CN112071793B - Wafer placing device and method - Google Patents
Wafer placing device and method Download PDFInfo
- Publication number
- CN112071793B CN112071793B CN202010966608.5A CN202010966608A CN112071793B CN 112071793 B CN112071793 B CN 112071793B CN 202010966608 A CN202010966608 A CN 202010966608A CN 112071793 B CN112071793 B CN 112071793B
- Authority
- CN
- China
- Prior art keywords
- wafer
- loading box
- wafer loading
- placing
- leading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000005484 gravity Effects 0.000 claims abstract description 11
- 230000009471 action Effects 0.000 claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims description 239
- 239000000463 material Substances 0.000 claims description 4
- -1 polytetrafluoroethylene Polymers 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000006748 scratching Methods 0.000 abstract 1
- 230000002393 scratching effect Effects 0.000 abstract 1
- 230000006872 improvement Effects 0.000 description 7
- 238000007689 inspection Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer placing device and a method, which are applied to semiconductor epitaxial equipment and mainly comprise the following steps: a wafer loading box platform which forms an included angle of 20-30 degrees with the plane of the bottom plate, and a chip leading-in device which is horizontally aligned with the clamping groove of the wafer loading box and has the same width and interval. When the wafer placing operation is performed, the wafer is placed on the wafer introducing device through the vacuum suction pen, and falls into the wafer loading box under the action of gravity. Compared with manual sheet placement, the invention can avoid scratching caused by touching the main surface due to artificial reasons; compared with automatic tablet taking and placing, the invention has higher flexibility, easier operation and strong practicability, and is suitable for various occasions.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a wafer placing device and a method.
Background
The III-V compound semiconductor material represented by gallium arsenide (GaAs) has very wide application in the fields of satellite communication, microwave devices, lasers and light emitting diodes due to the unique electrical properties. The fabrication of heterojunction bipolar transistors, high electron mobility transistors, LEDs, etc. requires the growth of epitaxial structures on high quality substrate surfaces using molecular beam epitaxy or organometallic compound vapor phase epitaxy techniques. Currently, a compound semiconductor single crystal such as GaAs, inP, or GaP has a fragile substrate texture, and is extremely susceptible to mechanical damage such as scratches or scratches on the surface, so that a more accurate and stable manner is required when such a wafer is placed in a moving manner.
In practice, the processing is manually operated by a person because of limitations such as functions and processes of automatic equipment, which cannot process a variety of products in one-stop mode. In some specific locations such as: inspection (by manual inspection of the product), suction inspection, sampling, and the like require a single-chip operation. There is a need for an auxiliary device that reduces the risk of personnel handling. The instability of the wafer carrier card slot spacing of 1.5-2 mm makes it difficult to manually insert wafers into the wafer carrier card slot without having the main surface wipe against the side walls. The automatic picking and placing can achieve accurate picking and placing, but the automatic picking and placing device is not easy to carry, large in size, fixed in place and the like, and has many limitation on factors.
The invention aims to overcome the defect of wafers caused by manual operation of placing the wafer loading frame and solve the problem of insufficient automation. Therefore, it is necessary to design a new solution to the above technical problems.
Disclosure of Invention
The invention aims at: aiming at the problems, the wafer placing device and the wafer placing method are provided, are used in equipment without an automatic wafer placing function or a place for detecting wafers on a single piece, and realize wafer placing operation by utilizing the gravity action generated by an included angle and the assistance of a wafer guiding device, so that the scratch and pollution on the surface of the wafer are avoided.
In order to achieve the above purpose, the present invention adopts the following technical scheme that:
The wafer placing device comprises: the wafer loading device comprises a bottom plate, an automatic control device, a wafer loading box placing plate, a wafer loading box supporting plate, a moving arm, a wafer leading-in device, a vacuum suction pen, a wafer sensor and a limit position sensor.
To better illustrate the location, configuration and function of the above devices, the following classifications and orientations are made: the wafer loading device comprises a base structure module, an automatic control module and a wafer loading module, wherein the wafer loading module is positioned above the base structure module, and the automatic control module is connected with the wafer loading module and the base structure module in a surrounding mode.
The base structure module comprises a bottom plate, a wafer loading box placing plate and a wafer loading box supporting plate, wherein the bottom plate is horizontally placed at the bottommost layer, the wafer loading box placing plate and the wafer loading box supporting plate are vertically intersected, and a vertical intersection line is positioned on the bottom plate.
The automatic control module comprises an automatic control device, a movable arm and a limit position sensor, wherein the automatic control device is positioned on the back surface of the wafer loading box placing plate, the automatic control device is vertically connected with the movable arm, planes of the automatic control device and the movable arm are also mutually vertical, and the limit position sensor is positioned on two side surfaces of the wafer loading box placing plate.
The wafer loading module comprises a wafer leading-in device, a vacuum suction pen, a wafer loading box and a wafer sensor, wherein the wafer leading-in device is positioned right above the wafer loading box, the wafer leading-in device and a clamping groove of the wafer loading box are arranged on the same plane, meanwhile, one side of the wafer leading-in device is provided with a vacuum suction pen outlet, and the wafer sensor is positioned at the center of the wafer leading-in device.
As a further improvement of the invention, the automatic control device comprises a guide rail and a stepping motor module, wherein the guide rail and the stepping motor module are positioned below the wafer loading box placing plate, and the displacement of the wafer introducing device is controlled by connecting a movable arm and combining a limit position sensor and a wafer sensor, so that the automatic control function is realized.
As a further improvement of the invention, the die introduction device is horizontally aligned with the cassette slot of the wafer cassette and has the same width and pitch.
As a further improvement of the invention, the length of the width is 2-3 mm greater than the wafer diameter.
As a further improvement of the invention, the size of the spacing is 1 to 1.5mm greater than the thickness of the wafer.
As a further improvement of the invention, the wafer loading box is made of polytetrafluoroethylene materials, has small friction force, is U-shaped in appearance and is open in bottom, and the wafers are stressed points on two sides when reaching the bottom by means of included angles and gravity, so that the wafers cannot collide with the front surfaces of the chips.
The invention also provides a wafer placing method, which comprises the following steps: when the wafer placing operation is carried out, the wafer is placed on the wafer guiding device through the vacuum suction pen, the wafer loading box forms an included angle of 20-30 degrees with the plane of the bottom plate, and the wafer falls into the wafer loading box under the action of gravity.
As a further improvement of the invention, the magnitude of the included angle is inversely related to the mass of the wafer, the smaller the mass of the wafer is, the larger the required included angle is, and the wafer falls into the wafer loading box from the back side against the clamping groove, so that the damage to the main surface of the chip in the manual operation can be reduced.
As a further improvement of the invention, a wafer dicing method is described as follows.
When the wafer placing operation is performed, the wafer is placed on the wafer introducing device through the vacuum suction pen, the wafer sensor senses that the wafer is present, and the guide rail of the automatic control device and the stepping motor module move at a fixed distance through the electrical control wafer introducing device, so that the wafer introducing device is aligned with one clamping groove of the wafer loading box. After the wafer is inspected by the staff, the wafer is put into the wafer guiding device by using a vacuum suction pen, and the vacuum suction pen is moved out through an outlet of the vacuum suction pen. The wafer slides into the wafer loading box along the guide rail of the chip guiding device by utilizing the self gravity effect, and the wafer placing operation is completed. After the wafer sensor senses that no wafer exists, the guide rail of the automatic control device and the stepping motor module move at a fixed distance through the electric control wafer introduction device again, so that the wafer introduction device is aligned with the next clamping groove of the wafer loading box, and next wafer placing operation is performed. The die introduction device is horizontally aligned with the card slot of the wafer cassette and has the same width and pitch. If the force of gravity is insufficient to move the wafer, the angle of the wafer cassette carrier and the base plate may be increased. The wafer loading box supporting plate plays roles of preventing the wafer loading box from shifting and keeping left-right balance.
The wafer placing method and device are very suitable for being used in equipment without automatic wafer placing function and places for detecting wafers on a single piece, and have the following advantages compared with the prior art.
1. Compared with manual sheet placement, the invention can avoid scratch caused by touching the main surface due to human factors.
2. Compared with an automatic sheet taking and placing device, the sheet taking and placing device is higher in flexibility, easier to operate and high in practicability, and can be used in various occasions.
3. Can avoid the extension accident caused by human factors and effectively improve the product quality.
Drawings
Fig. 1 is a schematic diagram of a front view overall structure of a wafer handling device according to an embodiment of the present invention.
Fig. 2 is a schematic view illustrating the overall structure of a wafer handling device according to an embodiment of the invention.
Wherein the reference numerals are as follows: a base plate-1; an automatic control device-2; a wafer cassette placement plate-3; wafer loading cassette pallet-4; moving arm-5; a vacuum suction pen outlet-6; introducing a wafer device-7; wafer loading rack-8; a wafer sensor-9; limit position sensor-10.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The embodiment of the invention provides a wafer placing method and device, which are suitable for being used in places without automatic wafer placing functional equipment or single wafer detection, and realize wafer placing operation by utilizing the gravity action generated by an included angle and the assistance of a wafer leading-in device, so as to avoid scratch and pollution on the surface of a wafer.
The embodiment of the invention provides a wafer placing device, which comprises the following modules: the wafer loading device comprises a base structure module, an automatic control module and a wafer loading module, wherein the wafer loading module is positioned above the base structure module, and the automatic control module is connected with the wafer loading module and the base structure module in a surrounding mode.
In order to better illustrate the structure, device and function of each module of a wafer placing device provided by the embodiment of the invention, the following description is made with reference to fig. 1 and 2:
the base structure module comprises a bottom plate 1, a wafer loading box placing plate 3 and a wafer loading box supporting plate 4, wherein the bottom plate 1 is horizontally placed at the bottommost layer, the wafer loading box supporting plate 4 and the bottom plate 1 form an included angle of 20-30 degrees to be connected, the wafer loading box placing plate 3 and the wafer loading box supporting plate 4 are vertically intersected, and a vertical intersection line is positioned on the bottom plate 1;
The automatic control module comprises an automatic control device 2, a movable arm 5 and a limit position sensor 10, wherein the automatic control device 2 is positioned on the back surface of the wafer loading box placing plate 3, the automatic control device 2 is vertically connected with the movable arm 5, planes of the automatic control device 2 and the movable arm 5 are also mutually vertical, and the limit position sensor 10 is positioned on two side surfaces of the wafer loading box placing plate;
The wafer loading module comprises the wafer leading-in device 7, a wafer loading box 8, a wafer sensor 9 and a vacuum suction pen, wherein the wafer leading-in device 7 is positioned right above the wafer loading box 8 and is on the same plane with a clamping groove of the wafer loading box 8, meanwhile, one side of the wafer loading module is provided with the vacuum suction pen outlet 6, and the wafer sensor 9 is positioned at the center of the wafer leading-in device 7.
In the embodiment of the present invention, the automatic control device 2 is composed of a stepper motor module capable of moving at a fixed distance, and the displacement of the wafer introducing device 7 is controlled by connecting the moving arm 5 and combining the limit position sensor 10 and the wafer sensor 9, so as to realize an automatic control function.
In the embodiment of the present invention, the die introduction device 7 is horizontally aligned with the clamping groove of the wafer loading box 8 and has the same width and pitch.
In the embodiment of the invention, the length of the width is 2-3 mm larger than the diameter of the wafer.
In the embodiment of the invention, the size of the interval is 1-1.5 mm larger than the thickness of the wafer.
The embodiment of the invention provides a wafer placing method, wherein the sizes of wafers are 2 inches, 3 inches, 4 inches and 6 inches, and the weights of the wafers are 6 grams, 10 grams, 18 grams and 80 grams respectively. The included angle is an angle formed by the wafer loading box supporting plate and the bottom plate, and the size of the included angle has an inverse relation with the weight of the wafer. For example, when the wafer is 6 inches and 80 grams, the required included angle is determined to be the best 30 degrees through practical tests; when the wafer is 2 inches and 6 grams, the required included angle is determined to be the best 20 degrees through practical tests. Therefore, the range of the included angle in the embodiment of the present invention is determined to be 20 to 30 °. The wafer loading box is made of polytetrafluoroethylene materials, friction force is small, the appearance is U-shaped, the bottom is open, the two sides of the wafer are stress points when the wafer reaches the bottom by means of the included angle and gravity, and the wafer cannot collide with the front surface of the wafer. The specific steps of the wafer dicing method according to the embodiment of the present invention are described below with reference to fig. 1 and 2.
When the wafer placing operation is performed, the wafer is placed on the wafer introducing device 7 through the vacuum suction pen, the wafer sensor 9 senses that the wafer is present, and the guide rail of the automatic control device 2 and the stepping motor module control the wafer introducing device 7 to move at a fixed distance by driving the moving arm 5, so that the wafer introducing device 7 is aligned with a clamping groove of the wafer loading box 8. After the wafer is inspected by the worker, the wafer is put into the wafer guiding device 7 by using a vacuum suction pen, and the vacuum suction pen is moved out through the vacuum suction pen outlet 6. The wafer slides into the wafer loading box 8 along the guide rail of the chip introducing device 7 by the self gravity, and the wafer placing operation is completed. After the wafer sensor senses that no wafer exists, the guide rail of the automatic control device 2 and the stepping motor module drive the moving arm 5 to control the wafer guiding device 7 to move at a fixed distance, so that the wafer guiding device 7 is aligned with the next clamping groove of the wafer loading box 8. The die introduction device 7 is horizontally aligned with the card slot of the wafer cassette 8 and has the same width and pitch. If the gravitational force is insufficient to cause movement of the wafer, the angle of the cassette tray 4 and the base plate 1 may be increased. The wafer cassette carrier 4 prevents the wafer cassette 8 from being displaced and maintains a left-right balance.
Compared with the prior art, the wafer placing device and method are very suitable for being used in equipment without an automatic wafer placing function and places for detecting wafers on a single piece, and have the advantages of being capable of avoiding scratches caused by touching a main surface due to human factors, high in flexibility, easy to operate, high in practicability, capable of improving product quality and the like.
Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Claims (7)
1. A wafer handling apparatus, the apparatus comprising: the wafer loading device comprises a base structure module, an automatic control module and a wafer loading module, wherein the wafer loading module is positioned above the base structure module, and the automatic control module is connected with the wafer loading module and the base structure module in a surrounding mode;
the base structure module comprises a bottom plate, a wafer loading box placing plate and a wafer loading box supporting plate, wherein the bottom plate is horizontally placed at the bottommost layer, the wafer loading box placing plate and the wafer loading box supporting plate are vertically intersected, and a vertical intersection line is positioned on the bottom plate;
The automatic control module comprises an automatic control device, a movable arm and a limit position sensor, wherein the automatic control device is positioned on the back surface of the wafer loading box placing plate, the automatic control device is vertically connected with the movable arm, planes of the automatic control device and the movable arm are also mutually vertical, and the limit position sensor is positioned on two side surfaces of the wafer loading box placing plate;
the wafer loading module comprises a wafer leading-in device, a vacuum suction pen, a wafer loading box and a wafer sensor, wherein the wafer leading-in device is positioned right above the wafer loading box, the wafer leading-in device and a clamping groove of the wafer loading box are positioned on the same plane, meanwhile, one side of the wafer leading-in device is provided with a vacuum suction pen outlet, and the wafer sensor is positioned at the center of the wafer leading-in device;
The automatic control device comprises a guide rail and a stepping motor module, wherein the guide rail and the stepping motor module are positioned below the wafer loading box placing plate, and the displacement of the wafer introducing device is controlled by connecting a movable arm and combining a limit position sensor and a wafer sensor;
the chip leading-in device is horizontally aligned with the clamping groove of the wafer loading box and has the same width and interval; the wafer loading box supporting plate forms an included angle of 20-30 degrees with the plane of the bottom plate;
The wafer loading box supporting plate plays a role in preventing the wafer loading box from shifting and keeping left-right balance.
2. A wafer handling device according to claim 1, wherein: the length of the width is 2-3 mm larger than the diameter of the wafer.
3. A wafer handling device according to claim 1, wherein: the size of the interval is 1-1.5 mm larger than the thickness of the wafer.
4. A wafer handling device according to claim 1, wherein: the appearance of the wafer loading box is U-shaped, and the bottom of the wafer loading box is open.
5. A wafer placing method is characterized in that: when the wafer placing device according to any one of claims 1-4 is used for placing wafers on the wafer guiding device through the vacuum suction pen, the wafer loading box supporting plate forms an included angle of 20-30 degrees with the plane of the bottom plate, and the wafers fall into the wafer loading box under the action of gravity generated by the included angle, and the specific wafer placing method comprises the following steps:
The wafer is placed on the wafer leading-in device through the vacuum suction pen, the wafer sensor senses that the wafer is arranged, the guide rail of the automatic control device and the stepping motor module move at a fixed distance through the electric control wafer leading-in device, so that the wafer leading-in device is aligned with one clamping groove of the wafer loading box, after the appearance of the wafer is checked to be intact, the wafer is placed into the wafer leading-in device through the vacuum suction pen, the vacuum suction pen moves out through the outlet of the vacuum suction pen, the wafer slides into the wafer loading box along the guide rail of the wafer leading-in device by utilizing the action of self gravity, the wafer placing operation is completed, and after the wafer sensor senses that the wafer is absent, the guide rail of the automatic control device and the stepping motor module move at a fixed distance through the electric control wafer leading-in device again, so that the wafer leading-in device is aligned with the next clamping groove of the wafer loading box, and the next wafer placing operation is carried out.
6. The wafer dicing method of claim 5, wherein: the wafer has a size of 2-6 inches and a weight of 6-80 grams.
7. The wafer dicing method of claim 5, wherein: the wafer loading box is made of polytetrafluoroethylene materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010966608.5A CN112071793B (en) | 2020-09-15 | 2020-09-15 | Wafer placing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010966608.5A CN112071793B (en) | 2020-09-15 | 2020-09-15 | Wafer placing device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112071793A CN112071793A (en) | 2020-12-11 |
| CN112071793B true CN112071793B (en) | 2024-05-24 |
Family
ID=73695829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010966608.5A Active CN112071793B (en) | 2020-09-15 | 2020-09-15 | Wafer placing device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112071793B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287636A (en) * | 1985-06-12 | 1986-12-18 | Canon Inc | Wafer insertion-takeout device |
| US6409448B1 (en) * | 2000-04-03 | 2002-06-25 | Brooks Automation Inc. | Ergonomic load port |
| TW503507B (en) * | 1999-01-08 | 2002-09-21 | United Microelectronics Corp | Weighted wafer cassette switching device |
| KR20060077981A (en) * | 2004-12-30 | 2006-07-05 | 삼성전자주식회사 | Apparatus for supporting a wafer carrier and apparatus for transporting a wafer having the same |
| CN105845611A (en) * | 2015-01-15 | 2016-08-10 | 南京华伯仪器科技有限公司 | Take-up mechanism and silicon wafer loading and unloading system |
| CN206931576U (en) * | 2017-06-16 | 2018-01-26 | 广东先导先进材料股份有限公司 | Chip access device |
| CN109994412A (en) * | 2019-04-26 | 2019-07-09 | 苏州长瑞光电有限公司 | The pick-and-place sheet devices and pick-and-place piece method of the wafer gaily decorated basket |
-
2020
- 2020-09-15 CN CN202010966608.5A patent/CN112071793B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287636A (en) * | 1985-06-12 | 1986-12-18 | Canon Inc | Wafer insertion-takeout device |
| TW503507B (en) * | 1999-01-08 | 2002-09-21 | United Microelectronics Corp | Weighted wafer cassette switching device |
| US6409448B1 (en) * | 2000-04-03 | 2002-06-25 | Brooks Automation Inc. | Ergonomic load port |
| KR20060077981A (en) * | 2004-12-30 | 2006-07-05 | 삼성전자주식회사 | Apparatus for supporting a wafer carrier and apparatus for transporting a wafer having the same |
| CN105845611A (en) * | 2015-01-15 | 2016-08-10 | 南京华伯仪器科技有限公司 | Take-up mechanism and silicon wafer loading and unloading system |
| CN206931576U (en) * | 2017-06-16 | 2018-01-26 | 广东先导先进材料股份有限公司 | Chip access device |
| CN109994412A (en) * | 2019-04-26 | 2019-07-09 | 苏州长瑞光电有限公司 | The pick-and-place sheet devices and pick-and-place piece method of the wafer gaily decorated basket |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112071793A (en) | 2020-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100848228B1 (en) | Substrate conveying device | |
| JP2020500291A (en) | Fully automatic optical inspection and measurement equipment for LED boards | |
| US4566839A (en) | Semiconductor wafer diffusion boat and method | |
| KR101401516B1 (en) | Tray aligner and solar cell manufacturing device comprising the same and tray aligning method using the same | |
| CN111940306A (en) | Detection device and detection method for semiconductor chip | |
| KR20100071550A (en) | Transfer apparatus for wafer cassette | |
| CN113804701B (en) | Visual inspection device | |
| CN112071793B (en) | Wafer placing device and method | |
| WO2022048023A1 (en) | Vertical automatic wafer loading/unloading device | |
| CN111312646A (en) | Four-side wafer arranging mechanism for silicon wafers | |
| CN114242632A (en) | Loading device of semiconductor equipment and semiconductor equipment | |
| CN116359223A (en) | Automatic vision inspection machine for semiconductor packaging protective material | |
| CN116344416A (en) | Carrier plate conveying structure and die bonding equipment | |
| CN110729223A (en) | Silicon chip laying device | |
| US6190111B1 (en) | Tray inverting apparatus and methods | |
| CN211682936U (en) | Bonding table for horizontal gallium arsenide single crystal slicing and accurate bonding device | |
| KR102372514B1 (en) | Foup fixing device for fims system | |
| CN213071071U (en) | Semiconductor crystal grain detection device | |
| CN111415893A (en) | Single-drive two-side clamping device and sheet-arranging mechanism | |
| KR20220093802A (en) | Semiconductor strip transfer method | |
| CN211828709U (en) | Single-drive two-side clamping device and sheet-arranging mechanism | |
| CN111410027A (en) | Wafer box positioning tool and wafer box fixing bearing platform | |
| CN218317511U (en) | Automatic braid equipment for packing of wafer ring | |
| CN211828717U (en) | Four-side wafer arranging mechanism for silicon wafers | |
| CN220627826U (en) | Linear half silicon wafer transmission line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230524 Address after: 511517 workshop a, No.16, Chuangxing Third Road, high tech Zone, Qingyuan City, Guangdong Province Applicant after: Guangdong lead Microelectronics Technology Co.,Ltd. Address before: 511517 area B, no.27-9 Baijia Industrial Park, Qingyuan high tech Zone, Guangdong Province Applicant before: FIRST SEMICONDUCTOR MATERIALS Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |