JP3422319B2 - Chip mounting method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting method for mounting various types of chips provided in a part cassette or tray on a substrate. 2. Description of the Related Art In a chip mounting apparatus, a chip provided in a chip supply unit is picked up by a transfer head and transferred and mounted on a substrate. As the chip supply unit, for example, a part cassette such as a tape feeder, a tube feeder, or a bulk feeder having relatively small chips such as a resistive chip or a capacitor, or a tray having a relatively large chip such as a leaded chip. Is used. FIG. 5 is a plan view of a conventional chip mounting apparatus. In the figure, reference numeral 1 denotes a substrate, which is positioned by being clamped by a clamper. Reference numeral 3 denotes a guide rail connected to the clamper, and the substrate 1 is transported along a mounting line along the guide rail 3. A parts cassette 5 and a tray 6 are provided on both sides of the guide rail 3. Reference numeral 7 denotes a transfer head, which horizontally moves in the X and Y directions by a moving table. Reference numeral 9 denotes a Y-direction feed screw constituting the moving table. The feed screw in the X direction is not shown in the drawing. The transfer head 7 moves above the parts cassette 5 and the tray 6 according to computer programming, and picks up the chips provided therein by chucking the nozzles 8 and mounts the chips on the substrate 1 at predetermined coordinate positions. Q1 and Q2 are trajectories of the transfer head 7 for mounting the chips of the parts cassette 5 on the substrate 1, Q3 'and Q
Reference numeral 4 'denotes a trajectory of the transfer head 7 for mounting the chips of the tray 6 on the substrate 1. The pick-up position P of the chips provided in the parts cassette 5 is located at the tip of the parts cassette 5 and close to the guide rail 3. On the other hand, the pickup position of the chips provided on the tray 6 is on the entire surface of the tray 6. Therefore, the transfer head 7 has a moving area A ′ covering the entire surface of the tray 6.
Have to move. For this reason, the length of the feed screw 9 for moving the transfer head 7 in the Y direction is increased, so that not only the moving table becomes large, but also the trajectories Q3 'and Q4'.
Since the transfer head 7 has to move over the entire surface of the tray 6 as shown in FIG. 7, there is a problem that the moving stroke of the transfer head 7 becomes longer, the tact time becomes longer, and the chip mounting efficiency does not increase. Was. Accordingly, the present invention provides a chip mounting method capable of improving the chip mounting efficiency by reducing the moving area of a transfer head for transferring and mounting chips provided on a tray to a substrate. With the goal. [0006] For this purpose, a chip mounting method according to the present invention is applied to a tray feeder provided above a transport path for transporting a substrate in an X direction by a guide rail. Loading
The chip is picked up by the transfer head from the placed tray, and the transfer head is moved by the moving table to mount the chip at a predetermined coordinate position of the substrate positioned at the positioning portion connected to the transport path. Chip mounting method, wherein the tray feeder
The tip of the tray feeder is located on the conveyance path, and the moving area of the transfer head in the Y direction is
Set so as to include the pickup position of the chips of the tray placed on the section , and the tip of the tray feeder
All the chips of the tray are arranged so as to be located within the range of the moving area in the Y direction , and
The rear end of the tray feeder located outside the
This was a spare area for placing the ray . According to the present invention, a tray feeder is provided above a transport path for transporting a substrate by a guide rail.
The chip is picked up by the transfer head from the tray placed at the tip of the printer, and this chip is mounted on the substrate of the positioning section connected to the transport path, thereby reducing the transfer head movement area and reducing tact time. The time can be reduced, and the efficiency of chip mounting can be improved.
In particular, the movement area of the Y-direction of the transfer head, Toreifi
Set to include the pickup position of the chips on the tray placed at the tip of the feeder, and
By arranging all the chips in the tray at the leading end so as to be located within the range of the moving area in the Y direction, the width (moving stroke) of the moving area of the transfer head in the Y direction can be greatly reduced. it can. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a chip mounting device according to one embodiment of the present invention, FIG. 2 is a plan view of a chip mounting device according to one embodiment of the present invention, and FIG. 3 is a chip according to one embodiment of the present invention. FIG. 4 is a side view of a main part during chip mounting of an embodiment of the present invention. In FIGS. 1 and 2, the following elements are provided on the upper surface of the base 10. Reference numeral 11 denotes a substrate which is clamped and positioned by a clamper 12 provided at the center of the upper surface of the base 10. 13 is a clamper 12
The guide rail 13 is connected to the
The substrate 11 is carried into and out of the clamp position. On both sides of the guide rail 13, a number of parts cassettes 15 as a chip supply unit are arranged in parallel. The parts cassette 15 is provided with relatively small chips of various types, such as resistance chips and capacitor chips. Reference numeral 17 denotes a tray feeder on which the trays 16 are placed. Two tray feeders 17 are arranged on the left and right sides of the tray 11 so as to sandwich the conveyance path of the substrate 11 by the guide rails 13. The leading end of each tray feeder 17 is located on the transport path of the substrate 11 by the guide rail 13. Of each tray feeder 17 placed the four trays 16, two trays 16 are guide rails 13 are placed on the transport path of the substrate 11 by, also other two trays 16 Torre
The feeder 17 is placed in the spare area B at the rear end. As shown in FIG. 2, this spare area B is a transfer head.
It is located outside the range in the Y direction of the 30 moving areas A. In FIG. 1, a Y table 21 is installed on both sides of the base 10 so as to straddle the guide rails 13, and an X table 22 is installed on the Y table 21. In FIG. 2, a feed screw 23 and a rail 24 in the Y direction are accommodated in a Y table 21. 25 is a motor for rotating the feed screw 23. In FIG. 1, a feed screw 26 and a rail (not shown) in the X direction and a feed screw 26
Is stored. The present invention
Then, the transport direction of the substrate 11 by the guide rail 13 is set to X.
Direction and a direction orthogonal to the X direction is a Y direction (FIG. 1).
(See symbols X and Y) . In FIG. 1, reference numeral 30 denotes a transfer head.
The transfer head 30 has three nozzles 31 so that three chips can be mounted on the substrate 11 at one time. The transfer head 30 is connected to the feed screw 2 via a nut (not shown).
6. Therefore, when the motor 27 is driven to rotate the feed screw 26, the transfer head 30 moves in the X direction along the feed screw 26. When the motor 25 of the Y table 21 is driven to rotate the feed screw 23, the X table 22 moves on the Y table 21 in the Y direction, and the transfer head 30 also moves in the Y direction. Both ends of the X table 22 are connected to the feed screw 23 via nuts (not shown). As described above, the X table 22 and the Y table 21 move the transfer head 30 in the X direction and the Y direction.
It is a moving table that moves horizontally in the direction. Next, a mechanism for raising and lowering the substrate 11 will be described with reference to FIG. The clamper 12 is erected on an elevating plate 41. Nuts 42 are mounted on both sides of the lifting plate 41. A vertical feed screw 43 is screwed into the nut 42. Reference numeral 44 denotes a support frame for the feed screw 43,
It is attached to 0. Sliders 45 are mounted on both sides of the elevating plate 41, and the sliders 45 are slidably fitted on vertical guide rails 46 mounted on the inner surface of the support frame 44. A timing pulley 47 is mounted on the lower end of the feed screw 43. A timing belt 48 is tuned to the timing pulley 47.
When the motor 49 is driven and the timing belt 48 rotates, the feed screw 43 rotates, whereby the lifting plate 41 moves up and down along the guide rail 46. The substrate 11 shown by a chain line in FIG. 3 shows a state where the motor 49 is driven and the elevating plate 41 is raised. A base plate 51 is provided above the elevating plate 41. On the base plate 51, a large number of pins 52 for supporting the substrate 11 from below are erected. The pins 52 correct the deflection of the substrate 11 and maintain the flatness of the substrate 11. 53 is a plate for positioning the pins 52. The pin 52 is inserted into a pin hole formed in the plate 53. Numeral 54 is a support standing upright on the base plate 51 to support the plate 53. A bracket 55 is mounted on one side of the lower surface of the base plate 51. The bracket 55 penetrates the lifting plate 41, and a nut 55 a at the lower end thereof is screwed to a vertical feed screw 56. The feed screw 56 is the lifting plate 41
Is rotatably held by a bearing 57 mounted on the bearing.
The feed screw 56 is driven and rotated by a motor 58 provided at the center of the lifting plate 41. 59 and 60 are timing pulleys for transmission, and 61 is a timing belt. A guide rod 62 is provided vertically on the other side of the lower surface of the base plate 51. The guide rod 62 is slidably inserted into a guide ring 63 mounted on the elevating plate 41.
Therefore, when the motor 58 is driven and the feed screw 56 is rotated, the base plate 51 moves up and down with respect to the substrate 11. FIG.
A pin 52 indicated by a dashed line in FIG. 3 shows a state in which the base plate 51 is lifted, the substrate 11 is supported from below, the deflection of the substrate 11 is corrected, and its flatness is maintained. The chip mounting apparatus is configured as described above. Next, the operation of mounting the chip on the substrate 11 will be described. In FIG. 2, the transfer head 30 moves above the parts cassette 15, picks up a chip provided in the parts cassette 15 with the nozzle 31, and mounts the chip at a predetermined coordinate position on the substrate 11. Q1 and Q2 indicate the locus of the transfer head 30 at this time. The transfer head 30 moves above the tray 16, picks up the chips provided on the tray 16, and mounts the chips on the substrate 11 at a predetermined coordinate position. Q3 and Q4 show the trajectory of the transfer head 30 at this time. In FIG. 2, a tray 16 is provided on the transport path of the substrate 11. A is a moving area of the transfer head 30, and the range of the moving area A in the Y direction is set to include the pickup position P of the parts cassette 15. Further, as shown in the drawing, all the chips in the tray 16 are arranged so as to be located within the range of the moving area A in the Y direction. Therefore, the transfer head 3
The trajectories Q3 and Q4 of 0 are trajectories Q3 'and
It is shorter than Q4 ', and the moving stroke of the transfer head 30 is greatly reduced. Therefore, the chip can be moved at high speed to the substrate 1
1 can be mounted. Further, the moving stroke of the transfer head 30 in the Y direction is short, and the width of the moving area A in the Y direction is smaller than that in the conventional example. By arranging the tray 16 above the transport path of the substrate 11, a large difference in elevation occurs between the substrate 11 and the tray 16 as it is, and the vertical stroke of the nozzle 31 must be increased. The tact time becomes longer due to the ascent and descent. In order to solve such a problem, the substrate 11 is raised to a position shown by a chain line in FIG. As a result, the time required for elevating and lowering the nozzle 31 is reduced, and high-speed mounting is made possible. FIG. 4 shows a state in which the substrate 11 is raised and the chips provided on the tray 16 are mounted on the substrate 11. 32
Is a chip vacuum-chucked to the lower end of the nozzle 31. As shown, the substrate 11 is at substantially the same height as the tray 16, so that the nozzle 31 can mount the chip 32 on the substrate 11 with a short lifting stroke. According to the present invention, a tip of a tray feeder disposed above a transport path for transporting a substrate by a guide rail is provided.
The chip is picked up by the transfer head from the tray placed at the end, and this chip is mounted on the substrate of the positioning unit connected to the transport path, thereby reducing the transfer head moving area and reducing the tact time. And the efficiency of chip mounting can be improved. In particular, the movement area of the Y-direction of the transfer head, tray fees
Set so as to include the pick-up position of the chips on the tray placed at the tip of the
By arranging all the chips on the end tray so as to be located within the range of the moving area in the Y direction, the width (moving stroke) of the moving area of the transfer head in the Y direction can be greatly reduced. it can.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of a chip mounting apparatus according to an embodiment of the present invention. FIG. 4 is a side view of a substrate elevating mechanism of a chip mounting apparatus according to an embodiment of the present invention. FIG. 4 is a side view of a main part during chip mounting according to an embodiment of the present invention. 10 Base 11 Board 12 Clamper 13 Guide rail 15 Parts cassette 16 Tray 21 Y table 22 X table 30 Transfer head 41 Elevating plate 43 Feed screw 49 Motor

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-102696 (JP, A) JP-A-6-104597 (JP, A) JP-A-7-312496 (JP, A) JP-A-3-3 133805 (JP, A) JP-A-3-131100 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/00

Claims (1)

(57) [Claim 1] A substrate is mounted on a tray feeder disposed above a transport path for transporting a substrate in the X direction by a guide rail.
The chip is picked up by the transfer head from the set tray, and the transfer head is moved by the moving table so that the chip is mounted at a predetermined coordinate position of the substrate positioned at the positioning portion connected to the transport path. Chip mounting method, wherein the tip of the tray feeder
Unit is located on the transport path, and the transfer head Y
Direction moving area on the tip of the tray feeder.
The tray is set so as to include the pickup position of the chips on the placed tray , and the tray at the tip of the tray feeder is set.
It arranged so as to be located within the Y direction of the moving area of all chips Lee and Y direction range of the moving area
Tray the rear end of the tray feeder located outside the
A method for mounting a chip, comprising a spare area for mounting.