JP4346352B2 - Wafer transfer device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wafer transfer apparatus for use in transferring a wafer stored in one carrier to another carrier in a semiconductor device manufacturing process.
[0002]
[Prior art]
In the semiconductor device manufacturing process, particularly the wafer manufacturing process, there are various physical and chemical processes such as heat treatment, etching, and thin film formation on the wafer, and a circuit pattern is formed on the surface of the wafer through these processing processes. Is done. In this processing step, a plurality of wafers are stored in a case called a carrier for each lot, and the carriers are transferred to the next step in a state where the wafers are stored.
[0003]
However, it is necessary to transfer the wafer to another carrier during the process such as lot separation, integration, and wafer upside down. There are various cases for this transfer. For example, if the pitch of the transfer source carrier and the transfer destination carrier is the same, is the wafer in the original carrier separated and transferred to a different carrier? Or, conversely, depending on whether different carriers are integrated into one carrier, it is necessary to use different transfer devices each time. If the carrier pitch is different, the wafers cannot be batch processed and must be transferred one by one, requiring a large amount of equipment and time.
[0004]
Furthermore, even if the pitch is the same, it may be necessary to transfer to a carrier having a different shape (for example, cited document 1). As shown in the perspective view of FIG. 10, the changing device used for this has three setting surfaces of the carrier to be changed, and the shape is different at the same pitch by turning the handle and selecting the required setting surface. Multiple types of carriers can be installed in the same turnover device. However, with this reconfiguration apparatus, although it is possible to perform batch transfer, it is not possible to transfer only half of the wafers. Therefore, lots cannot be separated and integrated, and the wafer processing time is longer than necessary. The reason why only half of the wafers cannot be transferred is that the vertical positions of the carrier of the transfer source and the transfer destination are fixed, and the grooves of the corresponding carriers are also fixed, so the vertical positions are different. This is because the wafer cannot be transferred between the grooves. For example, a wafer stored in the fourth, fifth, and sixth grooves from the top of the transfer source carrier cannot be transferred to the first, second, and third grooves from the top of the transfer destination carrier.
[0005]
In some cases, wafers must be transferred one by one even if the carrier has the same pitch and shape (for example, cited document 2). As shown in the plan view of FIG. 11, the change-over apparatus used for this can divide and store a wafer from one carrier into three carriers by suction means and transfer arm one by one, and conversely, three carriers. The wafers inside can be integrated into one carrier. However, with this changeover device, a plurality of wafers cannot be transferred simultaneously at the same time. Therefore, the time required for wafer transfer becomes longer in proportion to the number of wafers to be transferred, and extra time is required for the wafer transfer operation. The reason is that a plurality of wafers cannot be transferred at the same time because the means for transferring the wafers is arm transfer for attracting and transferring the wafers one by one.
[0006]
[Patent Document 1]
JP 04-307754 ([0008], FIG. 1)
[Patent Document 2]
JP 03-029309 (page 3, FIG. 1)
[0007]
[Problems to be solved by the invention]
The present invention has been made to solve the above-described conventional problems, and in the semiconductor device manufacturing process, half of the wafers stored in the carrier can be simultaneously transferred (separated) to another carrier. An object of the present invention is to shorten the wafer processing time and improve the production efficiency by providing a wafer transfer device.
[0008]
[Means for Solving the Problems]
The wafer transfer apparatus according to the present invention includes two mounting tables for separately mounting the first and second carriers having the same shape in which a groove for storing a wafer is formed facing each other so that the wafer is horizontal. , comprising a drive mechanism for raising and lowering each of the mounting table independently, and a control section for controlling the drive mechanism, and a wafer housed in the first carrier extrusion plate transferring extruded to the second carrier, one lot Are mounted on the respective mounting bases with the first carrier storing even number of wafers and the empty second carrier, and the first carrier is raised by a predetermined height to form the empty second carrier. position shifting, the empty second carrier from the first carrier by plate extruding c Fine, collectively on filling a lot of half the wafer without drilling the upper side of the groove of the empty second carrier To the first carrier. The wafer is stored in the same position on the rear and the second carrier, the center of gravity of the first carrier and the second carrier is made the same, and the even number of wafers on the first carrier are placed on the first carrier and the second carrier. The carrier is separated into two , half .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of a carrier transfer apparatus according to the present invention, showing a state before lot separation. As shown in FIG. 1, in this embodiment, there are mounting tables 3a and 3b on which two carriers 2a and 2b having the same shape and having a plurality of grooves for storing a wafer 1 are mounted to face each other. Supports 4a and 4b for supporting the table, racks 5a and 5b for moving the supports up and down, gears 6a and 6b, motors 7a and 7b, a control unit 8 for controlling motor drive, and a wafer from the carrier 2a to the carrier 2b. The carrier 2a, 2b is mounted so that the stored wafer 1 may be horizontal. Although not shown in the figure, the pushing unit 10 has a built-in mechanism for reciprocating the pushing plate 9 in the horizontal direction, and this mechanism may be an automatic mechanism having a drive source or may be simply a manual mechanism. The control unit 8 is provided with a push button for driving operation.
[0014]
Further, in this embodiment, for convenience of explanation, the carriers 2a and 2b to be used are those that can store 12 wafers when full, and the number of wafers is 6 for one lot. . Further, when extruding the wafer from the carrier, the length of the extruding plate 9 in contact with the wafer is 6P, which is a half of 12P, which is the total pitch of the grooves in the carrier. The back portion of the carrier is an opening through which the push plate 9 can pass.
[0015]
Next, the operation of the present embodiment will be described. 1 to 4 are diagrams for sequentially explaining lot separation operations in the wafer transfer apparatus of the present invention. 5 to 8 are diagrams for sequentially explaining the lot integration operation in the wafer transfer apparatus of the present invention.
[0016]
First, the operation of lot separation will be described with reference to FIGS. In FIG. 1, a carrier 2a and a carrier 2b are set on the mounting tables 3a and 3b, respectively, at the same height and facing the wafer loading / unloading side. Six wafers 1 in a lot are accommodated in the groove in the carrier 2a in order from the top.
[0017]
Next, as shown in FIG. 2, when half of the six sheets in the carrier 2a are transferred to the carrier 2b and separated into three sheets, the "B" button of the control unit 8 is continuously pressed. When the “6” button indicating the number of lots is pressed, calculation processing for raising the carrier 2a by the groove pitch 3P is performed by the control unit 8, the motor 7a and the gear 6a are driven, and the rack 5a is present. The support column 4a is raised, and the mounting table 3a is raised by the groove pitch 3P.
[0018]
Next, as shown in FIG. 3, the pushing plate 9 is moved horizontally in the direction from the carrier 2a to the carrier 2b, and the fourth, fifth, and sixth wafers 1 from the top of the carrier 2a are pushed out to push out the carrier 2b. Store in. At this time, the first, second, and third wafers 1 in the carrier 2a remain in the carrier 2a.
[0019]
Next, as shown in FIG. 4, after the three wafers 1 are stored in the carrier 2b, the pushing plate 9 is returned to the initial position. A position sensor (not shown) recognizes that the extrusion plate 9 has returned to the initial position, and the mounting table 3a is driven by a motor 7a, a gear 6a, and a rack 5a for driving the column 4a based on a signal from the position sensor, The mounting table 3a descends and returns to the initial height. With the above operation, six wafers 1 in one lot are separated into three, and each can be stored in the same position of two carriers 2a and 2b having the same shape.
[0020]
As described above, according to the present invention, in the case of separation, a plurality of wafers can be accommodated simultaneously in the upper order without opening the upper groove on the separation destination carrier. That is, by performing lot separation with the apparatus of the present invention, the number of wafers of the two carriers and the position of the grooves to be stored can be made the same, so that the centers of gravity of the two carriers can be made equal. Therefore, even in the case of a semiconductor manufacturing apparatus in which the carriers need to be set with the same center of gravity of the two carriers, simultaneous processing can be performed by setting the two carriers separated by the apparatus of the present invention. Can be increased.
[0021]
Here, when the number of wafers in one lot is an odd number, the difference in the number of wafers in the two separated carriers becomes one, and the center of gravity is shifted by one wafer. The deviation of the center of gravity due to the difference is acceptable. The button operation in this case is, for example, in the case of transferring the lower four sheets while leaving the upper three out of the seven sheets in the transfer source carrier, the buttons are pressed in the order of “B”, “7”, “3”. Thus, it may be programmed in advance so that the transfer source carrier is raised by 3P.
[0022]
In addition, when the number of wafers of the two carriers and the position of the grooves to be stored cannot be made the same by separating, for example, in FIG. 1, the wafers are stored in the fourth, fifth, and sixth grooves from the top of the separation source carrier. If the transferred wafer is also transferred to the fourth, fifth, and sixth grooves from the top in the separation destination carrier, there is no wafer in the first, second, and third grooves of the separation destination carrier, and the center of gravity of the separation destination carrier is the separation source carrier. It will be below the center of gravity of the carrier. Conventionally, when two carriers having different centers of gravity are set in the semiconductor manufacturing apparatus and processed, the wafer is broken inside the apparatus, resulting in a decrease in yield and a decrease in production efficiency due to the stop of the apparatus. However, in the present invention, since the center of gravity is the same even when separated, such a situation can be solved.
[0023]
Next, the lot integration operation will be described with reference to FIGS. In FIG. 5, the carrier 2a and the carrier 2b are set on the mounting tables 3a and 3b at the same height and with the openings facing each other. Three wafers 1 are stored in the first, second, and third grooves from the top in the carrier 2a, and three wafers 1 are stored in the first, second, and third grooves in the carrier 2b. Has been.
[0024]
Next, as shown in FIG. 6, when the three wafers 1 of the carrier 2a are transferred to the carrier 2b and integrated, the “T” button of the control unit 8 shown in FIG. When the “6” button is pressed, the calculation process for raising the carrier 2b by the groove pitch 3P is performed by the control unit 8, the motor 7b and the gear 6b are driven, and the column 4b with the rack 5b is moved. The mounting table 3b rises by the groove pitch 3P while the three wafers 1 are stored in the carrier 2b.
[0025]
Next, as shown in FIG. 7, the pushing plate 9 is moved horizontally in the direction from the carrier 2a to the carrier 2b, and the first, second, and third wafers 1 from the top of the carrier 2a are pushed out to push out the carrier 2b. It is stored in the fourth, fifth and sixth grooves from the top inside. As a result, six wafers 1 are accommodated in the grooves in the carrier 2b in order from the top.
[0026]
Next, as shown in FIG. 8, the pushing plate 9 is returned to the initial position. A position sensor (not shown) recognizes that the extrusion plate 9 has returned to the initial position, and the mounting table 3b is driven by a motor 7b, a gear 6b, and a rack 5b that drive the column 4b based on a signal from the position sensor. The mounting table 3b descends and returns to the initial height. With the above operation, the wafers stored in three separate carriers are integrated into one lot 6 sheets above one carrier.
[0027]
Further, according to the present invention, in the case of integration, a plurality of wafers are simultaneously transferred from the integration source carrier from the uppermost groove of the portion where no wafer is stored in the integration destination carrier to the lower groove corresponding to the required number. Therefore, it is possible to easily make a state where there is no empty groove between the wafers in the integration destination carrier. If there is a vacant groove between the wafers of the integration destination carrier, an operation to insert a dummy wafer is added to the groove, or if the semiconductor manufacturing equipment in the next process is a single sheet, the device recognizes the vacant groove as a missing wafer. The production efficiency decreases, such as stopping. However, in the present invention, such a situation can be solved because no empty groove is generated.
[0028]
Next, another embodiment of the present invention will be described. As shown in the configuration diagram of FIG. 9, the present embodiment includes carrier mounting tables 3a and 3b, supporting columns 4a and 4b that support the mounting tables 3a and 3b, and both sides of the carriers 2a and 2b that are mounted on the mounting tables and face each other ( Set up the raising distance of the columns 4a, 4b, and the vertical mechanism consisting of the racks 5a, 5b and gears 6a, 6b that independently raise and lower the wafer extruding portions 10a, 10b arranged on the back side) And the dials 11a and 11b for manually raising and lowering the support column and lowering it to the initial height.
[0029]
First, when performing the lot separation operation of the wafers stored in the carrier 2a, it is performed by one column up-and-down mechanism and the pushing unit 10a, and when performing the lot integration operation of the wafers stored in the carriers 2a and 2b, This is performed by the up-and-down support mechanism and the extruding part 10b. Each dial 11a, 11b has a scale that matches the number of wafers in the lot in advance. By turning the dial on the scale, the carrier moves up through gears, racks, etc., and by pushing the push-out part, lot separation or lot integration is performed. Is possible. After returning the pushing portion to the initial position, when the dial is turned to the initial position, the raised carrier is lowered to the initial height.
[0030]
【The invention's effect】
Described so as have, according to the present invention, it is possible to easily perform separation operation because that can be simultaneously separating housing half in one carrier wafer to another carrier.
[0031]
That is, at the time of lot separation, there is a mechanism for raising the separation source carrier by a half pitch (3P in FIG. 2) of the groove pitch (6P in FIG. 1), so half of the number of wafers is transferred simultaneously. It becomes possible to change .
[0032]
Thus the present invention, at the same time it is possible to reduce the processing time since it is possible to separate in a batch process, at the same time a plurality of wafers without opening the upper side of the groove of the minute Hanaresaki carrier on filling Since it can be stored, the centers of gravity of the two carriers can be made equal. Accordingly, the operating rate of the semiconductor manufacturing apparatus can be improved and the production efficiency can be increased.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing a state before lot separation in an embodiment of the present invention.
FIG. 2 is a configuration diagram showing a state in which a transfer source carrier is raised in an embodiment of the present invention.
FIG. 3 is a configuration diagram showing a state in which lots are separated in an embodiment of the present invention.
FIG. 4 is a configuration diagram showing a state where lot separation is completed in an embodiment of the present invention.
FIG. 5 is a configuration diagram showing a state before lot integration in an embodiment of the present invention.
FIG. 6 is a configuration diagram showing a state in which a transfer destination carrier is raised in an embodiment of the present invention.
FIG. 7 is a configuration diagram showing a state in which lots are integrated in an embodiment of the present invention.
FIG. 8 is a configuration diagram showing a state in which lot integration is completed in an embodiment of the present invention.
FIG. 9 is a block diagram showing another embodiment of the present invention.
FIG. 10 is a perspective view showing a conventional configuration.
FIG. 11 is a plan view showing a conventional configuration.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Wafer 2a, 2b Carrier 3a, 3b Mounting base 4a, 4b Support | pillar 5a, 5b Rack 6a, 6b Gear 7a, 7b Motor 8 Control part 9 Extrusion board 10, 10a, 10b Extrusion part 11a, 11b Dial

Claims (3)

And two mounting table the first and second carrier of the same shape in which a groove is formed for accommodating the wafer the wafer is placed separately are opposed so as to horizontally, independently of each of said mounting table A drive mechanism that moves up and down,
Wherein and a control unit for controlling the drive mechanism, and a pushing plate which transferring extruded to the second carrier the wafer housed in the first carrier,
One lot was placed even number wherein the wafer is housed in the first carrier and the empty second carrier to each of the mounting table, thereby the first carrier is raised a predetermined height sky shifting the position of said second carrier, said wafer to empty the second carrier from the first carrier by the extrusion plate, it is spaced the groove of the upper side of the empty second carrier Instead, half of the lots of the wafers are transferred in a batch, and the wafers are accommodated in the same positions of the first carrier and the second carrier, and the first carrier and the second carrier The wafer center transfer is characterized in that the even number of wafers of the first carrier are separated into two by half, the first carrier and the second carrier , with the same center of gravity position of the carrier of the first carrier. apparatus. Vertical drive mechanism of the two mounting table according to claim 1 Symbol placement of the wafer sorter, characterized in that only move up and down a total pitch of the carrier groove corresponding to the sorting number of wafers by the respective control unit. The length of the pushing plate in contact with the sorting wafers claim 1 Symbol placement of the wafer sorter, characterized in that the length of half the total number of pitches of the carrier groove.

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