CN109994412A - The pick-and-place sheet devices and pick-and-place piece method of the wafer gaily decorated basket - Google Patents
The pick-and-place sheet devices and pick-and-place piece method of the wafer gaily decorated basket Download PDFInfo
- Publication number
- CN109994412A CN109994412A CN201910342560.8A CN201910342560A CN109994412A CN 109994412 A CN109994412 A CN 109994412A CN 201910342560 A CN201910342560 A CN 201910342560A CN 109994412 A CN109994412 A CN 109994412A
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- wafer
- locating slot
- card slot
- pick
- gaily decorated
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000004579 marble Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000002305 electric material Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 125
- 238000004140 cleaning Methods 0.000 description 11
- 238000005192 partition Methods 0.000 description 8
- 239000013078 crystal Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a kind of pick-and-place sheet devices of wafer gaily decorated basket.The wafer gaily decorated basket includes one group of card slot for carrying wafer vertically being arranged in parallel and at equal intervals, and the upper end of the card slot is provided with the first opening for being removed and placed into wafer, and the lower end of the card slot is provided with intransitable second opening of wafer；The pick-and-place sheet devices include ontology, the ontology includes one group be arranged in parallel and at equal intervals and the one-to-one locating slot of the card slot, the interval between interval and card slot between locating slot is equal, the both ends of each locating slot, which are provided with to hold, is provided with the channel being mutually communicated between the opening and locating slot both ends open that wafer passes through, the width of locating slot is greater than the width of card slot.The invention also discloses a kind of pick-and-place piece methods of wafer gaily decorated basket.The present invention can effectively reduce a possibility that difficulty and wafer breakage for picking and placing piece operation, and structure is simple, and cost of implementation is cheap.
Description
Technical field
The present invention relates to a kind of pick-and-place sheet devices of wafer gaily decorated basket and piece method is picked and placed, belongs to semiconductor processing technology neck
Domain.
Background technique
In modern semiconductors manufacturing technology, the cleaning of wafer is through essential key in technique manufacturing process
Step, if the cleanliness of wafer surface can't meet the quality requirement, no matter the control of other processing steps it is how outstanding, also can not
The semiconductor devices of high quality can be obtained.Cleaning, which refers to, is first put into wafer the cleaning gaily decorated basket (referred to as film releasing), then by the gaily decorated basket
It is put into cleaning solution and impregnates, removal crystal column surface is dirty.Wafer is taken out out of the gaily decorated basket and (referred to as takes piece) again after having cleaned.
Card slot of generally include to be arranged in parallel and at equal intervals one group of the cleaning wafer gaily decorated basket for carrying wafer vertically,
The upper end of the card slot is provided with the first opening for being removed and placed into wafer, and the lower end of the card slot is provided with wafer cannot
By second opening.Currently employed film releasing and to take piece mode of operation be to clamp crystal round fringes with tweezers, is directly placed into flower
It basket and is taken out from the gaily decorated basket.Since wafer (especially thin wafer) has the characteristics that frangible, such pick-and-place sheet mode exists as follows
Defect: due to standard wafer cleaning the gaily decorated basket card slot be commonly designed it is relatively narrow, when manual operation takes, puts piece hand easily shake, position
The factors such as inaccurate are held, wafer is easy and card slot periphery collides, squeezes, and causes wafer broken.If increased in design
If gaily decorated basket card slot width, wafer is easy significantly to shake in card slot in transport and cleaning operation process, generates biggish punching
Power is hit, it is broken equally to will cause wafer.
Summary of the invention
Technical problem to be solved by the present invention lies in overcome to be difficult to operate and be easy present in existing pick-and-place sheet mode
Lead to the deficiency that wafer is broken, a kind of pick-and-place sheet devices of wafer gaily decorated basket be provided, can effectively reduce pick and place the difficulty of piece operation with
And a possibility that wafer breakage, and structure is simple, cost of implementation is cheap.
A kind of pick-and-place sheet devices of the wafer gaily decorated basket, the wafer gaily decorated basket include that one group be arranged in parallel and at equal intervals is used to erect
The card slot of straight carrying wafer, the upper end of the card slot are provided with the first opening for being removed and placed into wafer, the card slot
Lower end is provided with intransitable second opening of wafer；The pick-and-place sheet devices include ontology, and the ontology includes parallel and waits
Spaced one group with the one-to-one locating slot of the card slot, the interval phase between interval and card slot between locating slot
Deng the both ends of each locating slot are provided with to hold to be provided between the opening and locating slot both ends open that wafer passes through and mutually pass through
Logical channel, the width of locating slot are greater than the width of card slot.
Preferably, the ontology is arranged to: when the wafer gaily decorated basket and the ontology are placed horizontally on same plane and fixed
When position slot and card slot are each parallel to horizontal plane, there are a fixations between the bottom of each locating slot and the bottom of its corresponding card slot
Difference in height, the value range of the fixed height difference are 0.1mm~1.0mm.
Further, which further includes with a thickness of poor 2 times of the gasket of the fixed height.
Further, the value range of the fixed height difference is 0.4mm~0.6mm.
Further, which further includes push rod, for opening wafer from one end of locating slot along the channel
Mouth is pushed to another end opening.
Preferably, the material of the pick-and-place sheet devices is antistatic material.
Following technical scheme can also be obtained based on the above sheet devices that pick and place:
A kind of pick-and-place piece method of the wafer gaily decorated basket, film releasing process are specific as follows:
The ontology of pick-and-place sheet devices described in the wafer gaily decorated basket and any technical solution as above is placed horizontally at same plane by step 1
Upper and locating slot and card slot are each parallel to horizontal plane；
Step 2, enable each card slot of the wafer gaily decorated basket first be open on the ontology corresponding locating slot it is open at one end close to and just
It is right, and the bottom of each locating slot is made to be higher by 0.1mm~1.0mm than the bottom of card slot corresponding to it；
Step 3 places the wafer in locating slot via another end opening of locating slot on the ontology, and will be brilliant along the channel
Circle is to locating slot and wafer gaily decorated basket card slot close to the push open at one end of simultaneously face, until wafer main body enters the card of the wafer gaily decorated basket
In slot；
Step 4 takes pick-and-place sheet devices away, and the wafer gaily decorated basket is holded up, and completes film releasing；
It takes piece process specific as follows:
The ontology of pick-and-place sheet devices described in the wafer gaily decorated basket and any technical solution as above is placed horizontally at same plane by step 1
Upper and locating slot and card slot are each parallel to horizontal plane；
Step 2, enable each card slot of the wafer gaily decorated basket first be open on the ontology corresponding locating slot it is open at one end close to and just
It is right, and the bottom of each card slot is made to be higher by 0.1mm~1.0mm than the bottom of locating slot corresponding to it；
Step 3 pushes wafer up to wafer main body enters described to the first opening direction from the second opening of the wafer gaily decorated basket
In the locating slot of body；
Step 4 takes out wafer from locating slot.
Preferably, in the step 2 of film releasing process, so that the bottom of each locating slot is higher by than the bottom of card slot corresponding to it
0.4mm~0.6mm.
Preferably, in the step 2 for taking piece process, so that the bottom of each card slot is higher by than the bottom of locating slot corresponding to it
0.4mm~0.6mm.
Preferably, the plane placed the wafer gaily decorated basket and pick and place sheet devices ontology is marble platform.
Compared with prior art, technical solution of the present invention has the advantages that
The present invention, which picks and places sheet devices, had not only realized the easy pick-and-place piece of wide locating slot, but also can fix wafer with the gaily decorated basket of narrow card slot,
It is not easy to shake；
The present invention picks and places sheet devices, and having both auxiliary is placed and taken out two functions simultaneously, can easily cut between two functions
It changes, it is convenient, flexible；
The present invention, which picks and places between sheet devices positioning trench bottom and corresponding gaily decorated basket card slot, that certain altitude is poor, and wafer is not easy to hit when pick-and-place piece
It is non-breakable to surrounding
Present invention pick-and-place sheet devices structure is simple, and cost of implementation is low, and does not need to be transformed the existing gaily decorated basket；
The present invention picks and places sheet devices and is made by antistatic material, does not have electrostatic hazard to wafer.
Detailed description of the invention
Fig. 1 is the wafer gaily decorated basket in the sectional view perpendicular to wafer plane direction；
Fig. 2 is the wafer gaily decorated basket in the sectional view for being parallel to wafer plane direction；
Fig. 3 is the structural schematic diagram that the present invention picks and places sheet devices；
Fig. 4 is the main view perspective view of film releasing process；
Fig. 5 is the birds-eye perspective of film releasing process；
Fig. 6 is the main view perspective view for taking piece process；
Fig. 7 is the birds-eye perspective for taking piece process.
It is marked in figure comprising the following drawings:
1, the wafer gaily decorated basket, 2, wafer, 3, ontology, 4, gasket, 5, push rod, the 101, first opening, the 102, second opening, 103, card
Slot, 104, partition wall, 301, partition wall, 302, opening, 303, opening, 304, pedestal.
Specific embodiment
Piece difficulty is picked and placed for the problem that the existing wafer gaily decorated basket exists, easily causes wafer breakage, resolving ideas of the invention
It is a set of pick-and-place sheet devices for being used to assist picking and placing piece of design, is matched with wider locating slot with the narrow card slot of the wafer gaily decorated basket,
The auxiliary that wafer can be achieved at the same time in same covering device is placed and taken out, to effectively simplify under the premise of guaranteeing that wafer is not damaged
Pick and place piece process.
Specifically, the present invention provides a kind of pick-and-place sheet devices of wafer gaily decorated basket, the wafer gaily decorated basket include it is parallel and
For carrying the card slot of wafer vertically, the upper end of the card slot is provided with for being removed and placed into wafer one group be arranged at equal intervals
First opening, the lower end of the card slot be provided with wafer it is intransitable second opening；The pick-and-place sheet devices include ontology,
The ontology includes one group be arranged in parallel and at equal intervals and the one-to-one locating slot of the card slot, the interval between locating slot
Interval between card slot is equal, and the both ends of each locating slot, which are provided with, can hold opening that wafer passes through and locating slot both ends are opened
The channel being mutually communicated is provided between mouthful, the width of locating slot is greater than the width of card slot.
Film releasing process using above-mentioned pick-and-place sheet devices is specific as follows:
Step 1 by the wafer gaily decorated basket and picks and places the ontologies of sheet devices and is placed horizontally on same plane and locating slot and card slot are flat
Row is in horizontal plane；
Step 2, enable each card slot of the wafer gaily decorated basket first be open on the ontology corresponding locating slot it is open at one end close to and just
It is right, and the bottom of each locating slot is made to be higher by 0.1mm~1.0mm than the bottom of card slot corresponding to it；
Step 3 places the wafer in locating slot via another end opening of locating slot on the ontology, and will be brilliant along the channel
Circle is to locating slot and wafer gaily decorated basket card slot close to the push open at one end of simultaneously face, until wafer main body enters the card of the wafer gaily decorated basket
In slot；
Step 4 takes pick-and-place sheet devices away, and the wafer gaily decorated basket is holded up, and completes film releasing；
Take piece process specific as follows using above-mentioned pick-and-place sheet devices:
Step 1 by the wafer gaily decorated basket and picks and places the ontologies of sheet devices and is placed horizontally on same plane and locating slot and card slot are flat
Row is in horizontal plane；
Step 2, enable each card slot of the wafer gaily decorated basket first be open on the ontology corresponding locating slot it is open at one end close to and just
It is right, and the bottom of each card slot is made to be higher by 0.1mm~1.0mm than the bottom of locating slot corresponding to it；
Step 3 pushes wafer up to wafer main body enters described to the first opening direction from the second opening of the wafer gaily decorated basket
In the locating slot of body；
Step 4 takes out wafer from locating slot.
When carrying out picking and placing piece operation using present invention pick-and-place sheet devices, wafer is due to hitting locating slot or card in order to prevent
Slot bottom side and generate breakage, should make the bottom of locating slot more slightly higher than the bottom of card slot corresponding to it in film releasing, such wafer
Movement will not bump against card slot bottom；Make the bottom of card slot more slightly higher than the bottom of locating slot corresponding to it when taking piece, it is brilliant in this way
Circle movement will not bump against positioning trench bottom.Consider with practical conditions, the height being higher by should be 0.1mm~1.0mm, preferably
0.4mm~0.6mm.
For ease of operation, preferably design when just will pick and place sheet devices ontology setting are as follows: when the wafer gaily decorated basket with it is described
When ontology is placed horizontally on same plane and locating slot and card slot are each parallel to horizontal plane, the bottom of each locating slot and its institute are right
It answers between the bottom of card slot there are a fixed height is poor, the value range of the fixed height difference is 0.1mm~1.0mm, excellent
It is selected as 0.4mm~0.6mm.
For the ease of taking/film releasing conversion, one can also be prepared further with a thickness of poor 2 times of the pad of the fixed height
Piece.Assuming that the height that is designed of ontology for picking and placing sheet devices is slightly lower, then can in film releasing by the gasket pad in ontology in the following, this
Sample ensures that the height of the bottom of ontology locating slot design more slightly higher than the bottom of card slot corresponding to it；It does not need then to make when taking piece
It is that can guarantee that the bottom of card slot is more slightly higher than the bottom of locating slot corresponding to it with gasket.
Due to being provided with the channel being mutually communicated between locating slot both ends open, a push rod can be designed, is used for
Wafer is pushed from the open at one end of locating slot to another end opening along the channel.Push rod can design longer, vertically
Ground moves horizontally in the channel, so as to disposably realize the pick-and-place piece of more wafers.
The pick-and-place sheet devices can be used the materials such as the acrylic, polyvinyl chloride, nylon of antistatic and be made.
For the ease of public understanding, come to technical solution of the present invention below by a specific embodiment and in conjunction with attached drawing
It is described in detail:
The pick-and-place sheet devices of the present embodiment are to carry out the auxiliary of 4 cun of gaas wafers and pick and place piece, and the production of the wafer has two
Procedure is the cleaning after grinding and grinding.Grinding refers to the wafer (about 650um, commonly referred to as thick wafer) of original thickness
Carry out it is thinned, be thinned after wafer thickness be about that 150um(is commonly referred to as thin wafer).Cleaning refers to the thin crystalline substance by grinding
Circle is first put into the cleaning gaily decorated basket (referred to as film releasing), and then the gaily decorated basket is put into organic solution and is impregnated, and removal crystal column surface is dirty.Clearly
Thin wafer is taken out out of the gaily decorated basket and (referred to as takes piece) again after washing.As shown in Figure 1 and Figure 2, the wafer gaily decorated basket 1 of the present embodiment
Including a series of be separated by partition walls 104 one group of card slot 103(the present embodiment wafer gaily decorated basket that is parallel and being arranged at equal intervals
Pocket numbers are 4, can carry 4 thin wafers simultaneously), for carrying wafer 2 vertically；The upper end of card slot 103 is provided with for taking
Out and be put into wafer first opening 101, the lower end of the card slot be provided with wafer it is intransitable second opening 102.This reality
Applying the interval width between the card slot 103 of the wafer gaily decorated basket in example is 11mm, and wherein card slot width is 3mm, and the width of partition wall 104 is
9mm。
The existing film releasing of the wafer gaily decorated basket and to take piece mode of operation be to clamp crystal round fringes with tweezers, be directly placed into the gaily decorated basket and
It is taken out from the gaily decorated basket.Due to the frangible feature of thin wafer, this mode has following defects that the card slot due to the wafer cleaning gaily decorated basket is set
Relatively narrow (3mm) of meter, hand is easily shaken when manual operation takes, puts piece, the factors such as inaccurate are held in position, and wafer is easy and card slot positioning
Block collision squeezes, and causes wafer broken.If increasing gaily decorated basket card slot width design, wafer is in card slot in operating process
It is easy significantly to shake, generates biggish impact force, it is broken equally to will cause wafer.
In order to solve this problem, the present invention devises the device for assisting carrying out picking and placing piece, structure such as Fig. 3 institute
Show, is made of ontology 3, gasket 4 and push rod 5.
Ontology 3 includes being arranged on pedestal 304, is arranged by a series of be separated parallel of partition walls 301 and at equal intervals
One group with the one-to-one locating slot of card slot 103 on the wafer gaily decorated basket 1, for accommodating wafer；Interval between locating slot with
Interval between card slot 103 is equal, and the both ends of each locating slot, which are provided with, can hold the opening 302,303 that wafer 2 passes through, and open
The channel being mutually communicated is provided between mouth 302,303, the width of locating slot is greater than the width of card slot 103.Between locating slot
It is spaced, as 11mm equal with the card slot 103 on the wafer gaily decorated basket 1；On the basis of meeting this precondition, groove width is positioned
It is sufficiently large, it is convenient therefrom to pick and place piece to stay enough spaces to operation.Through experiments, it was found that positioning groove width is in 5mm or more
Can be there are enough operating spaces, width is the bigger the better in the conceived case, therefore positions groove width in the present embodiment and be
9mm, the thickness of partition wall 301 are 3mm.The height of ontology 3 is designed to: when ontology 3 be placed horizontally at the wafer gaily decorated basket 1 it is same
In plane and when locating slot and card slot 103 are each parallel to horizontal plane, the bottom of locating slot is lower than corresponding 103 bottom of card slot
0.5mm。
Gasket 4 with a thickness of 1.0mm, if gasket 4 pad below ontology 3, the bottom of locating slot is than corresponding
The high 0.5mm in 103 bottom of card slot, ensures that the convenience of operation in this way.
Specific film releasing process is as shown in Figure 4, Figure 5, comprising the following steps:
Step 1, by the wafer gaily decorated basket 1 and pick and place sheet devices ontology 3 be placed horizontally on marble level table and locating slot and
Card slot 103 is each parallel to horizontal plane；
Step 2 pads gasket 4 in ontology 3 in the following, enabling the first opening 101 of each card slot 103 of the wafer gaily decorated basket 1 corresponding on ontology 3
Open at one end the 302/303 of locating slot close to and face, the bottom of each locating slot is higher than the bottom of card slot 103 corresponding to it at this time
0.5mm out；
Wafer 2 is clamped with tweezers or is sucked with sucker by step 3, via another end opening 303/302 of locating slot on ontology 3
Wafer 2 is put into locating slot, and is slowly pushed away wafer 2 to positioning channel opening 302/303 along the channel with vertical push rod 5
It send, until 2 main body of wafer enters in the card slot 103 of the wafer gaily decorated basket 1；Due to locating slot design it is sufficiently wide, have in manual operation
Enough leeway, is greatly improved to operation, and since the bottom of locating slot is more slightly higher than the bottom of card slot corresponding to it, wafer
The partition wall 104 of 103 bottom of wafer gaily decorated basket card slot will not be struck in moving process, therefore non-breakable；
Step 4 takes ontology 3 and gasket 4 away, and the wafer gaily decorated basket 1 is holded up, and completes film releasing.
Specifically take piece process as shown in Figure 6, Figure 7, comprising the following steps:
Step 1, by the wafer gaily decorated basket 1 and pick and place sheet devices ontology 3 be placed horizontally on marble level table and locating slot and
Card slot 103 is each parallel to horizontal plane；
Step 2, the first opening 101 and open at one end 302/ of corresponding locating slot on ontology 3 for enabling each card slot 103 of the wafer gaily decorated basket 1
303 close to and face, the bottom of each card slot 103 is higher by 0.5mm than the bottom of locating slot corresponding to it at this time；
Step 3 is slowly pushed away wafer 2 to the first 101 directions of opening from the second opening 102 of the wafer gaily decorated basket 1 with vertical push rod 5
It send, until 2 main body of wafer enters in the locating slot of the ontology 3；Since the bottom of card slot 103 at this time is than locating slot corresponding to it
Bottom be higher by 0.5mm, the partition wall 301 of positioning trench bottom will not be struck in wafer moving process, therefore it is non-breakable；
Step 4 takes out wafer 2 with tweezers or with sucker from locating slot, and completion takes piece.Due to locating slot design it is sufficiently wide,
There is enough leeway in manual operation, is greatly improved to operation.
It can be to pick and place the specific shape of sheet devices designed, designed according to above scheme for the wafer gaily decorated basket of other size model numbers
Shape and dimensional parameters, for the sake of saving space, details are not described herein again.
Claims (10)
1. a kind of pick-and-place sheet devices of the wafer gaily decorated basket, the wafer gaily decorated basket includes that one group be arranged in parallel and at equal intervals is used for vertically
The card slot of wafer is carried, the upper end of the card slot is provided with the first opening for being removed and placed into wafer, under the card slot
End is provided with intransitable second opening of wafer；It is characterized in that, the pick-and-place sheet devices include ontology, the ontology includes
Be arranged in parallel and at equal intervals one group with the one-to-one locating slot of the card slot, between the interval and card slot between locating slot
It is spaced equal, the both ends of each locating slot are provided with to hold and be provided between the opening and locating slot both ends open that wafer passes through
The channel being mutually communicated, the width of locating slot are greater than the width of card slot.
2. as described in claim 1 pick and place sheet devices, which is characterized in that the ontology is arranged to: when the wafer gaily decorated basket with it is described
When ontology is placed horizontally on same plane and locating slot and card slot are each parallel to horizontal plane, the bottom of each locating slot and its institute are right
It answers between the bottom of card slot there are a fixed height is poor, the value range of the fixed height difference is 0.1mm~1.0mm.
3. picking and placing sheet devices as claimed in claim 2, which is characterized in that the pick-and-place sheet devices further include with a thickness of described fixed high
Spend poor 2 times of gasket.
4. as claimed in claim 2 pick and place sheet devices, which is characterized in that the value range of the fixed height difference for 0.4mm~
0.6mm。
5. picking and placing sheet devices as described in claim 1, which is characterized in that the pick-and-place sheet devices further include push rod, for along described
Channel pushes wafer from the open at one end of locating slot to another end opening.
6. picking and placing sheet devices as described in any one of Claims 1 to 5, which is characterized in that the material of the pick-and-place sheet devices is quiet to prevent
Electric material.
7. a kind of pick-and-place piece method of wafer gaily decorated basket, which is characterized in that its film releasing process is specific as follows:
Step 1, by the wafer gaily decorated basket and as described in any one of claim 1~6 pick and place sheet devices ontology be placed horizontally at it is same
In plane and locating slot and card slot are each parallel to horizontal plane；
Step 2, enable each card slot of the wafer gaily decorated basket first be open on the ontology corresponding locating slot it is open at one end close to and just
It is right, and the bottom of each locating slot is made to be higher by 0.1mm~1.0mm than the bottom of card slot corresponding to it；
Step 3 places the wafer in locating slot via another end opening of locating slot on the ontology, and will be brilliant along the channel
Circle is to locating slot and wafer gaily decorated basket card slot close to the push open at one end of simultaneously face, until wafer main body enters the card of the wafer gaily decorated basket
In slot；
Step 4 takes the ontology away, and the wafer gaily decorated basket is holded up, and completes film releasing；
It takes piece process specific as follows:
Step 1, by the wafer gaily decorated basket and as described in any one of claim 1~6 pick and place sheet devices ontology be placed horizontally at it is same
In plane and locating slot and card slot are each parallel to horizontal plane；
Step 2, enable each card slot of the wafer gaily decorated basket first be open on the ontology corresponding locating slot it is open at one end close to and just
It is right, and the bottom of each card slot is made to be higher by 0.1mm~1.0mm than the bottom of locating slot corresponding to it；
Step 3 pushes wafer up to wafer main body enters described to the first opening direction from the second opening of the wafer gaily decorated basket
In the locating slot of body；
Step 4 takes out wafer from locating slot.
8. picking and placing piece method as claimed in claim 7, which is characterized in that in the step 2 of film releasing process, so that the bottom of each locating slot
Portion is higher by 0.4mm~0.6mm than the bottom of card slot corresponding to it.
9. picking and placing piece method as claimed in claim 7, which is characterized in that in the step 2 of film releasing process, so that the bottom of each card slot
Bottom than locating slot corresponding to it is higher by 0.4mm~0.6mm.
10. picking and placing piece method as claimed in claim 7, which is characterized in that the placement wafer gaily decorated basket and pick-and-place sheet devices ontology
Plane be marble platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910342560.8A CN109994412A (en) | 2019-04-26 | 2019-04-26 | The pick-and-place sheet devices and pick-and-place piece method of the wafer gaily decorated basket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Cited By (1)
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| CN112071793A (en) * | 2020-09-15 | 2020-12-11 | 广东先导先进材料股份有限公司 | Wafer placing device and method |
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