TWI663671B - Wafer conversion device and wafer conversion method - Google Patents

Abstract

A wafer conversion device can be used for placing a first carrier and a second carrier. The first carrier is formed with a plurality of first receiving grooves arranged at an interval from each other. Each of the first receiving grooves is used for A wafer is accommodated, and the second carrier is formed with a plurality of second accommodation grooves arranged at an interval from each other. The number of the first accommodation grooves is different from the number of the second accommodation grooves. The conversion device includes a base, a first positioning frame, a second positioning frame, a height adjusting mechanism, and a pushing mechanism. The first carrier and the second carrier are placed on the first and second positioning frames, respectively, and the height adjustment mechanism can drive the first carrier to switch between a first height position and a second height position, and then The wafer in the first carrier is pushed into the second carrier by the pushing mechanism.

Description

Wafer conversion device and wafer conversion method

The present invention relates to a conversion device, and particularly to a wafer conversion device for transferring and transferring wafers in one carrier to another carrier.

In the semiconductor manufacturing process, the wafers need to be processed by a variety of machines, and the wafers are moved between different process machines through the carrier device to ensure that the wafers will not be damaged during the movement. In order to match the machine and process environment required for different processes, the wafers need to be stored in different configurations of the carrier device. When the wafer is to be transferred between different carrier devices, the wafer conversion device is used to assist the wafer between the two. Safely interchange positions between different bearing devices. The concept of using the wafer conversion device is that the operator first places the carrier device to be transferred out of the wafer and the carrier device to receive the wafer in a specified position on the wafer conversion device in order. After confirming that the positions of the two carrier devices are correct, Then, the moving mechanism of the wafer conversion device is used to transfer the wafers in the carrier device to be transferred out to the carrier device to receive the wafers. After confirming that the transfer operation is completed, the operator sequentially removes the two carrier devices.

However, the conventional wafer conversion device can only tolerate two load capacities. The same amount of carrier devices exchange wafers with each other. How to allow two carrier devices with different load capacities to exchange wafers with each other will improve the overall process efficiency, which is a topic worthy of research.

Therefore, an object of the present invention is to provide a wafer conversion device capable of performing wafer exchange between two carriers having different numbers of wafers.

Another object of the present invention is to provide a wafer conversion method for a wafer conversion device that performs wafer exchange between two carriers having different numbers of wafers.

Therefore, the wafer conversion device of the present invention can be used for placing a first carrier and a second carrier. The first carrier is formed with a plurality of first receiving grooves spaced from each other. The groove is used for accommodating a wafer, and the second carrier is formed with a plurality of second accommodating grooves which are spaced up and down. The number of the first accommodating grooves is different from the number of the second accommodating grooves. The wafer conversion device includes: a first positioning frame disposed on the base, the first positioning frame including a front end and a rear end opposite to the front end; a second positioning frame disposed on the base and Located at the rear end of the first positioning frame, the second positioning frame is used to carry and position the second supporting frame; a height adjusting mechanism is provided on the first positioning frame, and the height adjusting mechanism is used to carry the first The carrier can adjust the first carrier from a first height position to a second height position higher than the first height position. When the first carrier is at the first height position, the first All of one accommodation slot and one of the second accommodation slots And wherein the other part receiving groove position aligned with each other when the first carrier in the second height position, The positions of all the accommodation grooves of one of the first accommodation grooves and the second accommodation grooves and the other of the other accommodation grooves are aligned with each other; and a pushing mechanism is slidably disposed on the base. And is located at the front end of the first positioning frame, the pushing mechanism can be moved in a pushing direction from front to back, for aligning the first containers with the positions of the second containers The wafers in the slot are pushed from the first receiving slot into the second receiving slot.

In some embodiments, the height adjustment mechanism includes a first bearing plate and a second bearing plate. The height of the first bearing plate is less than the height of the second bearing plate, the first bearing plate and the second bearing plate. One of the supporting plates is optionally disposed on the first positioning frame. The first supporting plate can support the first supporting frame to be positioned at the first height position, and the second supporting plate can support the first supporting frame. Position it at this second height position.

In some embodiments, the first positioning frame includes a positioning plate, two limiting plates protruding from the surface of the positioning plate and spaced left and right, and a positioning defined by the limiting plates and the positioning plate. One of the first bearing plate and the second bearing plate can be selectively clamped in the positioning groove.

In some embodiments, the second positioning frame includes a bearing seat disposed on the base, and a mounting jig. A surface of the bearing seat is recessed to form a placement groove, and the installation jig is snapped to the placement groove. Inside, the mounting jig includes two side walls spaced from left to right, each of the side walls is formed with a plurality of guide grooves spaced up and down, the second carrier is joined to the rear side of the mounting jig, and the second The accommodating grooves are respectively aligned with the positions of the guide grooves, and each of the guide grooves is used to guide the corresponding wafer to move into the corresponding second accommodating groove.

In some embodiments, the supporting base includes a substrate with the placement groove formed thereon, and a blocking plate protruding from the rear end of the substrate to block the second supporting frame.

In some embodiments, the base includes a vertical wall, the first positioning frame and the second positioning frame are disposed on the vertical wall, and the height adjustment mechanism includes a slidably connected to the first positioning frame and can carry the A sliding frame of a first supporting frame, and a rotating component disposed on the first positioning frame and connected to the sliding frame, the rotating component can drive the first supporting frame in the first direction through the sliding frame in the up and down direction. Move between the height position and the second height position.

In some embodiments, the ejection mechanism includes a ejector guide plate and a plurality of ejectors, each ejector is used to eject a corresponding wafer, and the end surface of each ejector is recessed to form a groove, and the groove The thimble extends between the left and right ends of the thimble, and the longitudinal section of the groove is a V-shaped opening. The thimble guide plate is provided on the base and has a plurality of perforations the same as the thimbles. The thimbles penetrate the setting positions.

In some embodiments, the sliding frame includes a vertical plate slidably connected to the first positioning frame, the vertical plate is formed with a card slot, and the vertical plate has a surrounding surface defining the card slot, and the surrounding The surface has a lower side portion and an upper side portion. The rotating component includes a rotating shaft pivotally connected to the first positioning frame, a knob provided at one end of the rotating shaft for rotation, and a fixed connection to the other end of the rotating shaft. An eccentric shaft and a set of bearings provided on the eccentric shaft, the rotating shaft and the central axis of the eccentric shaft are parallel and spaced from each other, the bearing is penetrated in the card slot and is respectively engaged with the lower side portion and the on Side.

In some embodiments, the eccentric shaft includes a shaft member and a latch for fixing the shaft member to the rotating shaft.

In some embodiments, the sliding frame further includes a bearing plate disposed on the vertical plate and perpendicular to the bearing plate. The height adjustment mechanism further includes a mounting jig provided on the bearing plate. The mounting jig includes two The left and right side walls are spaced apart, and each of the side walls is formed with a plurality of guide grooves spaced up and down. The first carrier is connected to the mounting fixture and is located on the front side of the two side walls. When the guide grooves are aligned, each guide groove is used to guide the corresponding wafer to move into the corresponding second accommodating groove.

In some embodiments, the first positioning frame includes a first guide rail fixed to the vertical wall, a second guide rail fixed to the vertical wall and spaced behind the first guide rail, the first guide rail and the second guide rail. The guide rails are respectively elongated and parallel to the up-and-down direction. The vertical plate is disposed between the first rail and the second rail, and the vertical plate abuts the first rail and the second rail, respectively.

The wafer conversion method of the wafer conversion device of the present invention is suitable for transferring and transferring a wafer carried by a first carrier to a second carrier. The first carrier is formed with a plurality of first and second spaced-apart first arrays. Receiving slots, each of the first receiving slots is used to receive a wafer, the second carrier is formed with a plurality of second receiving slots arranged at an interval from each other, and the number of the first receiving slots is less than the number of the first receiving slots. After waiting for the number of the second accommodating slots, the method includes the following steps: an installation step of installing the first carrier and the second carrier separately on a high Degree adjusting mechanism and a positioning frame, so that the first supporting frame is located at a first height position, the positions of the first receiving grooves and some of the second receiving grooves are aligned with each other; A pushing step, pushing the wafers in the first accommodating slot and the second accommodating slot aligned with each other through a pushing mechanism from the first accommodating slot to the second accommodating slot In the groove; in the replacement step, the empty first carrier is removed from the height adjustment mechanism; in the height adjustment step, another first carrier with full wafers is installed in the height adjustment mechanism, and the height adjustment mechanism The other first carrier is adjusted to a second height position higher than the first height position, so that the first receiving grooves and the second receiving grooves of the other first carrier are The positions of the other receiving grooves are aligned with each other; and the second pushing step is to push the first receiving grooves aligned with the other receiving grooves of the second receiving grooves through the pushing mechanism. The wafers to push the wafers from the first receiving slots to Etc. The second receiving groove.

In some implementation forms, the number of the first receiving slots is one-half of the number of the second receiving slots, and the number of the second receiving slots is an even number. In the installation step, the The first receiving grooves are aligned with the second receiving grooves at even positions, respectively. In the height adjustment step, the first receiving grooves are respectively aligned with the second receivers at odd positions. The slots are aligned with each other.

The wafer conversion method of the wafer conversion device of the present invention is suitable for transferring and transferring a wafer carried by a first carrier to a second carrier. The first carrier is formed with a plurality of first and second spaced-apart arrays. An accommodating slot, each of the first accommodating slots is used for accommodating a wafer, and the second carrier is formed with A plurality of second accommodating slots spaced apart from each other, the number of the first accommodating slots is greater than the number of the second accommodating slots, the method includes the following steps: an installation step, the first carrier and the The second carrier is respectively mounted on a height adjustment mechanism and a positioning frame, so that the first carrier is located at a first height position, and a part of the receiving grooves in the first receiving grooves and the second receiving grooves. The positions are aligned with each other; in the first pushing step, the wafers in the first receiving slots that are aligned with the positions of the second receiving slots are aligned with each other by a first pushing mechanism. Push into the second accommodating slots; replace step, move the second carrier full of wafers away from the positioning frame, and install another empty second carrier on the positioning frame; height adjustment step By adjusting the first carrier to a second height position higher than the first height position through the height adjustment mechanism, so that another part of the first accommodation grooves and the other empty space The positions of the second receiving slots of the second carrier are aligned with each other; and The second pushing step pushes the wafers in the other receiving grooves of the first receiving grooves which are aligned with the positions of the second receiving grooves through the pushing mechanism, so as to push the crystals. The circle is pushed from the first receiving grooves into the second receiving grooves.

In some implementation forms, the number of the first receiving slots is twice the number of the second receiving slots, and the number of the first receiving slots is an even number. In the installation step, the second receiving slots The accommodating grooves are aligned with the first accommodating grooves at even positions, respectively. In the height adjustment step, the second accommodating grooves are respectively with the first accommodating grooves at odd positions. Align with each other.

The effect of the invention lies in that: driven by the height adjustment mechanism When the first carrier is in the first height position and the second height position, the wafers are transferred from the first carrier to the second carrier by the pushing mechanism, and the first carrier and the second carrier The number of wafers that can be accommodated in the carrier frame is different, so that the purpose of changing wafers between different carrier devices can be achieved.

100‧‧‧ Wafer Conversion Device

200‧‧‧ Wafer Conversion Device

1‧‧‧ base

2‧‧‧The first positioning frame

21‧‧‧ Positioning plate

22‧‧‧ limit plate

23‧‧‧ positioning groove

24‧‧‧Front

25‧‧‧ backend

3‧‧‧Second Positioning Frame

31‧‧‧bearing seat

311‧‧‧ substrate

312‧‧‧ barrier

313‧‧‧Slot

32‧‧‧Mounting fixture

321‧‧‧ sidewall

322‧‧‧Guide groove

4‧‧‧ height adjustment mechanism

41‧‧‧The first bearing plate

42‧‧‧Second loading plate

5‧‧‧ Pushing mechanism

51‧‧‧ connecting rod

52‧‧‧ Pusher

6‧‧‧first carrier

61‧‧‧first receiving slot

62‧‧‧First opening

63‧‧‧Second opening

7‧‧‧Second carrier

71‧‧‧Second accommodation slot

8‧‧‧ wafer

1'‧‧‧ base

11'‧‧‧ Libi

2'‧‧‧first positioning frame

21'‧‧‧First rail

22'‧‧‧Second Rail

23'‧‧‧Front

24'‧‧‧Back

25'‧‧‧Locking plate

251'‧‧‧ pivot hole

3'‧‧‧Second Positioning Frame

4'‧‧‧ height adjustment mechanism

41'‧‧‧Slider

42'‧‧‧Rotary components

43'‧‧‧Mounting fixture

431'‧‧‧ sidewall

432'‧‧‧Guide

44'‧‧‧ stand

441'‧‧‧Card Slot

442'‧‧‧ around

442a'‧‧‧ upper side

442b'‧‧‧ lower side

45'‧‧‧carrying plate

46'‧‧‧Shaft

47'‧‧‧ knob

471'‧‧‧indication slot

48'‧‧‧eccentric shaft

481'‧‧‧Shaft

482'‧‧‧ Bolt

49'‧‧‧bearing

5'‧‧‧ Pushing mechanism

50'‧‧‧ connecting rod

51'‧‧‧ thimble

511'‧‧‧ Trench

52'‧‧‧ thimble guide plate

521'‧‧‧Perforated

6'‧‧‧first carrier

61'‧‧‧First receiving slot

62'‧‧‧First opening

63'‧‧‧Second opening

7'‧‧‧Second carrier

71'‧‧‧Second accommodation slot

P‧‧‧ Pushing direction

D‧‧‧ Reset direction

D1‧‧‧ Up and down direction

H1, H2‧‧‧ height

L1, L2‧‧‧ center axis

Steps S1 ~ S5‧‧‧‧

S1 '~ S5'‧‧‧ steps

Other features and effects of the present invention will be clearly presented in the detailed description of the embodiment with reference to the drawings, in which: FIG. 1 is a perspective view illustrating a first embodiment of the wafer conversion device of the present invention; FIG. 2 is a A partial cross-sectional front view illustrating a first carrier of the first embodiment at a first height position; FIG. 3 is a partial cross-sectional front view illustrating the first carrier of the first embodiment at a second height Position; FIG. 4 is a top view illustrating a state in which a pushing mechanism of the first embodiment has not pushed a plurality of wafers, and the wafers are located on the first carrier; FIG. 5 is a top view illustrating the first A pushing mechanism of the embodiment pushes the wafers from the first carrier to a second carrier; FIG. 6 is a schematic flowchart illustrating a wafer conversion method of the wafer conversion device of the present invention, which is applicable In the first embodiment; FIG. 7 is a partially enlarged view of FIG. 2, illustrating that the wafers are located in a plurality of first receiving grooves of the first carrier; FIG. 8 is a partially enlarged sectional front view, illustrating The wafers are pushed to the second carrier by the pushing mechanism A second plurality of frame receiving groove; FIG. 9 is a partial enlarged view of FIG. 3, the description of the wafers positioned such An accommodation slot; FIG. 10 is a partially enlarged sectional front view showing that the wafers are pushed into the second accommodation slots by the pushing mechanism; FIG. 11 is a perspective view illustrating the wafer conversion of the present invention A second embodiment of the device; FIG. 12 is a perspective view, which is another perspective of FIG. 11; FIG. 13 is a partial exploded view, illustrating a rotating assembly and a vertical plate of the second embodiment; FIG. 14 is a partial perspective An exploded view is another perspective of FIG. 13; FIG. 15 is a partial cross-sectional side view illustrating the rotary assembly and the vertical plate of the second embodiment; FIG. 16 is a partial perspective view illustrating a thimble and a groove of the thimble; FIG. 17 is a side view of FIG. 16; FIG. 18 is a partial cross-sectional front view illustrating the first carrier at a first height position, and the wafers are located in the first receiving grooves; FIG. 19 is a partial cross-sectional side A view showing that an eccentric shaft of the rotary assembly is at a first height position; FIG. 20 is a partial cross-sectional front view showing that the first carrier is at a second height position, and the wafers are located in the first receiving grooves; FIG. 21 is a partial cross-sectional side view illustrating the The eccentric shaft of the rotating assembly is at the second height position; FIG. 22 is a schematic flowchart illustrating a wafer conversion method of the wafer conversion device of the present invention, which is applicable to the second embodiment; FIG. 23 is a partial cross-sectional side view illustrating the Wait for the thimble at the first height Position to push the wafers into the second receiving grooves; and FIG. 24 is a partial cross-sectional side view illustrating that the ejectors push the wafers into the second receiving grooves at the second height position .

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

Referring to FIG. 1 and FIG. 2, the first embodiment of the wafer conversion device 100 of the present invention can be used to place a first carrier 6 and a second carrier 7. The first carrier 6 is formed with a plurality of upper and lower spaced arrays. The first accommodating groove 61, a first opening 62, and a second opening 63 opposite to the first opening 62 are used for accommodating a wafer 8. The second carrier 7 is formed with a plurality of second accommodating grooves 71 which are spaced from each other. The number of the first accommodating grooves 61 is different from the number of the second accommodating grooves 71. The wafer conversion device 100 of the first embodiment includes a base 1, a first positioning frame 2, a second positioning frame 3, a height adjusting mechanism 4, and a pushing mechanism 5. In this embodiment, the first carrier 6 is a Teflon wafer box, the second carrier 7 is a quartz crystal boat, the number of the second receiving slots 71 is an even number, and the number of the first receiving slots 61 is even. The number is smaller than the number of the second accommodating slots 71, and the number of the first accommodating slots 61 is one half of the number of the second accommodating slots 71. Among them, the number of the first accommodating slots 61 is 25. The number of the accommodating slots 71 is 50 as an example, but is not limited thereto.

The first positioning frame 2 is disposed on the base 1. The first positioning frame 2 includes a positioning plate 21, two limiting plates 22 protruding from the surface of the positioning plate 21 and spaced left and right, and a positioning plate 21 and the limiting positions. Positioning groove 23 defined by the plate 22 , A front end 24, and a rear end 25 opposite to the front end 24. The first opening 62 of the first bearing base 31 faces the front end 24, and the second opening 63 faces the rear end 25.

The second positioning frame 3 is disposed on the base 1 and located at the rear end 25 of the first positioning frame 2. The second positioning frame 3 is used to carry and position the second supporting frame 7. The second positioning frame 3 includes a supporting base 31 and a mounting fixture 32 provided on the base 1. The surface of the supporting base 31 is recessed to form a placement groove 313. The mounting fixture 32 is snapped into the placement groove 313 to install the fixture. 32 includes two side walls 321 spaced from left to right, and each side wall 321 is formed with a plurality of guide grooves 322 spaced from each other. The second carrier 7 is coupled to the rear side of the mounting jig 32, and the second receiving grooves 71 are aligned with the guiding grooves 322 respectively. In this embodiment, the number of the guide grooves 322 is the same as the number of the second accommodating grooves 71, and they are all 50, but it is not limited thereto, as long as the number is the same.

Referring to FIGS. 1 to 3, the height adjustment mechanism 4 is disposed on the first positioning frame 2 to carry the first supporting frame 6 and can adjust the first supporting frame 6 from a first height position (as shown in FIG. 2) to A second height position higher than the first height position (as shown in FIG. 3). The height adjustment mechanism 4 includes a first bearing plate 41 and a second bearing plate 42. The height H1 of the first bearing plate 41 is smaller than the height H2 of the second bearing plate 42. One of the first load bearing plate 41 and the second load bearing plate 42 can be selectively clamped in the positioning groove 23 of the first positioning frame 2. The height adjusting mechanism 4 can pass the first load bearing plate 41 and the second load bearing plate 42. To adjust the first carrier 6 to switch between the first height position and the second height position. The first carrier plate 41 can carry the first carrier frame 6 at a first height position, and the second carrier plate 42 can carry the first carrier frame 6 Located at this second height position. When the first carrier 6 is at the first height position, the positions of all the receiving slots of one of the first receiving slots 61 and the second receiving slots 71 and a part of the receiving slots of the other are aligned with each other. . When the first supporting frame 6 is at the second height position, all the receiving slots of one of the first receiving grooves 61 and the second receiving slot 71 and the other part of the other receiving slots are positioned to each other. Aligned. Specifically, in this embodiment, as shown in FIG. 2, when the first carrier 6 is at the first height position, all the receiving grooves of the first receiving grooves 61 and the second receiving grooves The even-numbered receiving grooves (numbered from top to bottom) of 71 are aligned with each other; as shown in FIG. 3, when the first carrier 6 is at the second height position, all the receiving grooves of the first receiving grooves 61 The odd-numbered receiving grooves (counted from the top to the bottom) of the second receiving grooves 71 are aligned with each other.

Referring to FIGS. 1 to 5, the pushing mechanism 5 is slidably disposed on the base 1 and located at the front end 24 of the first positioning frame 2, and can be moved in a pushing direction P from front to back, for The wafers 8 in the first receiving grooves 61 that are aligned with each other in the second receiving grooves 71 are pushed into the second receiving grooves by the first receiving grooves 61. The pushing mechanism 5 includes a long connecting rod 51 and a rectangular pushing plate 52. The connecting rod 51 is slidably disposed on the base 1 and extends in a direction perpendicular to the base 1. The pushing plate 52 is provided on The connecting rod 51 extends in the pushing direction P.

Referring to FIG. 6, the wafer conversion method of the wafer conversion apparatus 100 of this embodiment is suitable for transferring and transferring the wafer 8 carried by the first carrier 6 into the second carrier 7. The conversion method includes the following steps: Installation step S1, a first push step S2, a replacement step S3, a height adjustment step Step S4, and a second pushing step S5.

Referring to FIG. 4, FIG. 6, and FIG. 7, in the mounting step S1, the second carrier 7 is first connected to the rear side of the mounting fixture 32, and then the first carrier 6 is mounted on the first carrier plate of the height adjustment mechanism 4. 41, and the mounting jig 32 is snapped into the placement groove 313 of the second positioning frame 3. At this time, the first carrier 6 is located at the first height position, and the positions of all the accommodation grooves of the first accommodation grooves 61 and some of the accommodation grooves of the second accommodation grooves 71 are aligned with each other. In this embodiment, In the embodiment, all the receiving grooves in the first receiving grooves 61 and the even-numbered receiving grooves in the second receiving grooves 71 are aligned with each other.

Referring to FIGS. 5, 6 and 8, in the first pushing step S2, the user can push the connecting rod 51 of the pushing mechanism 5 by hand to move the pushing plate 52 in the pushing direction P. During the movement of the ejection plate 52 in the ejection direction P, the ejection plate 52 penetrates into the first opening 62 of the first carrier 6, and then the ejection plate 52 ejects the even-numbered positions of the second accommodation slots 71. The wafers 8 in the first receiving grooves 61 in which the grooves are aligned with each other are moved, so that each wafer 8 is moved away from the first receiving grooves 61 and guided by the corresponding guide grooves 322 of the mounting fixture 32 Then, it moves into the corresponding second accommodation groove 71. After each wafer 8 moves to the corresponding second accommodating slot 71, the user can move the pushing mechanism 5 in a reset direction D opposite to the pushing direction P by pulling the connecting rod 51 of the pushing mechanism 5 by hand. Go to an initial position shown in FIG. 4.

Referring to FIG. 6 and FIG. 9, in the replacement step S3, the empty first carrier 6 is moved away from the first carrier plate 41.

In the height adjustment step S4, the first bearing plate 41 is first moved away from the positioning groove 23 of the first positioning frame 2, and then the second bearing plate 42 is mounted on the In the positioning groove 23, another first carrier 6 full of wafers 8 is mounted on the second carrier plate 42 of the height adjustment mechanism 4. By replacing the first carrier plate 41 with the second carrier plate 42, the other first carrier 6 which is fully loaded with the wafer 8 can be adjusted to the second height position, so that the other first carrier 6 The positions of the first accommodating grooves 61 and the other accommodating grooves in the second accommodating grooves 71 are aligned with each other. In this embodiment, all of the accommodating grooves of the first accommodating grooves 61 are aligned with The odd-numbered receiving grooves in the second receiving grooves 71 are aligned with each other.

Referring to FIGS. 5, 6 and 10, in the second pushing step S5, the user can push the connecting rod 51 of the pushing mechanism 5 by hand to move the pushing plate 52 in the pushing direction P. During the movement of the pushing plate 52 in the pushing direction P, the pushing plate 52 penetrates into the first opening 62 of the first carrier 6, and then the pushing plate 52 pushes against the odd positions in the second receiving slots 71. The wafers 8 in the first accommodating grooves 61 in the second accommodating grooves 71 aligned with each other are moved, so that each wafer 8 is moved away from the first accommodating grooves 61 and correspondingly guided by the mounting fixture 32. The guide groove 322 guides and moves into the corresponding second accommodation groove 71. This completes the step of converting wafer 8 from two 25-piece Teflon wafer cassettes to a 50-piece quartz wafer boat.

Referring to FIG. 11 and FIG. 12, a second embodiment of the wafer conversion device of the present invention may be used to place a first carrier 6 ′ and a second carrier 7 ′. The first carrier 6 ′ is formed with a plurality of upper and lower phases. The first accommodating grooves 61 ′ (as shown in FIG. 18) arranged at intervals, a first opening 62 ′ at the front end, and a second opening 63 ′ at the rear end opposite to the first opening 62 ′, each of which The first receiving groove 61 ′ is used to receive a wafer 8. The second carrier 7 'is formed with a plurality of upper brackets 7'. The number of the first accommodating grooves 61 ′ and the number of the second accommodating grooves 71 ′ are different from each other. The wafer conversion device 200 of the second embodiment includes a base 1 ′, a first positioning frame 2 ′, a second positioning frame 3 ′, a height adjustment mechanism 4 ′, and a pushing mechanism 5 ′. In this embodiment, the first carrier 6 ′ is a quartz crystal boat, and the second carrier 7 ′ is a Teflon wafer box. The number of the first accommodation grooves 61 ′ is an even number, and the first accommodation The number of the grooves 61 ′ is greater than the number of the second receiving grooves 71 ′. The number of the first receiving grooves 61 ′ is twice the number of the second receiving grooves 71 ′. The number of the first receiving grooves 61 ′ is 50. For example, the number of the second accommodating grooves 71 ′ is 25, but not limited thereto.

The base 1 'includes a standing wall 11'. The first positioning frame 2 'includes a front end 23', a rear end 24 'opposite to the front end 23', a first rail 21 'fixed to the vertical wall 11', and a first rail fixed to the vertical wall 11 'and spaced from the first rail. A second guide rail 22 'on the rear side of 21', and a locking plate 25 'fixed to the first guide rail 21' and the second guide rail 22 '. The first guide rail 21 ′ and the second guide rail 22 ′ are respectively elongated and extend along an up-down direction D1. The second positioning frame 3 ′ is disposed on the vertical wall 11 ′ and is located at the rear end 24 ′ of the first positioning frame 2 ′ for carrying and positioning the second supporting frame 7 ′.

Referring to FIG. 11, FIG. 12, and FIG. 13, the height adjustment mechanism 4 ′ is disposed on the first positioning frame 2 ′ for carrying the first supporting frame 6 ′ and can adjust the first supporting frame 6 ′ from a first height position to A second height position higher than the first height position. The height adjustment mechanism 4 'includes a sliding frame 41' slidably connected to the first positioning frame 2 'and can bear the first supporting frame 6', and a sliding frame 41 'disposed on the first positioning frame 2' and opposite to the sliding frame 41 '. Connected swivel assembly 42 ', And a mounting fixture 43 'disposed on the sliding frame 41'. The sliding frame 41 'includes a vertical plate 44' slidably connected between the first guide rail 21 'and the second guide rail 22' of the first positioning frame 2 ', and a bearing provided on the vertical plate 44' and perpendicular thereto. Plate 45 '. The vertical plate 44 'is formed with a latching groove 441', and has a surrounding surface 442 'defining the latching groove 441'. The surrounding surface 442 'has a lower side surface portion 442b' and an upper side surface portion 442a '. The carrying plate 45 'is used to carry the mounting fixture 43' and the first carrying frame 6 '. The rotating component 42 'can drive the first supporting frame 6' between the first height position and the second height position through the sliding frame 41 'in the up-down direction D1. The mounting fixture 43 'includes two side walls 431' spaced from left to right, and each side wall 431 'is formed with a plurality of guide grooves 432' (shown in Fig. 18) spaced apart from each other. The mounting fixture 43 ′ is located on the front side of the two side walls 431 ′. The first receiving grooves 61 ′ are aligned with the guide grooves 432 ′, and each guide groove 432 ′ is used to guide the corresponding wafer 8 to move. Into the corresponding second receiving slot 71 '. In this embodiment, the number of the guide grooves 432 'is the same as the number of the first accommodating grooves 61', both being 50, but it is not limited thereto, as long as the number is the same.

Referring to FIGS. 13 to 15, a rotating assembly 42 ′ is further described here, which has a rotating shaft 46 ′, a knob 47 ′ engaged with one end of the rotating shaft 46 ′ for rotation, and a fixed connection to the rotating shaft 46 ′. An eccentric shaft 48 'at one end and a set of bearings 49' provided on the eccentric shaft 48 '. The rotating shaft 46 'is rotatably connected to the pivot hole 251' of the locking plate 25 '. An indicator groove 471 'is formed in the recess of the knob 47' to indicate the height position of the height adjustment mechanism 4 '. The central axes L1, L2 of the rotating shaft 46 'and the eccentric shaft 48' are parallel and spaced from each other. The eccentric shaft 48 'includes a shaft member 481' and a shaft member 481 'for fixing the shaft member 481' to the rotating shaft. Pin 482 'for shaft 46'. The bearing 49 'is sleeved on the shaft member 481' of the eccentric shaft 48 ', and the bearing 49' is inserted into the slot 441 'of the vertical plate 44' and is engaged with the lower side portion 442b 'and the upper side portion 442a', respectively. .

Referring to FIG. 11, FIG. 16 and FIG. 17, the pushing mechanism 5 ′ is slidably disposed on the vertical wall 11 ′ of the base 1 ′ and is located at the front end 23 ′ of the first positioning frame 2 ′. The pushing direction P is used to move the wafers 8 in the first receiving grooves 61 'aligned with the positions of the second receiving grooves 71' to each other by the first receiving grooves 61 '. Pushed into the second accommodation grooves 71 '. The pushing mechanism 5 ′ includes a connecting rod 50 ′ slidably connected to the vertical wall 11 ′, a plurality of pushing pins 51 ′ disposed on the connecting rod 50 ′ and spaced apart from each other, and a guiding pin guide plate 52 ′. Each thimble 51 'is used to push the corresponding wafer 8. The end surface of each thimble 51' is recessed to form a groove 511 '. The groove 511' extends between the left and right ends of the thimble 51 '. The longitudinal section of 511 'is V-shaped with the opening facing backward. This structure is designed to hold the wafer 8 during the pushing process so that it is not easy to shake and produce up and down displacement, ensuring the pushing process is smooth and preventing the wafer 8 from being in the process. rupture. The thimble guide plate 52 'is disposed on the vertical wall 11' of the base 1 ', and has a plurality of perforations 521' the same as the thimbles 51 'for the thimbles 51' to pass through the setting position. In this embodiment, the number of the thimbles 51 ′ and the perforations 521 ′ is 25, but not limited thereto.

Referring to FIGS. 18 and 19, the height adjustment mechanism 4 ′ changes the height position by operating the knob 47 ′. When the indication groove 471 ′ of the knob 47 ′ is pointing to the rear side, and the central axis L1 of the eccentric shaft 48 ′ is lower than the central axis L2 of the rotating shaft 46 ′, the jig 43 ′ will be equipped with a jig 43 ′ and the first carrier 6. 'Support in the first height position. At this time, the first receiving slots 61 'of the first carrier 6' The odd-numbered receiving grooves in the middle are aligned with the positions of all the receiving grooves of the second receiving grooves 71 ′ of the ejector pins 51 ′ and the second carrier 7 ′. Next referring to FIGS. 20 and 21, the operation knob 47 ′ is rotated 180 degrees clockwise to make the indicating groove 471 ′ point to the front side, and the knob 47 ′ will rotate the rotation shaft 46 ′ and then rotate the eccentric shaft 48 ′ 180 degrees, so that the The central axis L1 is higher than the central axis L2 of the rotating shaft 46 ', so that the bearing 49' is upwardly displaced and simultaneously drives the vertical plate 44 'and the bearing plate 45' to move upward, so that the first bearing frame 6 'reaches the second height position. In the second height position, the even-numbered receiving grooves in the first receiving grooves 61 ′ and the entire contents of the second receiving grooves 71 ′ of the ejector pins 51 ′ and the second carrier 7 ′ are respectively The slot positions are aligned with each other.

Referring to FIG. 22, the wafer conversion method of the wafer conversion device 200 of this embodiment is suitable for transferring and transferring a wafer carried by a first carrier 6 ′ to a second carrier 7 ′. The conversion method includes the following: Steps: a mounting step S1 ', a first pushing step S2', a replacement step S3 ', a height adjusting step S4', and a second pushing step S5 '.

Referring to FIG. 18 and FIG. 22, in the mounting step S1 ′, the first carrier 6 ′ is firstly engaged with the mounting jig 43 ′, and then the mounting jig 43 ′ is mounted on the slide frame 41 ′ of the height adjustment mechanism 4 ′. The carrier plate 45 'and the second carrier frame 7' are mounted on the second positioning frame 3 '. At this time, the first carrier 6 'is located at the first height position, and a part of the first receiving grooves 61' and the second receiving grooves 71 'in the first receiving grooves 61' are aligned with each other. In the embodiment, the odd-numbered position receiving grooves in the first receiving grooves 61 ′ are aligned with all the receiving slots of the second receiving grooves 71 ′ and the ejector pins 51 ′.

Referring to FIG. 22 and FIG. 23, in the first pushing step S2 ', The user can push the connecting rod 50 'of the pushing mechanism 5' to move the pushing pins 51 'along the pushing direction P by hand. During the movement of the ejector pin 51 'in the ejection direction P, it will penetrate into the first opening 62' of the first carrier 6 ', and then the ejector pin 51' will eject and align with the positions of the second accommodation grooves 71 '. The wafers 8 in the odd-numbered receiving grooves 61 'of the first receiving grooves 61 are moved, so that each wafer 8 is moved away from the first receiving groove 61' and correspondingly guided by the mounting fixture 43 '. The guide groove 432 'guides and moves into the corresponding second accommodation groove 71'. After each wafer 8 is moved to the corresponding second accommodating slot 71 ′, the user can pull the connecting rod 50 ′ of the pushing mechanism 5 ′ by hand to cause the pushing mechanism 5 ′ to move in a direction opposite to the pushing direction P. The reset direction D is moved to an initial position shown in FIG. 18.

Referring to FIGS. 20 and 22, in the replacement step S3 ′, the second carrier 7 ′ full of wafers 8 is moved away from the second positioning rack 3 ′, and another empty second carrier 7 ′ is mounted on the first Two positioning frames 3 '.

In the height adjustment step S4 ', by rotating the knob 47' to drive the vertical plate 44 'and the bearing plate 45' of the slide frame 41 'to move upward, the first bearing frame 6' can be adjusted to a position higher than the first height. The second height position of the first receiving grooves 61 ′ and the second receiving grooves 71 ′ of another part of the first receiving grooves 61 ′ and the other empty second carrier 7 ′. The positions are aligned with each other. In this embodiment, the positions of the even-numbered positions in the first accommodation slots 61 ′, all the positions of the second accommodation slots 71 ′, and the ejector pins 51 ′ are aligned with each other.

Referring to FIG. 22 and FIG. 24, in the second pushing step S5 ′, the user can push the connecting rod 50 ′ of the pushing mechanism 5 ′ to move the pushing pins 51 ′ along the pushing direction P by hand. During the movement of the ejector pin 51 'in the ejection direction P Will penetrate into the first opening 62 'of the first supporting frame 6', and then the ejector pin 51 'will push against the first receiving grooves 61' aligned with the positions of the second receiving grooves 71 '. The wafers 8 are moved, so that each wafer 8 is moved away from the first accommodation groove 61 ′ and guided to the corresponding second accommodation groove 71 ′ by the corresponding guide groove 432 ′ of the mounting fixture 43 ′. Inside. This completes the step of converting wafer 8 from a 50-piece quartz wafer boat to two 25-piece Teflon wafer cassettes.

It is worth mentioning that the second embodiment of the wafer conversion device of the present invention only needs to slightly modify its design, and the pusher mechanism 5 ′ is mirror-imaged on the second carrier 7 with the second carrier 7 ′ as a reference. 'Back side, in this way, the pushing mechanism 5' can push the wafer 8 in the second carrier 7 'into the first carrier 6', thereby achieving the first embodiment of the wafer conversion device of the present invention. The effect that can be achieved is to convert wafer 8 from a 25-piece Teflon wafer box to a 50-piece quartz crystal boat.

It should be noted that the background of the wafer conversion device of the present invention is because there is a sintering station process in the semiconductor process. Before this process is performed, the wafer is transported in a Teflon wafer box of 25 pieces. Before the sintering process, the wafer must be converted to a quartz wafer boat to continue the sintering process. In order to increase the productivity of the sintering station, the capacity of the quartz crystal boat is designed to be 50 pieces. Therefore, by using the wafer conversion method of the wafer conversion device 100 of the first embodiment of the present invention, the wafers are converted from the Teflon wafer box to the quartz wafer boat through steps S1 to S5. After the sintering process is completed, the wafer conversion method of the wafer conversion device 200 according to the second embodiment of the present invention is used to convert the wafer from the quartz wafer boat to the Teflon wafer box through steps S1 ′ to S5 ′. The wafer can be carried through the Teflon wafer box for subsequent processing. therefore The wafer conversion device of the present invention enables the wafer to achieve the purpose of changing between carrier devices with different capacities, thereby improving the productivity of the overall process. Among them, it should be added that the height difference between the first height position and the second height position is only the height of one slot of the quartz crystal boat, so the height adjustment mechanism only needs to control the first carrier to change between the height differences. It does not require a large amount of space for the mechanism to operate, which can simplify the design of the overall device. In addition, the height adjustment mechanism drives the first carrier to move a short movement stroke so that it can be adjusted from the first height position to the second height position, thereby enabling the operator to quickly adjust the height of the first carrier In order to shorten operating hours and improve operational efficiency.

In summary, the height adjustment mechanisms 4, 4 'are used to adjust the first carrier 6, 6' to move at the first height position and the second height position, respectively, and the wafers 8 are pushed by the pushing mechanisms 5, 5 '. Push from the first carrier 6, 6 'into the second carrier 7, 7', so that the first carrier 6, 6 'and the second carrier 7, 7' with different capacities can be achieved. The purpose of interchanging the wafers 8 can further improve the productivity efficiency of the overall process, so it can indeed achieve the purpose of cost invention.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited in this way, any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the patent specification of the present invention are still Within the scope of the invention patent.

Claims (14)

A wafer conversion device can be used for placing a first carrier and a second carrier. The first carrier is formed with a plurality of first receiving grooves arranged at an interval from each other. Each of the first receiving grooves is used for A wafer is accommodated, and the second carrier is formed with a plurality of second accommodation grooves arranged at an interval from each other. The number of the first accommodation grooves is different from the number of the second accommodation grooves. The conversion device includes: a base; a first positioning frame disposed on the base, the first positioning frame including a front end and a rear end opposite to the front end; a second positioning frame disposed on the base And located at the rear end of the first positioning frame, the second positioning frame is used for carrying and positioning the second supporting frame; a height adjusting mechanism includes a first bearing plate and a second bearing plate, the first bearing The height of the plate is smaller than the height of the second bearing plate. One of the first bearing plate and the second bearing plate is optionally disposed on the first positioning frame. The first bearing plate can bear the first bearing frame. It is located at a first height position, and the second bearing plate can carry the first bearing The rack is positioned at a second height position that is higher than the first height position, thereby adjusting and changing the first carrier between the first height position and the second height position. When the rack is at the first height position, the positions of all the accommodation grooves of one of the first accommodation grooves and the second accommodation grooves and a portion of the other accommodation grooves are aligned with each other. When the frame is at the second height position, the positions of all the accommodation grooves of one of the first accommodation grooves and the second accommodation grooves and the other of the other accommodation grooves are aligned with each other; and A mechanism slidably disposed on the base and located at the front end of the first positioning frame, the pushing mechanism can be moved in a pushing direction from front to back, and is used to position the second receiving slots The wafers in the first receiving slots aligned with each other are pushed from the first receiving slots into the second receiving slots. The wafer conversion device according to claim 1, wherein the first positioning frame includes a positioning plate, two limit plates protruding from the surface of the positioning plate and spaced from left to right, and one of the limit plates and A positioning slot defined by the positioning plate, and one of the first bearing plate and the second bearing plate can be selectively locked in the positioning slot. The wafer conversion device according to claim 1, wherein the second positioning frame includes a bearing seat disposed on the base and a mounting jig, and a surface of the bearing seat is recessed to form a placement groove, and the mounting jig The jig is clamped in the placing groove. The mounting jig includes two side walls spaced from left to right. Each side wall is formed with a plurality of guide grooves spaced up and down. The second carrier is connected to the mounting jig. Side, and the second accommodating grooves are respectively aligned with the positions of the guide grooves, and each of the guide grooves is used to guide the corresponding wafer to move into the corresponding second accommodating groove. The wafer conversion device according to claim 3, wherein the carrier includes a substrate on which the placement groove is formed, and a blocking plate protruding from a rear end of the substrate to block the second carrier. A wafer conversion device can be used for placing a first carrier and a second carrier. The first carrier is formed with a plurality of first receiving grooves arranged at an interval from each other. Each of the first receiving grooves is used for A wafer is accommodated, and the second carrier is formed with a plurality of second accommodation grooves arranged at an interval from each other. The number of the first accommodation grooves is different from the number of the second accommodation grooves. The conversion device includes: a base including a vertical wall; a first positioning frame disposed on the vertical wall of the base, the first positioning frame including a front end and a rear end opposite to the front end; a second positioning A frame, which is disposed on the vertical wall of the base and is located at the rear end of the first positioning frame; the second positioning frame is used for carrying and positioning the second supporting frame; a height adjusting mechanism includes a slidably connected to The first positioning frame can carry a sliding frame of the first supporting frame, and a rotating component disposed on the first positioning frame and connected to the sliding frame, and the rotating component can be driven in a vertical direction through the sliding frame. The first carrier is adjusted from a first height position to A second height position that is higher than the first height position and can drive the first carrier to move between the first height position and the second height position, when the first carrier is at the first height position At this time, the positions of all the receiving slots of one of the first receiving slots and the second receiving slots and a part of the receiving slots of the other are aligned with each other, and when the first carrier is at the second height position When all of the first receiving slots and the second receiving slots are aligned with each other and the other part of the receiving slots are aligned with each other; and a pushing mechanism is slidably disposed on The base is located at the front end of the first positioning frame, and the pushing mechanism can be moved in a pushing direction from front to back for aligning the first receiving positions with the positions of the second receiving slots. The wafers in the accommodating slots are pushed from the first accommodating slots into the second accommodating slots. The wafer conversion device according to claim 5, wherein the ejection mechanism includes a ejector guide plate and a plurality of ejectors, each ejector is used to eject a corresponding wafer, and the end surface of each ejector is formed by depression A groove extending between the left and right ends of the thimble, and the longitudinal section of the groove is a V-shaped opening rearward, and the thimble guide plate is provided on the base, and has a plurality of numbers and the Wait for the same perforation of the thimbles for the thimbles to penetrate the set position. The wafer conversion device according to claim 6, wherein the sliding frame includes a vertical plate slidably connected to the first positioning frame, the vertical plate is formed with a card slot, and the vertical plate has a card slot defining the card slot The rotating surface includes a lower side portion and an upper side portion. The rotating component includes a rotating shaft pivotally connected to the first positioning frame, a knob provided at one end of the rotating shaft for rotation, and a fixed connection. An eccentric shaft at the other end of the rotating shaft, and a set of bearings provided on the eccentric shaft. The central axes of the rotating shaft and the eccentric shaft are parallel and spaced from each other. The bearings are inserted into the slot and are respectively engaged with The lower side portion and the upper side portion. The wafer conversion device according to claim 7, wherein the eccentric shaft includes a shaft member and a pin for fixing the shaft member to the shaft. The wafer conversion device according to claim 8, wherein the sliding frame further includes a supporting plate disposed on the vertical plate and perpendicular to the supporting plate, and the height adjustment mechanism further includes a mounting fixture provided on the supporting plate. The mounting jig includes two side walls spaced from left to right. Each side wall is formed with a plurality of guide grooves spaced up and down. The first carrier is connected to the mounting jig and is located on the front side of the two side walls. An accommodating groove is respectively aligned with the positions of the guide grooves, and each of the guide grooves is used to guide the corresponding wafer to move into the corresponding second accommodating groove. The wafer conversion device according to claim 7, wherein the first positioning frame includes a first guide rail fixed to the vertical wall, and a second guide rail fixed to the vertical wall and spaced behind the first guide rail. The first guide rail and the second guide rail are respectively elongated and their longitudinal directions are parallel to the up-down direction. The vertical plate is disposed between the first guide rail and the second guide rail, and the vertical plate and the first guide rail and This second rail abuts. A wafer conversion method of a wafer conversion device is suitable for transferring and transferring a wafer carried by a first carrier to a second carrier. The first carrier is formed with a plurality of first and second spaced-apart first arrays. Receiving slots, each of the first receiving slots is used to receive a wafer, the second carrier is formed with a plurality of second receiving slots arranged at an interval from each other, and the number of the first receiving slots is less than the number of the first receiving slots. After waiting for the number of the second receiving grooves, the method includes the following steps: an installation step of installing the first carrier and the second carrier on a first carrier plate and a positioning frame of a height adjustment mechanism, respectively, so that the The first carrier is located at a first height position, and the positions of the first receiving grooves and some of the second receiving grooves are aligned with each other; the first pushing step is to push the The wafers in the first accommodating slots in which the second accommodating slots are aligned with each other are pushed from the first accommodating slots into the second accommodating slots; in the replacement step, the empty The first carrier is moved away from the first carrier plate of the height adjustment mechanism; In the step, the first carrier plate of the height adjustment mechanism is replaced with a height of the height adjustment mechanism that is greater than the second carrier plate, and then another first carrier frame full of wafers is mounted on the second carrier plate, so that The other first carrier is adjusted to a second height position higher than the first height position, so that the first receiving grooves and the second receiving grooves of the other first carrier are The positions of the other receiving grooves are aligned with each other; and the second pushing step is to push the first receiving grooves aligned with the other receiving grooves of the second receiving grooves through the pushing mechanism. The wafers to push the wafers from the first receiving grooves into the second receiving grooves. The wafer conversion method of the wafer conversion device according to claim 11, wherein the number of the first accommodation slots is a half of the number of the second accommodation slots, and the number of the second accommodation slots is For the even number, in the installation step, the first receiving grooves are aligned with the second receiving grooves in even positions, respectively. In the height adjustment step, the first receiving grooves are Align with the second receiving slots at odd positions, respectively. A wafer conversion method of a wafer conversion device is suitable for transferring and transferring a wafer carried by a first carrier to a second carrier. The first carrier is formed with a plurality of first and second spaced-apart first arrays. Receiving slots, each of the first receiving slots is used to receive a wafer, the second carrier is formed with a plurality of second receiving slots arranged at an interval from each other, and the number of the first receiving slots is greater than the number of the first receiving slots. After waiting for the number of the second receiving grooves, the method includes the following steps: an installation step of installing the first carrier and the second carrier on a sliding frame and a positioning frame of a height adjustment mechanism, respectively, so that the first The carrier is located at a first height position, a part of the receiving grooves in the first receiving grooves and the positions of the second receiving grooves are aligned with each other; the first pushing step, through a pushing mechanism, The wafers in the first receiving slots whose second receiving slots are aligned with each other are pushed from the first receiving slots into the second receiving slots; in the replacement step, the The second carrier is moved away from the positioning frame and another empty second carrier Mounted on the positioning frame; a height adjustment step of operating a rotating component of the height adjusting mechanism connected to the sliding frame, the rotating component driving the first carrier from a first height position through the sliding frame in an up-down direction Adjusted to a second height position higher than the first height position, so that another part of the first receiving slots and the second receiving slots of the other empty second carrier The positions are aligned with each other; and the second pushing step, pushing the wafers in another part of the receiving slots aligned with the positions of the second receiving slots through the pushing mechanism. To push the wafers from the first receiving grooves into the second receiving grooves. The wafer conversion method of the wafer conversion device according to claim 13, wherein the number of the first accommodation slots is twice the number of the second accommodation slots, and the number of the first accommodation slots is an even number. In the installation step, the second accommodating slots are aligned with the first accommodating slots in even positions, respectively. In the height adjustment step, the second accommodating slots are respectively aligned with the first accommodating slots. The first accommodating slots located at the odd positions are aligned with each other.