference finger and each lifting / lowering finger of the variable-pitch wafer transfer hand and taken out. When the slide block is horizontally moved in this state, each support member is retracted from the space between the elevating fingers for a predetermined time. At the same time, the inclined surfaces push up the respective lifting fingers in order from the lower lifting finger. When all the lifting fingers come into contact with the reference finger in a stacked state, the pitch of each lifting finger with respect to the reference finger is changed to a narrow pitch. That is, the pitch of the wafer is set to a narrow pitch. The variable-pitch wafer transfer hand is moved to the narrow-pitch wafer boat side to store each wafer. Thereafter, the slide block is horizontally moved in the opposite direction to lower each of the elevating fingers, thereby setting the pitch to the standard pitch.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to examples. In this embodiment, a wafer transfer hand for changing the vertical pitch of five wafers from the standard pitch P ₁ (6.35 mm) to one of the narrow pitch P ₂ (4.76 mm) will be described. As shown in FIGS. 1 to 4, the frame 1 of the wafer transfer hand according to the present invention
Includes a base 2, a frame 3 of the shape of inverted "U" which is erected on the upper surface of the base 2, the reference bracket B ₀ Metropolitan is fixedly provided astride the upper surface of the frame body 3 Made up of The reference bracket B _0, the reference finger F ₀ of the plate shape is fixedly provided with a rectangular. This reference finger F ₀
Is consist with the front of the wafer placing portion 4a and a rear supporting portion 5a, the wafer placing portion 4a is in a form projecting from the frame 1 to the front, and is fixed to the reference bracket B _0. Below the reference finger F _0, in the first to fourth lifting the finger F ₁ to F ₄ is the order in which forms substantially the same shape as the reference finger F _0, moreover reference finger F ₀
It is arranged in a shape that substantially overlaps with. Each of the elevating fingers F _{1 to} F ₄ includes a wafer mounting portion 4b and a support portion 5b from the front.
And the respective portions of the lifting / lowering operation unit 6. Each support portion 5b is fixed to the lift bracket B ₁ .about.B ₄ to be described later. Reference finger F ₀ and each lifting finger F
₁ to F ₄ of the wafer placing portion 4a, the 4b, a circular wafer W
Are provided, and the wafer W is placed in a cantilevered state in the circular groove 7. As shown in FIG. 3, in the present embodiment, each of the elevating fingers F ₁ to
The thickness of F ₄ is equal to pitch P _2. The reference finger F ₀ and (pitch of the lifting finger F ₁ to F ₄ with respect to the reference finger F ₀₎ vertical pitch of the wafer W placed on each lifting finger F ₁ to F ₄
Is preset to the standard pitch P _1.

A structure for raising and lowering the _first to _fourth lifting fingers F _{1 to} F ₄ will be described with reference to FIGS. As shown in FIG. 5, each of the lifting brackets B _{1 to} B ₄ has an “L” shape that is substantially horizontal when viewed from the front, and the above-mentioned lifting fingers F are attached to their horizontal steps 8. supporting portion 5b of ₁ to F ₄ is attached. These support portion 5b is attached by a plurality of countersunk screws 9, does not head countersunk screw 9 wherein the plurality of protruding from the upper surface of each lifting finger F ₁ to F _4. In each of the lifting brackets B _{1 to} B ₄ , the right angle portion 11 provided in a direction perpendicular to the step portion 8 is
Is attached to the individual guide rails G ₁ ~G _4. As shown in FIG. 4, these four guide rails G _{1 to} G ₄ are attached to the inside of the front part of the frame body 3 constituting the frame 1 in parallel two by two along the vertical direction. I have. Then, as each lifting finger F ₁ to F ₄ shown in FIG. 2, it is disposed turned multistage so each other do not interfere. As described above, lifting the finger F ₁ to F ₄ of the first to fourth is mounted in the state of cantilever through a respective lift bracket B ₁ .about.B ₄ in the guide rails G ₁ ~G _4.

As shown in FIGS. 3 and 4, a reference finger F ₀ is provided at the rear of the base 2 constituting the frame 1.
And the guide rail G ₀ is mounted along the width direction of each lift finger F ₁ to F _4. This guide rail G
_The slide block 12 is attached to the upper surface of the _zero . Next, the slide block 12 will be described. The slide block 12 has a rectangular shape in plan view. As shown in FIG. 6, the longitudinal end portion of the slide block 12, the support from the upper first to third members S ₁ to S ₃ are provided in multiple stages. The tip of each of the support members S _{1 to} S ₃ extends toward the longitudinal center of the slide block 12. The thickness of each of the support members S _{1 to} S ₃ is a difference d (d = P ₁ −P ₂ ) between the standard pitch P ₁ and the narrow pitch P ₂ . Between each of the support members S ₁ to S _3, the second to fourth lifting the finger F ₂ to F ₄ enters. Therefore, the vertical interval h between the support members S _{1 to} S ₃ is equal to the thickness of the _second to _fourth lifting fingers F _{2 to} F ₄ (equal to the narrow pitch P ₂ ).
Slightly larger than. In addition, the length of each of the support members S _{1 to} S _{3 is such that} the length of the uppermost support member S ₁ is the longest, and the length of the support members S _{1 to} S ₃ is gradually reduced toward the bottom. Each support member S _{1 to} S ₃
Is enters between the overlapping lifting finger F ₁ to F _4, to support the lower surface of each lifting finger F ₁ to F ₃ except lifting finger F ₄ lowermost. Each support member S _{1 to} S ₃
There their tip for easy penetration between each lifting finger F ₁ to F ₄ are cut obliquely from the upper surface to the lower surface. In addition, each elevating finger F
In ₂ to F _4, relief portions 13 are respectively provided. A flat portion 14 is provided at the other end in the longitudinal direction of the slide block 12, and an inclined surface portion 15 is provided from an inner end 14 a of the flat portion 14 downward. From the inside of the end portion 14a of the flat portion 14 described above, the horizontal distance 16 to the distal end portion of the support member S ₁ of the uppermost is slightly longer than the width L of each lifting finger F ₁ to F _4.

[0011] As shown in FIG. 4, the base 2 are attached pneumatic cylinder 17 along the longitudinal direction of the adjacent guide rail G ₀ of the slide block 12 described above, moreover the guide rails G ₀ . This pneumatic cylinder 1
The seventh cylinder shaft 17 a is attached to a connection bracket 18 attached to one end of the slide block 12. Therefore, the pneumatic cylinder 17 is operated to move forward and backward the cylinder axis 17a, the slide block 12 is moved horizontally along the width direction of each lift finger F ₁ to F _4.

[0012] With reference to FIG. 7 to FIG. 10, the pitch in the vertical direction of the wafer W, a description will be given of the principle of the shift from the standard pitch P ₁ in the pitch P _2. The wafer W is
Each reference finger F ₀ and each lifting finger F ₁
Wafer placing portion 4a of the to F _4, is placed in 4b. The uppermost reference finger F ₀ is the reference bracket B ₀
It is fixed to. To change the vertical pitch of the wafer W is vertical pitch of the lifting finger F ₁ to F ₄ (or each lifting finger F ₁ to F ₄ is lift bracket B ₁ .about.B ₄ attached) Can be changed. To change the pitch of the reference finger F first for ₀ lifting the finger F _1, the difference in the elevating finger F ₁ and the standard pitch P ₁ and a narrow pitch P ₂ d (i.e., d = P ₁ -P ₂ ) Only need to be raised. And
The second lifting finger F _{2 with} respect to the reference finger F ₀
In order to change the pitch of the lift finger F ₂
Should be increased by twice the difference d between the standard pitch P ₁ and the narrow pitch P ₂ . Similarly, in order to change the third pitch of the lifting finger F ₃ of the reference finger F ₀ is the finger F ₃ descending該昇only 3 times the difference d between the standard pitch P ₁ and a narrow pitch P _2, also , Reference finger F
To change the fourth pitch of the lifting finger F ₄ for _0, elevating the finger F ₄ standard pitch P ₁
And the narrow pitch P ₂ may be increased by four times the difference d.

As shown in FIG. 7, the first to fourth lifting fingers F _{1 to} F ₄ are set to a standard pitch P ₁ in advance. First to third support members S _{1 to} S ₃ enter between the lifting fingers F _{1 to} F ₄ , respectively.
Vertical pitch of the lifting finger F ₁ to F ₄ is set to the standard pitch P _1. In this state, the slide block 12 is moved in the direction 19 in which the support members S _{1 to} S ₃ are retracted.
To the moved horizontally, as shown in FIG. 8, is retracted from between the bottom of the support member S ₃ is the third lift finger F ₃ and the fourth lift finger F _4. At about the same time, the lower end 21 of the lowermost lifting finger F ₄ comes into contact with the inclined surface 15 of the slide block 12. The third lower surface of the lifting finger F ₃ of is laminated in contact with the upper surface of the fourth lifting finger F _4. In this state, the fourth lifting finger F ₄ rises along the inclined surface 15 of the slide block 12, so that the third lifting finger F ₃ also rises. When the slide block 12 is further moved horizontally, the second support member S ₂ is retracted from between the second lifting finger F ₂ and the third lifting finger F _3, and the second lifting member F ₂ the lower surface is laminated in contact with the upper surface of the third lift finger F ₃ of. In this state, the fourth lifting finger F ₄ is
2 ascending along the second inclined surface portion 15,
The third lifting fingers F ₂ and F ₃ also rise.

[0014] is further horizontally moving the slide block 12, as shown in FIG. 9, the first support member S ₁ is,
First lifting finger F ₁ and second lifting finger F ₂
Retracted from between the first lower surface of the lifting finger F ₁ it is laminated in contact with the second upper surface of the lifting finger F _2. In this state, the fourth lifting finger F ₄ rises along the inclined surface 15 of the slide block 12,
At the same time, the first to third lifting fingers F _{1 to} F ₃ also rise. As described above, the horizontal distance 16 from the inner end 14a of the flat portion 14 to the distal end of the support member S ₁ the uppermost
Is slightly longer than the width L of each of the lifting fingers F _{1 to} F ₄ , so that in the state shown in FIG. 9, the lower end 21 of the fourth lifting finger F _{4 at} the bottom is in contact with the inclined surface portion 15. ing. Thus, the first to third support members S ₁ to S ₁
At the same time the S ₃ from between the lifting finger F ₁ to F ₄ is retracted by shifting a predetermined time, push up each lifting finger F ₁ to F ₄ laminated by inclined surface 15 from below. Then, as shown in FIG. 10, a fourth lifting finger F ₄ is the rides on the flat portion 14 of the slide block 12, the first upper surface of the lifting finger F ₁ is brought into contact with the lower surface of the reference finger F _0. In this state, each lifting finger F _{1 to} F _{4 with} respect to the reference finger F ₀
Vertical pitch is set to a narrow pitch P _2. Each lifting finger F _{1 to} F _{4 with} respect to the reference finger F ₀
Narrow pitch P of the up and down direction of the pitch, from the standard pitch P ₁
If you want to change to _2, the slide block 12 in the opposite direction is moved horizontally, each support member S ₁ to S ₃ between each lifting finger F ₁ to F _4, it is advanced while shifting by a predetermined time You can do it.

Each of the lifting fingers F _{1 to} F ₄ and the slide block 12 can be removed. By changing the thickness of each of the lifting fingers F _{1 to} F ₄ (equal to the narrow pitch P ₂ to be changed) and the thickness d of each of the support members S _{1 to} S ₃ , a single pitch variable wafer transfer hand can be used. , 4.7
Narrow pitches other than 6 mm (for example, 5.2 mm) can be handled. In this embodiment, each of the support members S ₁ to S ₁
Having described the thickness of the S ₃ d as the difference between the standard pitch P ₁ and a narrow pitch _{P 2 (d = P 1 -P} 2), vertical spacing h of the thickness d and the support members S ₁ to S ₃ (See FIG. 6) should be the standard pitch P ₁ (P ₁ = d +
A is P ₂₎ to the thickness d of the support member S ₁ to S ₃ are may be thinner than the difference between the standard pitch P ₁ and a narrow pitch P _2. Further, in this embodiment, the pneumatic cylinder 17 is used as a means for horizontally moving the slide block 12, but other means, for example, a combination of a rack and a pinion may be used. By setting the moving direction of the slide block 12 to the width direction of each of the lifting fingers F _{1 to} F ₄ ,
The frame 1 can be reduced in size. By arranging the slide block 12 at the end portion of each lifting finger F ₁ to F ₄ (elevation operating section 6), each lifting finger F
₁ The length of the respective support portions 5b to each wafer placing portion 4b of to F ₄ is shortened, it is possible to further reduce the deflection of the wafer W, can transfer accurately the wafer W.

[0016]

In the variable-pitch wafer transfer hand according to the present invention, a plurality of lifting fingers are arranged in multiple stages below the reference finger, and each lifting finger is moved up and down by the slide block. Therefore, the vertical pitch of each elevating finger with respect to the reference finger can be changed only by moving the slide block horizontally. That is, the pitch of each wafer of the lifting fingers with respect to the wafer of the reference finger can be changed.
The mechanism for raising and lowering each lifting finger is simple and can be realized at low cost. Further, by exchanging each finger and the slide block, it is possible to cope with a pitch having a different size.

[Brief description of the drawings]

FIG. 1 is a plan view of a variable-pitch wafer transfer hand according to the present invention.

FIG. 2 is a side view of the same.

FIG. 3 is a sectional view taken along line X ₁ -X ₁ of FIG. 1;

FIG. 4 is a sectional view taken along line X ₂ -X ₂ of FIG. 2;

5 is an exploded view showing the mounting state of each lift bracket B ₁ .about.B ₄ and the guide rail G ₁ ~G _4.

6 is a side view of the slide block 12. FIG.

FIG. 7 shows a reference finger F ₀ on which a wafer W is placed.
FIG. 7 is a diagram showing a state in which the pitches of the lifting fingers F _{1 to} F ₄ are set to a standard pitch P ₁ .

[8] To change from the standard pitch P ₁ in the pitch P _2, an operation explanatory view of a state in which retracts the supporting member S ₃ of the bottom.

FIG. 9 is an operation explanatory view showing a state in which the support members S _{1 to} S ₃ are retracted.

FIG. 10 Similarly, each of the support members S _{1 to} S ₃ is retracted,
FIG. 8 is an operation explanatory view in a state where the stacked lifting fingers F _{1 to} F ₄ ride on the flat portion 14.

[11] The wafer W from the standard pitch wafer carrier 54 side of P _1, is a diagram showing a state of transferring the wafer boat 57 side of the narrow pitch P _2.

[Explanation of symbols]

F ₀ : Reference finger F _{1 to} F ₄ : Lifting finger P ₁ : Standard pitch P ₂ : Narrow pitch S _{1 to} S ₃ : Support member W: Wafer 5 b: Support section 6: Lift operation section 12: Slide block 14: Flat Part 15: Inclined surface part 54: Wafer carrier 57: Wafer boat

Claims (5)

[Claims] When transferring wafers from a standard pitch wafer carrier side to a narrow pitch wafer boat side, the vertical pitch of the wafers mounted on a plurality of fingers is changed so that a plurality of A variable-pitch wafer transfer hand for transferring a plurality of wafers, comprising: a reference finger; and a support portion arranged in multiple stages with respect to the reference finger and supported in a cantilever state, and individually raised and lowered. A plurality of elevating fingers provided with an elevating operation part for causing, each supporting member for horizontally moving and setting each elevating finger at a standard pitch at one end in the moving direction are provided in multiple stages, Similarly, a slide portion is provided at the other end portion of which is provided a flat portion for stacking up and down fingers to set a narrow pitch, and further having an inclined surface portion between the flat portion and the support member. A lock, and horizontally moving a slide block disposed on the lifting / lowering operation unit of each of the lifting / lowering fingers, so that the vertical pitch of each of the other wafers with respect to the reference finger wafer can be changed. Characteristic variable pitch wafer transfer hand. 2. The variable-pitch wafer transfer hand according to claim 1, wherein the length of each of the support members is gradually reduced from the upper one to the lower one. 3. The variable pitch wafer transfer hand according to claim 1, wherein the moving direction of the slide block is a direction along a width direction of each lifting finger. 4. The variable-pitch wafer transfer according to claim 1, wherein the lifting operation section of each lifting finger is a portion protruding rearward from a support section of the lifting finger. hand. 5. The variable-pitch wafer transfer hand according to claim 1, wherein the slide block and each lifting finger are replaceable.