JPH09186495A - Chip mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip mounting device capable of raising mounting effi ciency of a chip by a method wherein a moving area of a moving head for transferring and mounting chips provided in a tray to a board is reduced. SOLUTION: A part cassette 15 is provided on both sides of a guide rail 13 of a board 11 positioned in a clamper 12, and a tray 16 is provided on a conveying passage of the board 11 by the guide rail 13. A transfer head 30 is moved to X and Y directions by driving by an X table 22 and a Y table 21, and chips of the part cassette 15 or the tray 16 are mounted on the board 11. As the tray 16 is provided on a conveying passage of the board 11, a moving stroke of the transfer head 30 in a Y direction is reduced and a moving area A of the transfer head 30 is reduced so that a tact time can considerably be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting apparatus for mounting various kinds of chips provided on a parts cassette or tray on a substrate.

[0002]

2. Description of the Related Art A chip mounting apparatus picks up a chip provided in a chip supply section by a transfer head and transfers and mounts it on a substrate. As the chip supply unit, for example, a parts cassette such as a tape feeder, a tube feeder, or a bulk feeder having a relatively small chip such as a resistor chip or a capacitor, or a tray having a relatively large chip such as a leaded chip, etc. Is used.

FIG. 5 is a plan view of a conventional chip mounting apparatus. In the figure, reference numeral 1 denotes a substrate, which is clamped and positioned by a clamper. Reference numeral 3 is a guide rail connected to the clamper, and the substrate 1 is transported along the guide rail 3 along the mounting line. A parts cassette 5 and a tray 6 are provided on both sides of the guide rail 3. Reference numeral 7 denotes a transfer head which horizontally moves in the X direction and the Y direction by a moving table. Reference numeral 9 is a Y-direction feed screw which constitutes the moving table. The X direction feed screw is not shown in the figure. The transfer head 7 moves above the parts cassette 5 and the tray 6 according to computer programming, and the chips provided therein are chucked by the nozzles of the transfer head 7 and picked up, and the predetermined coordinate position of the substrate 1 is set. To be installed on. Q1 and Q2 are loci of the transfer head 7 for mounting the chip of the parts cassette 5 on the substrate 1,
Q3 'and Q4' are loci of the transfer head 7 for mounting the chips of the tray 6 on the substrate 1.

[0004]

The pick-up position P of the chip provided in the parts cassette 5 is at the tip of the parts cassette 5 and close to the guide rail 3. On the other hand, the pick-up position of the chip provided in the tray 6 is the entire surface of the tray 6. Therefore, the transfer head 7 moves in the moving area A ′ including the entire surface of the tray 6.
Have to move. Therefore, not only the length of the feed screw 9 for moving the transfer head 7 in the Y direction becomes long and the moving table becomes large, but also the loci Q3 'and Q4'.
Since the transfer head 7 has to move over the entire surface of the tray 6 as shown by, the moving stroke of the transfer head 7 becomes long, and the takt time becomes longer accordingly, and the chip mounting efficiency is not improved. It was

Therefore, the present invention provides a chip mounting apparatus capable of increasing the chip mounting efficiency by reducing the moving area of the transfer head for transferring and mounting the chips mounted on the tray onto the substrate. With the goal.

[0006]

To this end, the chip mounting apparatus of the present invention has a positioning portion for a substrate, a guide rail connected to the positioning portion for transporting the substrate, and arranged on a side of the guide rail. The parts cassette is provided, a tray feeder for arranging a tray in which chips are stored above the substrate conveyance path by the guide rail, and a tray arranged above the parts cassette and the conveyance path. The transfer head is configured to pick up a chip and mount the chip at a predetermined coordinate position on the substrate, and a moving table for moving the transfer head in the horizontal direction.

[0007]

According to the present invention, since the tray is arranged above the substrate conveying path by the guide rail, the moving stroke of the transfer head for picking up the chip mounted on the tray is shortened. It is possible to shorten the tact time and improve the chip mounting efficiency.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a side view of an elevating mechanism of the same substrate, and FIG. 4 is a side view of essential parts during the same chip mounting. Is.

In FIGS. 1 and 2, the following elements are arranged on the upper surface of the base 10. Reference numeral 11 denotes a substrate, which is clamped and positioned by a clamper 12 provided at the center of the upper surface of the base 10. 13 is a clamper 12
Is a guide rail to be connected to
The substrate 11 is carried in and out of the clamp position along the line. On both sides of the guide rail 13, a large number of parts cassettes 15 as chip supply parts are arranged in parallel.

The parts cassette 15 is provided with various relatively small types of chips such as resistor chips and capacitor chips. Reference numeral 17 denotes a tray feeder on which the tray 16 is placed, and two tray feeders 17 are provided on the left and right sides of the guide rail 13 so as to sandwich the conveyance path of the substrate 11. The tip of each tray feeder 17 is located on the conveyance path of the substrate 11 by the guide rail 13. Of the four trays 16 placed on each tray feeder 17, two trays 16 are placed on the conveyance path of the substrate 11 by the guide rails 13, and the other two trays 16 are a table. It is placed in the spare area B at the rear end of the 17.

In FIG. 1, Y tables 21 are installed on both sides of the base 10 so as to straddle the guide rails 13, and X tables 22 are installed on the Y table 21. In FIG. 2, a Y-direction feed screw 23 and a rail 24 are housed inside a Y-table 21. Reference numeral 25 is a motor for rotating the feed screw 23. Further, in FIG. 1, inside the X table 22, a feed screw 26 in the X direction, a rail (not shown), and a feed screw 26 are provided.
A motor 27 for rotating the is housed. Note that the direction in which the substrate 11 is conveyed by the guide rail 13 is the X direction.

In FIG. 1, reference numeral 30 is a transfer head.
The transfer head 30 includes three nozzles 31 so that the three chips can be mounted on the substrate 11 in a batch. The transfer head 30 is mounted on the feed screw 2 via a nut (not shown).
6. Therefore, when the motor 27 drives and the feed screw 26 rotates, the transfer head 30 moves in the X direction along the feed screw 26. When the motor 25 of the Y table 21 is driven to rotate the feed screw 23, the X table 22 moves on the Y table 21 in the Y direction, and the transfer head 30 also moves in the Y direction. Both ends of the X table 22 are connected to the feed screw 23 via nuts (not shown). As described above, the X table 22 and the Y table 21 move the transfer head 30 in the X direction or Y direction.
It is a moving table that moves horizontally in any direction.

Next, an elevating mechanism for the substrate 11 will be described with reference to FIG. The clamper 12 is erected on the lift plate 41. Nuts 42 are attached to both sides of the lift plate 41. A vertical feed screw 43 is screwed onto the nut 42. Reference numeral 44 denotes a support frame for the feed screw 43, which is the base 1
It is attached to 0. Sliders 45 are mounted on both sides of the lift plate 41, and the sliders 45 are slidably fitted to vertical guide rails 46 mounted on the inner surface of the support frame 44. A timing pulley 47 is attached to the lower end of the feed screw 43. A timing belt 48 is attached to the timing pulley 47.
When the motor 49 is driven and the timing belt 48 rotates, the feed screw 43 rotates, and the lift plate 41 moves up and down along the guide rail 46. The substrate 11 shown by the chain line in FIG. 3 shows a state in which the motor 49 is driven and the lift plate 41 is raised.

A base plate 51 is provided above the elevating plate 41. On the base plate 51, a large number of underpins 52 for vertically supporting the substrate 11 are provided upright. The pins 52 correct the deflection of the substrate 11 and maintain the flatness of the substrate 11. Reference numeral 53 is a plate for positioning the pin 52. The pin 52 is inserted into the pin hole formed in the plate 53. Reference numeral 54 is a column that stands on the base plate 51 to support the plate 53.

A bracket 55 is mounted on one side of the lower surface of the base plate 51. The bracket 55 penetrates the elevating plate 41, and the nut portion 55a at the lower end thereof is screwed into the vertical feed screw 56. The feed screw 56 is the lift plate 41.
It is rotatably held by a bearing 57 attached to the.
The feed screw 56 is driven by a motor 58 provided in the central portion of the elevating plate 41 to rotate. 59 and 60 are timing pulleys for transmission, and 61 is a timing belt. A guide rod 62 is vertically provided on the other side of the lower surface of the base plate 51. The guide rod 62 is slidably inserted into a guide ring 63 attached to the lift plate 41.
Therefore, when the motor 58 is driven and the feed screw 56 rotates, the base plate 51 moves up and down with respect to the substrate 11. FIG.
A pin 52 indicated by a chain line in FIG. 3 indicates a state in which the base plate 51 is raised, the substrate 11 is supported from the lower surface to correct the deflection of the substrate 11, and the planarity thereof is maintained.

The chip mounting apparatus is configured as described above. Next, the operation of mounting the chip on the substrate 11 will be described. In FIG. 2, the transfer head 30 moves above the parts cassette 15, picks up chips provided in the parts cassette 15 with the nozzles 31, and mounts the chips at predetermined coordinate positions on the substrate 11. Q1 and Q2 indicate the loci of the transfer head 30 at this time. Further, the transfer head 30 moves above the tray 16 to pick up the chip provided on the tray 16 and mount it on the substrate 11 at a predetermined coordinate position. Q3 and Q4 show the locus of the transfer head 30 at this time.

In FIG. 2, the tray 16 is arranged on the conveyance path of the substrate 11. Therefore, the loci Q3 and Q4 of the transfer head 30 are the loci Q3 'and Q of the conventional example shown in FIG.
It is shorter than 4 ', and the moving stroke of the transfer head 30 is greatly shortened. Therefore, the chip can be moved to the substrate 11
Can be mounted on. Further, since the moving stroke of the transfer head 30 in the Y direction is short and the moving area A is smaller than that in the above-mentioned conventional example, the feed screw 23 in the Y direction can be shortened to downsize the Y table 21.

By arranging the tray 16 above the transport path of the substrate 11, a large height difference is generated between the substrate 11 and the tray 16 as it is, and the lifting stroke of the nozzle 31 must be increased, and the nozzle 31 is required. The tact time becomes longer due to the vertical movement of the. In order to solve such a problem, the substrate 11 is raised to the position shown by the chain line in FIG. 3 to minimize the height difference with the tray 16. As a result, the time required for raising and lowering the nozzle 31 is shortened, and high-speed mounting becomes possible. FIG. 4 shows a state in which the substrate 11 is thus raised and the chips provided in the tray 16 are mounted on the substrate 11. 32
Is a chip vacuum-chucked to the lower end of the nozzle 31. As shown, the substrate 11 is at substantially the same height as the tray 16, so that the nozzle 31 can mount the chip 32 on the substrate 11 with a short lifting stroke.

[0019]

According to the present invention, since the tray is arranged above the substrate conveying path by the guide rail, the moving stroke of the transfer head for picking up the chip mounted on the tray is shortened and the tact time is shortened. The time can be greatly shortened to improve the chip mounting efficiency. Further, since the moving stroke of the transfer head can be shortened, the moving table for moving the transfer head in the horizontal direction can be downsized.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a side view of a substrate lifting mechanism of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a side view of essential parts of the chip mounting apparatus according to the embodiment of the present invention during chip mounting.

FIG. 5 is a plan view of a conventional chip mounting device.

[Explanation of symbols]

 10 Base 11 Board 12 Clamper 13 Guide Rail 15 Parts Cassette 16 Tray 21 Y Table 22 X Table 30 Transfer Head 41 Elevating Plate 43 Feed Screw 49 Motor

Claims (1)

[Claims] 1. A substrate positioning unit, a guide rail connected to the positioning unit for carrying a substrate, a parts cassette arranged laterally of the guide rail, and a substrate carrying path by the guide rail. A tray feeder having a tray for storing chips above and a transfer for picking up chips mounted on the tray arranged above the parts cassette and the transport path and mounting them at predetermined coordinate positions on the substrate. A chip mounting device comprising a mounting head and a moving table for moving the transfer head in a horizontal direction.