CN102468118B - Jig and cleaning machine - Google Patents
Jig and cleaning machine Download PDFInfo
- Publication number
- CN102468118B CN102468118B CN201010544631.1A CN201010544631A CN102468118B CN 102468118 B CN102468118 B CN 102468118B CN 201010544631 A CN201010544631 A CN 201010544631A CN 102468118 B CN102468118 B CN 102468118B
- Authority
- CN
- China
- Prior art keywords
- substrate
- gripper frame
- fixture
- tool
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 132
- 238000010926 purge Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000007789 gas Substances 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Cleaning In General (AREA)
- Plasma Technology (AREA)
Abstract
The invention provides a jig and a cleaning machine. The jig comprises a fixing device and a pedestal, wherein the fixing device is used for fixing a substrate; the pedestal is groove-shaped; and a supporting part is arranged on the side wall of the pedestal and is used for supporting the fixing device so that the substrate fixed by the fixing device is positioned between the anode and the cathode of the cleaning machine. In the jig provided by the invention, the substrate is fixed by the fixing device in a mode of fixing the edge of the substrate, and the fixing device is arranged on the supporting part of the pedestal, so that areas to be cleaned on the two surfaces of the substrate fixed in the fixing device can be fully exposed in a plasma environment, the two surfaces of the substrate can be etched, cleaned or the like at the same time, and the efficiency of technical process of the substrate is improved.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly, relate to a kind of tool and cleaning machine.
Background technology
Horizontal electrode formula plasma cleaner comprises purge chamber, positive electrode and negative electrode, negative electrode and earth surface, gas in electric field ionization purge chamber between positive electrode and negative electrode is as argon gas, to obtain plasma, horizontal electrode formula plasma cleaner carrys out cleaning base plate by plasma.During horizontal electrode formula plasma cleaner cleaning base plate, substrate is directly placed on the negative electrode in its purge chamber, substrate need the surface cleaned upward fully to contact with plasma in purge chamber, another surface of substrate and negative electrode Full connected and plasma can not be touched, so this surface can not by plasma clean.
A kind of seedless base plate for packaging technology is created in current base plate for packaging industry, be characterized in utilizing the mode of copper post conducting to replace the through hole technology used in traditional PCB, dry film is used to be made into blind hole needing the position of conducting, then make by electroplating technology the conducting effect that copper post carries out between layers, for ensureing the cleaning at the bottom of through hole hole, in the fabrication processing of substrate, need the substrate after by development to carry out two-sided cleaning to remove two left on surfaces things, when utilizing the two-sided cleaning base plate of plasma cleaner, after first must cleaning up a surface of substrate, another surface of cleaning base plate again, cause the scavenging period of substrate long, efficiency is not high.
Summary of the invention
For solving the problem, the invention provides a kind of tool and cleaning machine, it can realize cleaning base plate expeditiously.
For this reason, the invention provides a kind of tool, comprising: fixture and base;
Described fixture is used for fixing base;
Described base is groove-like, and the sidewall of described base arranges support portion, described support portion for supporting described fixture, thus between the positive electrode making the substrate fixed by described fixture be in described cleaning machine and negative electrode.
Preferably, the substrate fixed by described fixture is in half eminence or the half-breadth of the purge chamber of described cleaning machine.
Preferably, described fixture comprise following at least one:
Fixed frame, for being fixed between described fixed frame and described support portion by described substrate;
Two gripper frames, for by described substrate clamping between described gripper frame;
At least one pair of groove, in the opposing sidewalls that the often pair of groove is separately positioned on described base or on described support portion, for being fixed in described groove by the edge of described substrate;
At least one elasticity or non-resilient folder, in its opposing sidewalls being arranged on described base or on described support portion, for clamping described substrate.
Preferably, described support portion is the step-like structure or the protuberance structure that are arranged on described base side wall.
Preferably, the height of described support portion and/or described base can regulate.
Preferably, the outer surface of described fixture is curved surfaces.
Preferably, described base is made up of the material identical with described positive electrode and/or negative electrode, and preferably the material of described base comprises aluminium or stainless steel.
Preferably, also comprise: backing plate, for the substrate described in holding when fixing described substrate to prevent described substrate generation deformation.
Preferably, described base is made up of the material identical with described positive electrode and/or negative electrode, and preferably the material of described base comprises aluminium or stainless steel.
Present invention also offers a kind of cleaning machine, wherein, comprising:
Purge chamber, positive electrode, negative electrode and any one tool foregoing;
Preferably, described tool is placed in described purge chamber.
Preferably, the base of described tool is connected using as positive electrode or be connected using as negative electrode with described negative electrode with described positive electrode.
Preferably, comprise detector further, for detecting the surface cleanness of described substrate in real time or periodically.
The present invention has following beneficial effect:
Tool provided by the invention, the fixture of tool fixes substrate by the edge of fixing base, then fixture is arranged on base support portion, thus make the region to be cleaned be fixed on substrate two surfaces in fixture fully be exposed in plasma ambient, to be conducive to etching two surfaces of substrate or the manufacturing process of cleaning etc. simultaneously, improve the efficiency that substrate carries out manufacturing process.
Cleaning machine provided by the invention, fixture fixes substrate by clamping the edge of substrate, thus the region to be cleaned be clamped on substrate two surfaces in fixture fully can be contacted with the plasma in plasma ambient, to be conducive to etching two surfaces of substrate or the manufacturing process of cleaning etc. simultaneously, and improve the efficiency of cleaning base plate, and make the substrate in fixture be on the centre position of positive electrode and negative electrode by support portion, to make the concentration of the plasma on substrate surface maximum, to improve the efficiency of plasma clean substrate further.
Accompanying drawing explanation
Fig. 1 is the structural representation of tool first embodiment provided by the invention;
Fig. 2 is the vertical view of fixture fixing base in tool first embodiment provided by the invention;
Fig. 3 is the front view of fixture fixing base in tool first embodiment provided by the invention;
Fig. 4 is the sectional view along B-B direction in Fig. 3;
Fig. 5 is the structural representation of the base in tool second embodiment provided by the invention;
Fig. 6 is the structural representation of cleaning machine embodiment provided by the invention.
Embodiment
Tool embodiment provided by the invention comprises fixture and base, fixture is used for fixing base, and base is groove-like, and the sidewall of base arranges support portion, support portion is used for supporting adn fixing device, thus the substrate fixed by fixture is between the positive electrode of cleaning machine and negative electrode.
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, embodiment provided by the invention is described in detail.
Fig. 1 is the structural representation of tool first embodiment provided by the invention.As shown in Figure 1, the present embodiment tool comprises fixture and base.
Fixture preferably includes two gripper frames in the present embodiment, be respectively gripper frame 1011 and lower gripper frame 1012, substrate clamping is fixed on therebetween by the edge clamping substrate by upper gripper frame 1011 and lower gripper frame 1012, and the region to be cleaned on substrate two surfaces is exposed.Preferably, upper gripper frame 1011 is roughly the same with size with the shape of lower gripper frame 1012, with the fringe region stress balance making the two guarantee substrate when clamping the edge of substrate.
Base is groove-like, and two sidewalls 1021 of base are provided with support portion 1023, and support portion 1023 is for supporting adn fixing device.Preferably; after fixture is arranged on support portion 1023; the substrate fixed by fixture is positioned at half eminence of the purge chamber of cleaning machine; both made there are enough spaces between the substrate in base and fixture; guarantee that again substrate is in the positive electrode of purge chamber and the centre position of negative electrode; because isoionic concentration is the highest, be conducive to the cleaning efficiency improving substrate herein.In the present embodiment, support portion 1023 is arranged on the step-like structure by sidewall 1021 placement, after fixture is arranged to support portion 1023, the sidewall 1021 adjacent with support portion 1023 will stop fixture to two Slideslips, the fixture be placed on support portion 1023 is made to keep stable fixing, to avoid damaged substrate.
Because fixture fixes substrate by the edge of fixing base, thus the region to be cleaned on two of substrate surfaces is made fully to expose, be conducive to etching two surfaces of substrate or the manufacturing process of cleaning etc. simultaneously, improve and substrate etched or the efficiency of the manufacturing process such as cleaning.
Fig. 2 is the vertical view of fixture fixing base in tool first embodiment provided by the invention, and Fig. 3 is the front view of fixture fixing base in tool first embodiment provided by the invention.
As shown in Figure 2 and Figure 3, fixture preferably includes two gripper frames, and more preferably above gripper frame 1011, lower gripper frame 1012 and substrate 20 to be held are rectangle is in the present embodiment that example is to introduce technical scheme.Wherein, substrate 20 comprises region 201 to be cleaned and edge 202, the size of upper gripper frame 1011 and lower gripper frame 1012 is slightly larger than the size at the edge 202 of substrate 20, when fixture clamps substrate 20, the inward flange of upper gripper frame 1011 and lower gripper frame 1012 is positioned on the edge 202 of substrate 20, with the region to be cleaned 201 making upper gripper frame 1011 and lower gripper frame 1012 can not cover in substrate, region 201 to be cleaned being exposed, avoiding being hindered when cleaning the manufacturing process such as the residue on region 201 to be cleaned.
Preferably, in actual applications, after upper gripper frame 1011 and lower gripper frame 1012 clamp substrate 20, can fix by use elastic clip around the upper gripper frame 1011 of fixture and lower gripper frame 1012, to increase stability during gripping apparatus grips substrate 20, elastic clip can be butterfly clamp etc.
Fig. 4 is the sectional view along B-B direction in Fig. 3.As shown in Figure 4, in a preferred embodiment of the invention, the outer surface of upper gripper frame 1011 and lower gripper frame 1012 is curved surfaces, preferably in streamline shape; And/or the inner surface of the contact substrate of upper gripper frame 1011 and lower gripper frame 1012 is flat surfaces.When fixture fixing base, upper gripper frame 1011 fully contacts with the edge 202 of substrate with the inner surface of lower gripper frame 1012, object is the contact area increasing above-mentioned two gripper frames and substrate, stability when gripper frame 1011 and lower gripper frame 1012 clamp substrate in raising, simultaneously, because the corner angle on upper gripper frame 1011 and lower gripper frame 1012 or projection will block or hinder plasma or gas etc. to arrive the periphery in the region to be cleaned 201 of substrate, i.e. edge effect, so the outer surface of upper gripper frame 1011 and lower gripper frame 1012 can be designed to arc, to make the outer surface of fixture for curved surfaces, gripper frame 1011 and lower gripper frame 1012 on it is avoided to produce the edge effect being unfavorable for cleaning base plate, prevent gripper frame 1011 and lower gripper frame 1012 from blocking or hinder plasma or gas etc. to arrive the periphery in the region to be cleaned 201 of substrate, increase the efficiency that plasma arrives substrate region 201 to be cleaned.
In actual applications, the thickness of the diapire 1022 of base can be 3mm, the shape and size of upper gripper frame 1011 and lower gripper frame 1012 can be suitable with the edge of substrate, to make upper gripper frame 1011 and lower gripper frame 1012 when clamping substrate, both can not block or the region to be cleaned 201 of covered substrate, guarantee that the surperficial region to be cleaned 201 of substrate two can be fully exposed in purge chamber in isoionic environment, fully can contact to guarantee to clamp to stablize with the edge 202 of substrate again, wherein, on composition, the height of the edge of gripper frame 1011 and lower gripper frame 1012 is approximately 2mm, width is 1.5cm.
Fig. 5 is the structural representation of the base in tool second embodiment provided by the invention.As shown in Figure 5, in the embodiment of the present invention, support portion 1023 for being arranged on the protuberance structure at base side wall 1021 place, and need not be step-like as shown in Figure 1.The support portion 1023 of protuberance structure can reduce the cost manufacturing jig base, and increases the spatial volume between substrate and base be clamped in fixture, increases the quantity of plasma within this space.
Preferably, in actual applications, base is made up of the material that the positive electrode and/or negative electrode with cleaning machine is identical.
Preferably, the material of base comprises aluminium or stainless steel.
In the various embodiments of the invention, preferably, base can be connected using as positive electrode or be connected using as negative electrode with negative electrode with the positive electrode of cleaning machine.
In the various embodiments of the invention, preferably, the height of support portion 1023 and/or base can regulate, suitable with the size of the purge chamber with place cleaning machine, guarantee the applicable position of substrate between the positive electrode and negative electrode of purge chamber that fixture is fixed, such as, face between positive electrode and negative electrode (with positive electrode and negative electrode equidistant) position, thus be conducive to the efficiency improving cleaning base plate.
In the various embodiments of the invention, fixture can take different structure as required.Except the aforementioned structure comprising two gripper frames as shown in Figure 3, in other embodiments, fixture can comprise following at least one structure:
Fixed frame, for being fixed between described fixed frame and described support portion by described substrate;
Two gripper frames, for by described substrate clamping between described gripper frame;
At least one pair of groove, in the opposing sidewalls that the often pair of groove is separately positioned on described base or on described support portion, for being fixed in described groove by the edge of described substrate;
At least one elasticity or non-resilient folder, in its opposing sidewalls being arranged on described base or on described support portion, for clamping described substrate.
In the various embodiments of the invention, the fixture of tool fixes substrate by the edge of fixing base, then fixture is arranged on base support portion, thus make the region to be cleaned be fixed on substrate two surfaces in fixture fully be exposed in plasma ambient, to be conducive to etching two surfaces of substrate or the manufacturing process of cleaning etc. simultaneously, improve the efficiency that substrate carries out manufacturing process.
The present invention also provides a kind of cleaning machine, comprising: the tool described in purge chamber, positive electrode, negative electrode and various embodiments of the present invention; Wherein, described tool is placed in described purge chamber.
Fig. 6 is the structural representation of cleaning machine embodiment provided by the invention.As shown in Figure 6, cleaning machine in the present embodiment comprises purge chamber 60, tool, positive electrode 601 and negative electrode 602, tool in the present embodiment cleaning machine can adopt the structure of any one tool embodiment above-mentioned, tool in the present embodiment adopts structure to be as shown in Figure 1 that example is to introduce the technical scheme of the present embodiment, positive electrode 601 and negative electrode 602 are separately positioned on two the chamber walls up and down in purge chamber 60, tool is placed in purge chamber, the base of tool can be made by aluminium or 316 type stainless steels etc., base can contact with negative electrode and serve as negative electrode, electric field between positive electrode 601 and negative electrode 602 by ionization purge chamber in gas to obtain plasma, gas can be argon gas etc., ionize the plasma obtained and do random motion in purge chamber 60, wherein, the plasma density of the center between positive electrode 601 and negative electrode 602 is maximum, so need to design the height of support portion 1023 on sidewall 1021 according to the distance between positive electrode 601 and negative electrode 602, be arranged to after on support portion 1023 to make the fixture be clamped with, substrate is just in time in the centre position between positive electrode 601 and negative electrode 602, thus improve the efficiency of cleaning machine etching or cleaning base plate, can ensure again in the space that forms with positive electrode and negative electrode respectively at substrate, have sufficient plasma to come two surfaces of cleaning base plate.
By in the process that clamps on when substrate is passed to fixture fixing base, to bend deformation due to the effect of own wt for preventing substrate, and make the substrate be clamped in fixture in cleaning process, be in deformed state always, finally cause substrate damage or the sordid adverse consequences of wash residue, can fixture complete clamping substrate before can adopt backing plate to transmit holding substrate with prevent its occur deformation, backing plate will keep clean to prevent from polluting substrate during holding substrate, the area of backing plate is less than the area of the inside casing inward flange encirclement of lower gripper frame 1012, preferably, the area of backing plate can be 80% of the area of the inside casing inward flange encirclement of lower gripper frame 1012, such backing plate effectively can prevent substrate generation deformation, can avoid again when support substrate and lower gripper frame 1012 collides and causes substrate impaired.
The detailed process of the present embodiment cleaning machine work comprises:
The upper gripper frame 1011 of fixture is separated with lower gripper frame 1012, transferring substrates is to the top of lower gripper frame 1012, the center of substrate is aimed at the center of lower gripper frame 1012, then substrate is placed on lower gripper frame 1012, the inward flange of lower gripper frame 1012 is positioned at the edge of substrate, then utilize backing plate holding substrate and due to the reason of self gravitation, deformation occurs to prevent substrate, then fall after the center of upper gripper frame 1011 and lower gripper frame 1012 being aimed at, with make upper gripper frame 1011 and lower gripper frame 1012 all involutory with the edge of substrate, the elastic clips such as recycling butterfly clamp are by fixing around upper gripper frame 1011 and lower gripper frame 1012, to prevent from being moved by the substrate clamped or coming off and damage, then remove backing plate and the fixture being clamped with substrate is placed on the step-like support portion 1023 of base, then power-on is charged to positive electrode 601 and negative electrode 602, electric field between positive electrode 601 and negative electrode 602 is by plasma gas (the such as argon gas in ionization purge chamber 60, the inert gases such as helium) to obtain plasma, plasma fully contacts to carry out two-sided cleaning to substrate by with two surfaces of substrate simultaneously, thus the residuals on substrate two surfaces is removed in realization simultaneously.
In the present embodiment, fixture fixes substrate by clamping the edge of substrate, thus the region to be cleaned be clamped on substrate two surfaces in fixture fully can be contacted with the plasma in plasma ambient, to be conducive to etching two surfaces of substrate or the manufacturing process of cleaning etc. simultaneously, and improve the efficiency of cleaning base plate, and make the substrate in fixture be on the centre position of positive electrode and negative electrode by support portion, to make the concentration of the plasma on substrate surface maximum, to improve the efficiency of plasma clean substrate further.
In the various embodiments of the invention, preferably, plasma washing machine can be the flat distributed frame of electrode water or the vertical distributed frame of electrode.
According to various embodiments of the present invention, preferably, the base of described tool is connected using as positive electrode or be connected using as negative electrode with described negative electrode with described positive electrode.
In the various embodiments of the invention, preferably, the substrate fixed by described fixture is in half eminence or the half-breadth of the purge chamber of described cleaning machine.For the cleaning machine of the flat distributed frame of electrode water, substrate can be in the half-breadth place of purge chamber; For the cleaning machine of the vertical distributed frame of electrode, substrate can be in half eminence of purge chamber.
In the various embodiments of the invention, preferably, cleaning machine comprises detector further, for detecting the surface cleanness of described substrate in real time or periodically.
In the various embodiments of the invention, preferably, described substrate is base plate for packaging, especially seedless base plate for packaging.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (11)
1. for a tool for plasma cleaner, it is characterized in that comprising: fixture and base;
Described fixture is used for fixing base;
Described base is groove-like, and the sidewall of described base arranges support portion, described support portion for supporting described fixture, thus between the positive electrode making the substrate fixed by described fixture be in described cleaning machine and negative electrode; The sidewall of described base can stop fixture to two Slideslips, makes the fixture be placed on support portion keep stable fixing;
Described fixture comprises two gripper frames, for by described substrate clamping between described gripper frame;
Described two gripper frames are respectively gripper frame and lower gripper frame, the size of upper gripper frame and lower gripper frame is slightly larger than the size at the edge of substrate, the inward flange of upper gripper frame and lower gripper frame is positioned on the edge of substrate, expose to make the region to be cleaned on two of substrate surfaces, upper gripper frame fully contacts with the edge of substrate with the lower inner surface of gripper frame, to increase the contact area of two gripper frames and substrate; Upper gripper frame is roughly the same with size with the shape of lower gripper frame, and the center of upper gripper frame and lower gripper frame is aligned with each other, and aims at the center of substrate, with the fringe region stress balance making the two guarantee substrate when clamping the edge of substrate;
The outer surface of described fixture is curved surfaces, produces to avoid upper gripper frame and lower gripper frame the edge effect being unfavorable for cleaning base plate.
2. the tool for plasma cleaner according to claim 1, is characterized in that, the substrate fixed by described fixture is in half eminence or the half-breadth of the purge chamber of described cleaning machine.
3. the tool for plasma cleaner according to claim 1, is characterized in that, described fixture also comprises:
At least one elasticity or non-resilient folder, it is arranged on around gripper frame and lower gripper frame, for fixing described upper gripper frame and lower gripper frame.
4. the tool for plasma cleaner according to any one of claim 1-3, is characterized in that, described support portion is the step-like structure or the protuberance structure that are arranged on described base side wall.
5. the tool for plasma cleaner according to any one of claim 1-3, is characterized in that, the height of described support portion and/or described base can regulate.
6. the tool for plasma cleaner according to any one of claim 1-3, characterized by further comprising: backing plate, for the substrate described in holding when fixing described substrate to prevent described substrate generation deformation.
7. the tool for plasma cleaner according to any one of claim 1-3, is characterized in that, described base is made up of the material identical with described positive electrode and/or negative electrode.
8. the tool for plasma cleaner according to claim 7, is characterized in that, the material of described base comprises aluminium or stainless steel.
9. a cleaning machine, is characterized in that, comprising:
Tool in purge chamber, positive electrode, negative electrode and claim 1-8 described in any one;
Wherein, described tool is placed in described purge chamber.
10. cleaning machine according to claim 9, is characterized in that, the base of described tool is connected using as positive electrode or be connected using as negative electrode with described negative electrode with described positive electrode.
11. cleaning machines according to claim 9 or 10, is characterized in that, comprise detector further, for detecting the surface cleanness of described substrate in real time or periodically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010544631.1A CN102468118B (en) | 2010-11-12 | 2010-11-12 | Jig and cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010544631.1A CN102468118B (en) | 2010-11-12 | 2010-11-12 | Jig and cleaning machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102468118A CN102468118A (en) | 2012-05-23 |
| CN102468118B true CN102468118B (en) | 2015-04-22 |
Family
ID=46071609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010544631.1A Expired - Fee Related CN102468118B (en) | 2010-11-12 | 2010-11-12 | Jig and cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102468118B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103331284A (en) * | 2013-07-24 | 2013-10-02 | 合肥彩虹蓝光科技有限公司 | ITO (indium tin oxide) glass sheet washing jig |
| CN103752562A (en) * | 2014-02-13 | 2014-04-30 | 苏州众显电子科技有限公司 | Technology for utilizing plasma cleaning machine to clean liquid crystal display screen substrate |
| CN103990618B (en) * | 2014-05-30 | 2016-04-27 | 苏州倍辰莱电子科技有限公司 | A kind of pcb board air blow jig |
| CN110791764A (en) * | 2018-08-02 | 2020-02-14 | 奇景光电股份有限公司 | Cleaning jig |
| CN111534790A (en) * | 2020-04-09 | 2020-08-14 | 常州高光半导体材料有限公司 | Cleaning device and cleaning method for metal mask |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101009208A (en) * | 2006-01-26 | 2007-08-01 | 大日本网目版制造株式会社 | Substrate treatment apparatus and substrate treatment method |
| CN201887033U (en) * | 2010-11-12 | 2011-06-29 | 北大方正集团有限公司 | Jig and cleaning machine |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4027072B2 (en) * | 2001-10-18 | 2007-12-26 | 松下電器産業株式会社 | Low pressure plasma processing apparatus and method |
| US7185661B2 (en) * | 2002-05-06 | 2007-03-06 | Akrion Technologies, Inc. | Reciprocating megasonic probe |
| US7140374B2 (en) * | 2003-03-14 | 2006-11-28 | Lam Research Corporation | System, method and apparatus for self-cleaning dry etch |
| KR101353490B1 (en) * | 2006-07-20 | 2014-01-27 | 에프엔에스테크 주식회사 | Processing apparatus for substrate |
| CN101165854A (en) * | 2006-10-19 | 2008-04-23 | 大日本网目版制造株式会社 | Substrate processing apparatus and substrate processing method |
| JP5156488B2 (en) * | 2007-08-21 | 2013-03-06 | 大日本スクリーン製造株式会社 | Substrate cleaning apparatus and substrate cleaning method |
-
2010
- 2010-11-12 CN CN201010544631.1A patent/CN102468118B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101009208A (en) * | 2006-01-26 | 2007-08-01 | 大日本网目版制造株式会社 | Substrate treatment apparatus and substrate treatment method |
| CN201887033U (en) * | 2010-11-12 | 2011-06-29 | 北大方正集团有限公司 | Jig and cleaning machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102468118A (en) | 2012-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102468118B (en) | Jig and cleaning machine | |
| TWI405261B (en) | Dry etching apparatus | |
| CN201887033U (en) | Jig and cleaning machine | |
| WO2009057855A1 (en) | A clip for fixing of shield can | |
| JP2009504906A (en) | Apparatus for accommodating or holding a plurality of substrates and electroplating apparatus | |
| WO2011076108A1 (en) | Horizontal graphite boat | |
| CN218677076U (en) | Silicon wafer carrier and film coating system | |
| CN214012905U (en) | Device for corrosion cleaning | |
| CN212247203U (en) | Substrate carrier, substrate carrier array and vapor deposition apparatus | |
| CN211000405U (en) | 3D glass silk screen printing device | |
| CN209461434U (en) | The pick-and-place sheet devices of the wafer gaily decorated basket | |
| CN207925503U (en) | A kind of monolithic solar cell piece etching edge anti-extrusion fixture | |
| CN212161781U (en) | Vacuum chuck and silicon wafer conveying device | |
| CN201264621Y (en) | Transfer cart for loading substrate | |
| JP2004087981A (en) | Etching device and method | |
| CN206356314U (en) | A kind of ceramic substrate circuit ultrasonic cleaning equipment | |
| CN111471982A (en) | Substrate carrier, substrate carrier array and vapor deposition apparatus and method of using the same | |
| WO2019010748A1 (en) | Stacking apparatus for flexible packaging battery | |
| CN108288659B (en) | Extrusion-proof clamp for etching edge of single solar cell | |
| CN214625015U (en) | Electrostatic adsorption device with profile modeling is spacing | |
| JP5375643B2 (en) | Wafer holding mechanism, wafer holder and electrostatic chuck | |
| CN104124126A (en) | Bearing device and plasma processing apparatus | |
| CN207624654U (en) | A kind of grating type electrode plate plasma treatment vacuum chamber | |
| CN109994412A (en) | The pick-and-place sheet devices and pick-and-place piece method of the wafer gaily decorated basket | |
| CN219144125U (en) | Testing device for back contact battery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220615 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 |