CN111312646A - Four-side wafer arranging mechanism for silicon wafers - Google Patents
Four-side wafer arranging mechanism for silicon wafers Download PDFInfo
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- CN111312646A CN111312646A CN202010213841.6A CN202010213841A CN111312646A CN 111312646 A CN111312646 A CN 111312646A CN 202010213841 A CN202010213841 A CN 202010213841A CN 111312646 A CN111312646 A CN 111312646A
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 144
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 123
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 122
- 239000010703 silicon Substances 0.000 title claims abstract description 122
- 230000007246 mechanism Effects 0.000 title claims abstract description 43
- 238000009966 trimming Methods 0.000 claims abstract description 12
- 230000000903 blocking effect Effects 0.000 claims description 34
- 230000000712 assembly Effects 0.000 claims description 21
- 238000000429 assembly Methods 0.000 claims description 21
- 230000010354 integration Effects 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 230000001276 controlling effect Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 6
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000005245 sintering Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000000994 depressogenic effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a four-side silicon wafer trimming mechanism which comprises a silicon wafer loading device for stacking silicon wafers, a conveying device for conveying the silicon wafer loading device along an X direction, an X-direction positioning device for trimming the silicon wafers from the X direction, and a pair of Y-direction positioning devices for trimming the silicon wafers from a Y direction, wherein the conveying device is provided with a trimming station, the X-direction positioning device comprises a first air cylinder, a lifting plate which is connected to the upper side of the first air cylinder and can move along the Z direction under the driving of the first air cylinder, a second air cylinder which is installed on the lifting plate, and two clamping components which are driven by the second air cylinder, and the two clamping components can respectively trim the silicon wafers from the front side and the back side.
Description
Technical Field
The invention relates to the field of silicon wafer processing, in particular to a four-side wafer arrangement mechanism of a silicon wafer.
Background
The silicon chip is a carrier of the solar cell, the quality of the silicon chip directly determines the conversion efficiency of the solar cell, the solar cell needs a large-area PN junction to realize the conversion from light energy to electric energy, and the diffusion furnace is special equipment for manufacturing the PN junction of the solar cell. The tubular diffusion furnace mainly comprises an upper loading part and a lower loading part of a quartz boat, an exhaust gas chamber, a furnace body part, a gas holder part and the like. The diffusion is generally carried out by using a liquid source of phosphorus oxychloride as a diffusion source. The P-type silicon chip is placed in a quartz container of a tubular diffusion furnace, phosphorus oxychloride is brought into the quartz container by using nitrogen at the high temperature of 850-900 ℃, and phosphorus atoms are obtained by the reaction of the phosphorus oxychloride and the silicon chip. After a certain period of time, phosphorus atoms enter the surface layer of the silicon wafer from the periphery, and permeate and diffuse to the interior of the silicon wafer through gaps among the silicon atoms to form an interface of the N-type semiconductor and the P-type semiconductor, namely a PN junction.
In the prior art, three processes of diffusion, coating and sintering are the most important in the whole production process flow of the solar cell. Generally, silicon wafers are stacked in the jig and placed in a sintering furnace for sintering, and if the silicon wafers are not stacked orderly, the sintering effect is influenced, so that the quality of the silicon wafers is influenced.
Disclosure of Invention
The invention aims to provide a four-side silicon wafer arrangement mechanism.
In order to solve the technical problem, the invention provides a four-side silicon wafer trimming mechanism, which comprises a silicon wafer loading device for stacking silicon wafers, a conveying device for conveying the silicon wafer loading device along an X direction, an X-direction positioning device for trimming the silicon wafers from the X direction, and a pair of Y-direction positioning devices for trimming the silicon wafers from a Y direction, wherein the conveying device is provided with a trimming station, and the X-direction positioning device comprises a first air cylinder, a lifting plate which is connected to the upper side of the first air cylinder and can move along the Z direction under the driving of the first air cylinder, a second air cylinder arranged on the lifting plate, and two clamping components driven by the second air cylinder, wherein the two clamping components can respectively trim the silicon wafers from the front side and the back side.
Preferably, a pair of Y to positioner be first Y respectively to positioner, second Y to positioner, install respectively the left and right sides of whole piece station, first Y to positioner include fixed mounting on conveyer second fixing base, install second mounting bracket on the second fixing base, install the second mounting bracket on fifth cylinder, quilt the fifth cylinder along Y to driven third push pedal, second Y to positioner install including conveyer on first fixing base, install first mounting bracket on the first fixing base, first mounting bracket include upside mounting panel and downside mounting panel, upside mounting panel on install the fourth cylinder, downside mounting panel on install the third cylinder, second Y to positioner still include by fourth cylinder along Y to drive second push pedal, The second Y-direction positioning device also comprises a first limiting block driven by the third cylinder along the Y direction.
Preferably, the silicon wafer integrating mechanism further comprises a pair of base positioning devices capable of positioning the silicon wafer loading device on the integrating station.
Preferably, the silicon wafer loading apparatus includes a base, a carrier plate mounted on the base for stacking silicon wafers, and a plurality of fences disposed around the carrier plate and fixed to the base.
Preferably, the conveying device comprises two side plates arranged in the left-right direction, the side plates are respectively provided with a conveying belt moving synchronously, the tops of the side plates are respectively provided with a top plate, the height of each top plate is larger than that of each conveying belt, when the silicon wafer loading device is conveyed by the conveying belts, the base is positioned between the two top plates, and the first fixing seat of the first Y-direction positioning device and the second fixing seat of the second Y-direction positioning device are respectively arranged on the outer walls of the two side plates.
Preferably, the pair of base positioning devices are a first base positioning device and a second base positioning device respectively, the first base positioning device comprises a third fixing seat mounted on the conveying device, a sixth air cylinder mounted on the third fixing seat, a seventh air cylinder driven by the sixth air cylinder along the Y direction, and a first base blocking piece capable of lifting and descending under the driving of the seventh air cylinder; the second base positioning device comprises a fourth fixed seat arranged on the conveying device, an eighth air cylinder arranged on the fourth fixed seat, and a second base blocking piece capable of lifting under the driving of the eighth air cylinder.
Preferably, a first bottom plate and a second bottom plate are arranged between the bottoms of the two side plates of the conveying device along the front-back direction, the first base positioning device is arranged on the second bottom plate, the second base positioning device is arranged on the first bottom plate, the inner sides of the two side plates are respectively provided with a supporting plate, the supporting plates are arranged at the lower side of the upper side surface of the conveyor belt, the upper side surface of the conveyor belt is used for supporting the conveyor belt, the inner side of one side plate of the conveyor is also provided with a fixing strip arranged along the front-back direction, a first inductor and a second inductor are respectively arranged on the fixing strip along the front-back direction and are used for detecting the position of the silicon wafer loading device, and when the silicon wafer loading device is conveyed to the whole wafer station, controlling the conveyor belt to stop working.
Preferably, the X-direction positioning device further comprises a driving plate mounted on the second cylinder and capable of moving in the Y direction under the driving of the second cylinder, the driving plate is of a wedge-shaped structure, the front side and the rear side of the driving plate are provided with a bevel edge, the small end of the driving plate is located in the extending direction of the driving plate, the large end of the driving plate is located in the retracting direction of the driving plate, the lifting plate is provided with a slide rail extending in the X direction, the two clamping assemblies are mounted on the lifting plate and located on the front side and the rear side of the driving plate respectively, each clamping assembly comprises a slide block capable of sliding along the slide rail, a pulley arranged on the slide block, and a baffle arm arranged on the slide block in the Y direction, the baffle arm is provided with a first push plate, the first push plates of the two clamping assemblies are arranged oppositely, and the front side and the rear side of the driving plate are provided with spring, one end of the spring tension mechanism is fixed on the lifting plate, and the other end of the spring tension mechanism is fixed on the clamping component.
Preferably, the X-direction positioning device has a clamping position and an opening position, when the X-direction positioning device is located at the clamping position, the two pulleys are located at two sides of the small end of the driving block respectively, the two clamping assemblies are relatively close to each other, the two spring tension mechanisms apply a tension to the two clamping assemblies respectively, so that the clamping assemblies clamp the silicon wafer loading device from the front side and the rear side, and the silicon wafer on the silicon wafer loading device is subjected to wafer integration, when the X-direction positioning device is located at the opening position, the driving plate is driven by the second cylinder to extend out along the Y direction and is inserted between the two pulleys, the two pulleys slide to be separated from each other along two side surfaces of the driving plate respectively, so that the two clamping assemblies are located at the opening position, the first pushing plate is separated from the silicon wafer loading device, and the spring tension mechanisms apply a restoring force to the clamping assemblies, so that the clamping assemblies have a tendency of returning to the clamping positions, the spring tension mechanism comprises a first fixing rod fixed on the lifting plate, a second fixing rod fixed on the sliding block and a spring connected between the first fixing rod and the second fixing rod.
Preferably, X still including installing the C type adjustment sheet on first blend stop to positioner's first push pedal, C type adjustment sheet include with the parallel adjustment sheet body of first blend stop, locate upper portion board and the lower part board of both sides about the adjustment sheet body, the upper portion board and the lower part board of adjustment sheet on offer respectively along the Y slot hole to setting up, the upper portion board be located the top of first blend stop, the lower part board be located the bottom of first blend stop, upper portion board and lower part board fix the top and the bottom at first blend stop through fastening screw respectively, fastening screw pass the slot hole, the adjustment sheet make for metal material, the structure of first blend stop also be C type structure, first blend stop sets up with the opening of adjustment sheet relatively, exists a space between adjustment sheet body and the first blend stop.
The four-side silicon wafer integrating mechanism has the following beneficial effects:
1. the mechanism is provided with an X-direction positioning device and two Y-direction positioning devices, and can be used for integrating the silicon wafers from four directions, wherein the integration step is a step before sintering the silicon wafers, and after the stacked silicon wafers are integrated, the silicon wafers can be prevented from being sintered unevenly and the photoelectric conversion efficiency of the silicon wafers is prevented from being influenced.
2. The mechanism is provided with a pair of base positioning devices and a first limiting block controlled by a third air cylinder, the silicon wafer loading device is positioned respectively from the front and back direction and the left and right direction, the position of the whole station can be more accurate in the technological process, and therefore the whole process of the silicon wafer is more accurate.
3. A first limiting block is arranged on the second Y-direction positioning device and matched with the top plate on the opposite side, and the silicon wafer loading device is limited from the left side and the right side. Because the position of the top plate in the left and right directions is not changed, the silicon wafer loading device can be accurately positioned in the left and right directions by the pushing of the first limiting block. The silicon wafer whole-piece mechanism is designed through the height difference between the side plate, the top plate and the positioning device, and the positioning device on one side is only used for completing the positioning in the left-right direction.
4. The first base positioning device and the second base positioning device are respectively provided with a first base blocking piece and a second base blocking piece, the first base blocking piece and the second blocking piece can move up and down under the driving of the air cylinder, the silicon wafer loading device in conveying can be avoided, and the sixth air cylinder is used for driving the first base blocking piece to further position the silicon wafer loading device. The position of the second base blocking piece in the X direction is unchanged, so that the silicon wafer loading device can be accurately positioned in the front and back direction by being pushed by the first base blocking piece.
5. Every edge of support plate in this application has two depressed areas, and when the silicon chip was placed on the support plate, the edge of silicon chip was located the depressed area in, every edge of silicon chip carries out the integer through two blend stops respectively, the strip inserts corresponding depressed area respectively in, carries out the integer to the silicon chip, prevents the wrench movement of silicon chip at the integer in-process, and the integer effect is better. In addition, the edge of the silicon wafer is positioned in the edge of the carrier plate, so that the silicon wafer can be prevented from shifting caused by collision in the transportation process.
6. The utility model provides a X can drive second cylinder and clamping component to positioner's first cylinder and reciprocate, can dodge the silicon chip loading attachment in the conveying, clamping component's mutual approaching and separation are realized through a second cylinder, clamping component's the tight elasticity that passes through the spring that presss from both sides realizes, this structure lies in for the tight advantage through cylinder direct clamping, press from both sides through the spring and can have a buffer power, and cylinder direct drive presss from both sides tight then does not have the buffer power, consequently, the X of this application can prevent that the silicon chip from taking place to damage at the in-process of whole piece to positioner.
7. The utility model provides a X is still including installing the C type adjustment sheet on first blend stop to positioner's first push pedal, and this C type adjustment sheet can be followed Y and finely tuned to relative first blend stop to make two clamping components's relative distance change, change the clamp force between the clamping component.
8. The X of this application also is C type structure to the structure of the first blend stop of positioner's first push pedal, and first blend stop sets up with the opening of adjustment sheet relatively, has a space between adjustment sheet body and the first blend stop. This structure makes the adjustment sheet main part be elastic construction, when the adjustment sheet main part touches the silicon chip, for the flexible contact, can not cause the damage to the silicon chip edge.
Drawings
FIG. 1 is a schematic structural diagram of a four-sided sheeting mechanism for a silicon wafer of the present application;
FIG. 2 is a schematic structural view of the X-direction positioning device of the present application;
FIG. 3 is a schematic top view of the X-positioning device of the present application;
FIG. 4 is a schematic view of the construction of a first pusher plate of the present application;
FIG. 5 is a schematic structural view of a second Y-position device of the present application;
FIG. 6 is a schematic view of a first Y-position device of the present application;
FIG. 7 is a schematic structural view of a first base positioning device of the present application;
FIG. 8 is a schematic structural view of a second base positioning device of the present application;
FIG. 9 is a schematic structural view of a wafer loading apparatus according to the present application;
FIG. 10 is a schematic structural view of the transfer device of the present application;
fig. 11 is a schematic top view of the singulation engine of the present application.
Wherein: 1. a conveying device; 2. a silicon wafer loading device; 31. a first Y-direction positioning device; 32. a second Y-direction positioning device; 4. an X-direction positioning device; 5. a first base positioning device; 6. a second base positioning device;
11. a top plate; 12. a side plate; 13. a conveyor belt; 14. a support plate; 15. a first base plate; 16. a second base plate; 17. a fixing strip; 18. a first inductor; 19. a second inductor;
21. a base; 22. a carrier plate; 23. a fence; 221. a recessed region.
311. A second mounting bracket; 313. a fifth cylinder; 314. a third push plate; 3141. a third barrier strip; 315. a second fixed seat;
321. a first mounting bracket; 322. a third cylinder; 323. a fourth cylinder; 324. a second push plate; 325. a first fixed seat; 326. a first stopper; 3241. a second barrier strip;
41. a first cylinder; 42. a lifting plate; 43. a second cylinder; 44. a slider; 441. a pulley; 45. a catch arm; 46. a first push plate; 461. a first barrier strip; 462. a regulating sheet; 463. a long hole; 464. fastening screws; 471. a first fixing lever; 472. a spring; 473. a second fixing bar; 48. a slide rail; 49. a drive plate;
51. a third fixed seat; 52. a sixth cylinder; 53. a seventh cylinder; 54. a first base stop;
61. a fourth fixed seat; 62. an eighth cylinder; 63. a second base stop.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
As shown in fig. 1, the wafer alignment mechanism according to the present invention includes a wafer loading device 2 for stacking wafers, a transfer device 1 for transporting the wafer loading device 2 in the X direction, an X-direction positioning device 4 for aligning the wafer alignment from the X direction, and a pair of Y-direction positioning devices for aligning the wafer alignment from the Y direction.
The conveying device 1 is provided with a sheet-integrating station. When the silicon wafer loading device 2 is conveyed to the wafer-arranging station, the X-direction positioning devices 4 respectively arrange the silicon wafers from the front side and the rear side, and the pair of Y-direction positioning devices respectively arrange the silicon wafers from the left side and the right side.
The silicon wafer integrating mechanism further comprises a pair of base positioning devices capable of positioning the silicon wafer loading device 2 on an integrating station.
As shown in FIGS. 2 and 3, the X-direction positioning device 4 of the present application comprises a first cylinder 41, a lifting plate 42 connected to the upper side of the first cylinder 41 and capable of moving in the Z direction under the driving of the first cylinder 41, a second cylinder 43 mounted on the lifting plate 42, a driving plate 49 mounted on the second cylinder 43 and capable of moving in the Y direction under the driving of the second cylinder 43,
the driving plate 49 is in a wedge-shaped structure, the front side and the rear side of the driving plate 49 are provided with a bevel edge, the small end of the driving plate 49 is positioned in the extending direction of the driving plate 49, the large end of the driving plate 49 is positioned in the retracting direction of the driving plate 49,
the lifting plate 42 is provided with a slide rail 48 extending along the X direction, two clamping components respectively positioned at the front side and the rear side of the driving plate 49,
the clamping assemblies comprise a sliding block 44 arranged on the sliding rail 48 and capable of sliding along the sliding rail, a pulley 441 arranged on the sliding block 44, and a blocking arm 45 arranged on the sliding block 44 and arranged along the Y direction, wherein a first push plate 46 is arranged on the blocking arm 45, the first push plates 46 of the two clamping assemblies are oppositely arranged,
spring tension mechanisms are respectively arranged on the front side and the rear side of the driving plate 49, one end of each spring tension mechanism is fixed on the lifting plate 42, and the other end of each spring tension mechanism is fixed on the clamping assembly.
The X-direction positioning device 4 has a clamping position and an open position,
when the X-direction positioning device 4 is in the clamping position, the two pulleys 441 are respectively positioned at two sides of the small end of the driving block, the two clamping components are relatively close to each other, the two spring tension mechanisms respectively apply tension to the two clamping components, so that the clamping components clamp the silicon wafer loading device 2 from the front side and the rear side to piece the silicon wafer on the silicon wafer loading device 2,
when the X-direction positioning device 4 is in the open position, the driving plate 49 is driven by the second cylinder 43 to extend along the Y direction and is inserted between the two pulleys 441, the two pulleys 441 respectively slide along the two side surfaces of the driving plate 49 to be separated from each other, so that the two clamping assemblies are in the open position, the first push plate 46 is separated from the silicon wafer loading device 2, and the spring tension mechanism applies a return force to the clamping assemblies, so that the clamping assemblies have a tendency of returning to the clamping position.
The spring tension mechanism includes a first fixing rod 471 fixed to the lifting plate 42, a second fixing rod 473 fixed to the slider 44, and a spring 472 connected between the first fixing rod 471 and the second fixing rod 473.
The pair of Y-direction positioning devices are respectively a first Y-direction positioning device 31 and a second Y-direction positioning device 32 which are respectively arranged at the left side and the right side of the whole station.
As shown in fig. 6, the first Y-direction positioning device 31 includes a second fixing seat 315 fixedly mounted on the conveying device 1, a second mounting frame 311 mounted on the second fixing seat 315, a fifth air cylinder 313 mounted on the second mounting frame 311, and a third push plate 314 driven by the fifth air cylinder 313 along the Y-direction.
As shown in fig. 5, the second Y-direction positioning device 32 includes a first fixing seat 325 installed on the conveying device 1, and a first mounting frame 321 installed on the first fixing seat 325, the first mounting frame 321 includes an upper mounting plate and a lower mounting plate, the upper mounting plate is provided with a fourth cylinder 323, and the lower mounting plate is provided with a third cylinder 322. The second Y-direction positioning device 32 further includes a second pushing plate 324 driven by the fourth cylinder 323 along the Y-direction, and a first stopper 326 driven by the third cylinder 322 along the Y-direction, wherein the second pushing plate 324 and the third pushing plate 314 respectively slice the silicon wafer from the left and right sides.
As shown in fig. 9, the wafer loading apparatus 2 according to the present invention includes a base 21, a carrier plate 22 mounted on the base 21 for stacking wafers, and a plurality of fences 23 disposed around the carrier plate 22 and fixed to the base 21, the fences 23 serving to prevent the wafers from falling off the carrier plate 22.
As shown in fig. 10, the conveyor 1 includes two side plates 12 arranged in a left-right direction, and the side plates 12 are respectively provided with a conveyor belt 13 moving synchronously. The top of the side plates 12 is respectively provided with a top plate 11, the height of the top plate 11 is greater than that of the conveyor belt 13, and when the silicon wafer loading device 2 is conveyed by the conveyor belt 13, the base 21 is positioned between the two top plates 11. The first fixing seat 325 of the first Y-direction positioning device 31 and the second fixing seat 315 of the second Y-direction positioning device 32 are respectively installed on the outer walls of the two side plates 12.
The pair of base positioning devices are respectively a first base positioning device 5 and a second base positioning device 6.
As shown in fig. 7, the first base positioning device 5 includes a third fixed base 51 mounted on the conveying device 1, a sixth air cylinder 52 mounted on the third fixed base 51, a seventh air cylinder 53 driven by the sixth air cylinder 52 in the Y direction, and a first base stopper 54 capable of moving up and down by the drive of the seventh air cylinder 53.
As shown in fig. 8, the second base positioning device 6 includes a fourth fixing base 61 mounted on the conveying device 1, an eighth air cylinder 62 mounted on the fourth fixing base 61, and a second base blocking member 63 capable of moving up and down under the driving of the eighth air cylinder 62.
The working process of the sheet integrating mechanism is as follows:
positioning of the wafer loading apparatus 2 in the X direction: when the silicon wafer loading device 2 moves on the conveyor belt 13, the first base stop part of the first base positioning device 5 and the second base stop part of the second base positioning device 6 are positioned at the lower side of the conveyor belt 13. When the wafer loading unit 2 is transferred to the wafer-aligning station by the transfer unit 1, the transfer belt 13 stops the transfer, the seventh cylinder 53 of the first base positioning unit 5 located at the front side of the wafer loading unit 2 drives the first base stopper 54 to ascend, the eighth cylinder of the second base positioning unit 6 located at the rear side of the wafer loading unit 2 drives the second base stopper 63 to ascend until the base of the wafer loading unit 2 is located between the first base stopper 54 and the second base stopper 63, then, the sixth air cylinder 52 drives the seventh air cylinder 53 to move toward the wafer loading device 2 in the X direction, so that the first base stopper 54 pushes the base 21 of the wafer loading device 2 until the base 21 of the wafer loading device 2 touches the second base stopper 63, and at this time, the wafer loading apparatus 2 is restrained in the X direction between the first pedestal stopper 54 and the second pedestal stopper 63.
(II) positioning of the silicon wafer loading apparatus 2 in the Y direction: the third cylinder 322 of the second Y-direction positioning device 32 drives the first stopper 326 to move along the Y-direction, so that the first stopper 326 pushes the base 21 of the silicon wafer loading device 2 until the other side of the base 21 of the silicon wafer loading device 2 contacts the top plate 11, and at this time, the silicon wafer loading device 2 is limited between the first stopper 326 and the top plate 11 in the Y-direction.
(III) silicon wafer integration in the X direction: when the wafer loading unit 2 moves on the conveyor belt 13, the first pushing plate 46 of the X-direction positioning unit 4 is positioned above the wafer loading unit 2, and the wafer loading unit 2 can pass under the X-direction positioning unit 4. When the silicon wafer loading device 2 is transferred to the wafer integrating station and the positioning in the X direction and the Y direction is completed, the first air cylinder 41 drives the second air cylinder 43 and the clamping assembly to descend until the silicon wafer loading device 2 is positioned between the two first pushing plates 46, at this time, the two clamping assemblies are in an open state, and the first pushing plates 46 are separated from the silicon wafer loading device 2. Then, the second air cylinder 43 is used to control the driving plate 49 to retract, and the two clamping assemblies approach each other under the action of the spring 472, so as to clamp the silicon wafer loading device 2, thereby completing the wafer alignment in the X direction.
(IV) silicon wafer integration in the Y direction: the fifth air cylinder 313 of the first Y-direction positioning device 31 and the fourth air cylinder 323 of the second Y-direction positioning device 32 respectively drive the third pushing plate 314 and the second pushing plate 324 to move oppositely along the Y direction, so as to complete the integration of the silicon wafer in the Y direction.
And (V) moving the silicon wafer loading device 2 after the whole wafer is finished to the next station: (1) the fifth cylinder 313 of the first Y-direction positioning device 31 and the fourth cylinder 323 of the second Y-direction positioning device 32 respectively drive the third pushing plate 314 and the second pushing plate 324 to withdraw to the original positions along the Y-direction, and the third cylinder 322 of the second Y-direction positioning device 32 controls the first limiting block 326 to withdraw to the original positions; (2) the second cylinder 43 of the X-direction positioning device 4 extends the driving plate 49 and inserts between the two pulleys 441, the two clamping assemblies are relatively separated, the first push plate 46 is separated from the silicon wafer loading mechanism, and the first cylinder 41 drives the second cylinder 43 and the clamping assemblies to rise to the upper side of the silicon wafer loading mechanism.
(3) The sixth cylinder 52 of the first base positioning device 5 drives the seventh cylinder 53 to return to the original position, the seventh cylinder 53 of the first base positioning device 5 and the eighth cylinder 62 of the second base positioning device 6 respectively drive the first base blocking piece 54 and the second base blocking piece 63 to descend to the lower side of the silicon wafer loading device 2, the conveyor belt 13 is restarted, and the silicon wafer loading device 2 is moved to the next station.
In a preferred embodiment, the carrier 22 has a rectangular structure, each edge of the carrier 22 has two recessed regions 221, and when a silicon wafer is placed on the carrier 22, the edge of the silicon wafer is located in the recessed region 221.
The first push plate 46 of the X-direction positioning device 4 is provided with two parallel first blocking bars 461 extending in the up-down direction, the third push plate 314 of the first Y-direction positioning device 31 is provided with two parallel third blocking bars 3141 extending in the up-down direction, and the second push plate 324 of the second Y-direction positioning device 32 is provided with two parallel second blocking bars 3241 extending in the up-down direction. In the third step, the first barrier ribs 461 of the two first push plates 46 are respectively inserted into the corresponding recessed regions 221, so as to complete the silicon wafer. In the step (four), the second stop bars 3241 of the second push plate 324 and the third stop bars of the third push plate 314 are respectively inserted into the corresponding concave regions 221 to complete the silicon wafer. Since the edge of the silicon wafer is smaller than that inside the edge of the carrier plate 22, the silicon wafer can be prevented from being offset due to collision during transportation. Meanwhile, each edge of the silicon wafer is integrated through the two barrier strips, so that the silicon wafer can be prevented from being twisted in the process of integration, and the integration effect is better.
Preferably, the first pushing plate 46 of the X-direction positioning device 4 further includes a C-shaped adjusting tab 462 installed on the first blocking strip 461, the C-shaped adjusting tab 462 includes an adjusting tab 462 body parallel to the first blocking strip 461, and an upper plate and a lower plate disposed on the upper and lower sides of the adjusting tab body, the upper plate and the lower plate of the adjusting tab are respectively provided with a long hole 463 disposed along the Y-direction, the upper plate is located at the top of the first blocking strip 461, the lower plate is located at the bottom of the first blocking strip 461, the upper plate and the lower plate are respectively fixed at the top and the bottom of the first blocking strip 461 through a fastening screw 464, and the fastening screw 464 penetrates through the long hole 463.
The C-shaped adjustment tab can be fine-tuned relative to the first stop 461 along the Y-direction to vary the relative distance between the two clamping assemblies and vary the clamping force between the clamping assemblies. In addition, the adjusting piece 462 is made of metal material, the first blocking strip 461 is also in a C-shaped structure, the first blocking strip 461 is opposite to the opening of the adjusting piece, and a gap exists between the adjusting piece body and the first blocking strip 461. This structure makes the adjustment sheet main part be elastic construction, when the adjustment sheet main part touches the silicon chip, for the flexible contact, can not cause the damage to the silicon chip edge.
In another preferred embodiment, a first bottom plate 15 and a second bottom plate 16 are installed between the bottoms of the two side plates 12 of the conveying device 1 along the front-back direction, the first base positioning device 5 is installed on the second bottom plate 16, and the second base positioning device 6 is installed on the first bottom plate 15. A supporting plate 14 is respectively arranged at the inner sides of the two side plates 12, and the supporting plate 14 is arranged at the lower side of the upper side surface of the conveyor belt 13 and is used for supporting the upper side surface of the conveyor belt 13. The inner side of one side plate 12 of the conveying device 1 is also provided with a fixing strip 17 arranged along the front-back direction, the fixing strip 17 is respectively provided with a first sensor 18 and a second sensor 19 along the front-back direction, the first sensor 18 and the second sensor 19 are used for detecting the position of the silicon wafer loading device 2, and when the silicon wafer loading device 2 is conveyed to the whole wafer station, the conveying belt 13 is controlled to stop working.
The X direction in this application is the running direction of the silicon wafer loading device 2 on the conveying device 1, i.e. the front-back direction; the Y direction in the present application means a direction perpendicular to the X direction on a horizontal plane, i.e., a left-right direction; the Z direction in the present application refers to the up-down direction.
The above-mentioned embodiments are merely preferred embodiments for fully explaining the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. A four-side silicon wafer trimming mechanism is characterized by comprising a silicon wafer loading device for stacking silicon wafers, a conveying device for conveying the silicon wafer loading device along an X direction, an X-direction positioning device for trimming the silicon wafers from the X direction, and a pair of Y-direction positioning devices for trimming the silicon wafers from a Y direction, wherein the conveying device is provided with a trimming station,
the X-direction positioning device comprises a first air cylinder, a lifting plate, a second air cylinder and two clamping components, wherein the lifting plate is connected to the upper side of the first air cylinder and can move in the Z direction under the driving of the first air cylinder, the second air cylinder is installed on the lifting plate, the two clamping components are driven by the second air cylinder, and the two clamping components can respectively carry out silicon wafer integration from the front side and the rear side.
2. The sheet mechanism of claim 1, wherein the pair of Y-direction positioning devices are a first Y-direction positioning device and a second Y-direction positioning device respectively installed on the left and right sides of the sheet station, the first Y-direction positioning device comprises a second fixing seat fixedly installed on the conveying device, a second mounting frame installed on the second fixing seat, a fifth cylinder installed on the second mounting frame, and a third push plate driven by the fifth cylinder along the Y direction, the second Y-direction positioning device comprises a first fixing seat installed on the conveying device, a first mounting frame installed on the first fixing seat, the first mounting frame comprises an upper mounting plate and a lower mounting plate, the upper mounting plate is provided with a fourth cylinder, and the lower mounting plate is provided with a third cylinder, the second Y-direction positioning device further comprises a first limiting block driven by the fourth cylinder along the Y direction to drive a second push plate and a third cylinder along the Y direction, the second push plate and the third push plate respectively integrate the silicon wafer from the left side and the right side, and the second Y-direction positioning device further comprises a first limiting block driven by the third cylinder along the Y direction.
3. The wafer collating mechanism according to claim 2 further including a pair of base positioning means for positioning said wafer loading means at the collating station.
4. The wafer loading apparatus as claimed in claim 1, wherein the wafer loading device comprises a base, a carrier plate mounted on the base for stacking wafers, and a plurality of fences disposed around the carrier plate and fixed to the base.
5. The wafer integrating mechanism as claimed in claim 3, wherein the conveying device comprises two side plates arranged in a left-right direction, the side plates are respectively provided with a conveying belt moving synchronously, the top of each side plate is respectively provided with a top plate, the height of each top plate is greater than that of the conveying belt, when the silicon wafer loading device is conveyed by the conveying belts, the base is located between the two top plates, and the first fixing seat of the first Y-direction positioning device and the second fixing seat of the second Y-direction positioning device are respectively arranged on the outer walls of the two side plates.
6. The integrated sheet mechanism as claimed in claim 5, wherein the pair of base positioning devices are a first base positioning device and a second base positioning device, respectively, the first base positioning device comprises a third fixed seat mounted on the conveying device, a sixth air cylinder mounted on the third fixed seat, a seventh air cylinder driven by the sixth air cylinder along the Y direction, and a first base blocking member capable of lifting under the driving of the seventh air cylinder; the second base positioning device comprises a fourth fixed seat arranged on the conveying device, an eighth air cylinder arranged on the fourth fixed seat, and a second base blocking piece capable of lifting under the driving of the eighth air cylinder.
7. The sheet integrating mechanism as claimed in claim 6, wherein a first bottom plate and a second bottom plate are installed between the bottoms of the two side plates of the conveying device along the front-rear direction, the first base positioning device is installed on the second bottom plate, the second base positioning device is installed on the first bottom plate, a supporting plate is installed on the inner side of each of the two side plates, the supporting plate is installed on the lower side of the upper side surface of the conveying belt and used for supporting the upper side surface of the conveying belt, a fixing strip is further installed on the inner side of one of the side plates of the conveying device along the front-rear direction, a first sensor and a second sensor are respectively installed on the fixing strip along the front-rear direction and used for detecting the position of the silicon wafer loading device, when the silicon wafer loading device is conveyed to the sheet integrating station, and controlling the conveyor belt to stop working.
8. The tablet forming mechanism according to claim 1, wherein the X-direction positioning device further comprises a driving plate mounted on the second cylinder and capable of moving in the Y direction under the driving of the second cylinder, the driving plate is of a wedge-shaped structure, the front side and the rear side of the driving plate have an oblique edge, the small end of the driving plate is located in the extending direction of the driving plate, the large end of the driving plate is located in the retracting direction of the driving plate, the lifting plate is provided with a slide rail extending in the X direction, two clamping assemblies are mounted on the lifting plate and located in the front side and the rear side of the driving plate respectively, each clamping assembly comprises a slide block arranged on the slide rail, a pulley arranged on the slide block, and a stop arm arranged in the Y direction on the slide block, the stop arm is provided with a first push plate, and the first push plates of the two clamping assemblies are arranged oppositely, spring tension mechanisms are respectively arranged on the front side and the rear side of the driving plate, one end of each spring tension mechanism is fixed on the lifting plate, and the other end of each spring tension mechanism is fixed on the clamping assembly.
9. The tablet mechanism of claim 8 wherein the X-direction positioning means has a clamping position and an open position,
when the X-direction positioning device is positioned at the clamping position, the two pulleys are respectively positioned at the two sides of the small end of the driving block, the two clamping components are relatively close to each other, the two spring tension mechanisms respectively apply tension to the two clamping components, so that the clamping components clamp the silicon wafer loading device from the front side and the rear side to piece the silicon wafer on the silicon wafer loading device,
when the X-direction positioning device is in an opening position, the driving plate extends out along the Y direction under the driving of the second air cylinder and is inserted between the two pulleys, the two pulleys respectively slide along the two side surfaces of the driving plate to be separated from each other so as to enable the two clamping components to be in the opening position, the first push plate is separated from the silicon wafer loading device, the spring tension mechanism applies a restoring force to the clamping components so as to enable the clamping components to have a tendency of returning to the clamping position,
the spring tension mechanism comprises a first fixing rod fixed on the lifting plate, a second fixing rod fixed on the sliding block and a spring connected between the first fixing rod and the second fixing rod.
10. The sheet integrating mechanism as claimed in claim 9, wherein the first pushing plate of the X-direction positioning device is provided with two first blocking strips extending in a vertical direction and parallel to each other, the first pushing plate of the X-direction positioning device further comprises a C-shaped adjusting sheet mounted on the first blocking strips, the C-shaped adjusting sheet comprises an adjusting sheet body parallel to the first blocking strips, an upper plate and a lower plate disposed on upper and lower sides of the adjusting sheet body, the upper plate and the lower plate of the adjusting sheet are respectively provided with a long hole disposed in a Y direction, the upper plate is disposed on top of the first blocking strips, the lower plate is disposed on bottom of the first blocking strips, the upper plate and the lower plate are respectively fixed on top and bottom of the first blocking strips by fastening screws, the fastening screws penetrate through the long holes, the adjusting sheet is made of a metal material, and the first blocking strips are also in a C-shaped structure, the first barrier strip is arranged opposite to the opening of the regulating sheet, and a gap is formed between the regulating sheet body and the first barrier strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010213841.6A CN111312646A (en) | 2020-03-24 | 2020-03-24 | Four-side wafer arranging mechanism for silicon wafers |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010213841.6A CN111312646A (en) | 2020-03-24 | 2020-03-24 | Four-side wafer arranging mechanism for silicon wafers |
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| CN111312646A true CN111312646A (en) | 2020-06-19 |
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| CN202010213841.6A Pending CN111312646A (en) | 2020-03-24 | 2020-03-24 | Four-side wafer arranging mechanism for silicon wafers |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864068A (en) * | 2021-02-23 | 2021-05-28 | 天津环博科技有限责任公司 | Silicon wafer arranging equipment |
| CN115556248A (en) * | 2022-12-08 | 2023-01-03 | 釜川(无锡)智能科技有限公司 | Silicon wafer degumming and inserting integrated machine |
-
2020
- 2020-03-24 CN CN202010213841.6A patent/CN111312646A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864068A (en) * | 2021-02-23 | 2021-05-28 | 天津环博科技有限责任公司 | Silicon wafer arranging equipment |
| CN115556248A (en) * | 2022-12-08 | 2023-01-03 | 釜川(无锡)智能科技有限公司 | Silicon wafer degumming and inserting integrated machine |
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