CN112864068A - Silicon wafer arranging equipment - Google Patents
Silicon wafer arranging equipment Download PDFInfo
- Publication number
- CN112864068A CN112864068A CN202110201752.4A CN202110201752A CN112864068A CN 112864068 A CN112864068 A CN 112864068A CN 202110201752 A CN202110201752 A CN 202110201752A CN 112864068 A CN112864068 A CN 112864068A
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- gear
- box body
- silicon wafer
- transverse moving
- cartridge clip
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 42
- 239000010703 silicon Substances 0.000 title claims abstract description 42
- 235000012431 wafers Nutrition 0.000 claims abstract description 49
- 230000001105 regulatory effect Effects 0.000 claims abstract description 8
- 238000010606 normalization Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Electromagnetism (AREA)
- Manipulator (AREA)
Abstract
The invention provides silicon wafer arranging equipment, which comprises a box body, an elastic clamp and an arranging manipulator, wherein the elastic clamp is arranged in the box body through a transverse moving assembly; the traversing assembly is arranged at the bottom of the box body, the cartridge clip is arranged on the traversing assembly through a cartridge clip traversing seat, and the regulating mechanical arm is arranged on the side wall of the box body and positioned at two sides of the cartridge clip. The silicon wafer arranging device is created, silicon wafers are arranged through the cooperation of the two groups of arranging mechanical arms, the cartridge clip is moved to the position of the silicon wafer through the transverse moving device, the silicon wafer is inserted into the cartridge clip, and the mechanical arms can take the cartridge clip away conveniently to clean the silicon wafer.
Description
Technical Field
The invention belongs to the technical field of photovoltaic silicon wafer manufacturing, and particularly relates to silicon wafer arranging equipment.
Background
With the exhaustion of traditional fossil energy, renewable energy research has received attention, and the advantages of large solar energy reserve, safety, cleanness and the like become one of the main energy sources in the future. Under the joint assistance of factors such as high-speed industrial development, good policy and technical progress, the growth of the domestic photovoltaic power generation industry is vigorous, and the industry maintains high-speed growth.
In the manufacturing process of the photovoltaic silicon wafer, the degumming process is a key step, the cut whole rod of the silicon wafer is separated from the resin plate and is changed into a sliced silicon wafer, the cleaning process is prepared, and the silicon wafer is required to be regular during cleaning, so that the silicon wafer is convenient to clean.
Disclosure of Invention
In view of the above, the present invention provides a silicon wafer regularizing apparatus to solve the problem of silicon wafer cleaning.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a silicon wafer arranging device comprises a box body, an elastic clamp and an arranging manipulator, wherein the elastic clamp is arranged in the box body through a transverse moving assembly;
the traversing assembly is arranged at the bottom of the box body, the cartridge clip is arranged on the traversing assembly through a cartridge clip traversing seat, and the regulating mechanical arm is arranged on the side wall of the box body and positioned at two sides of the cartridge clip.
Further, regular manipulator is equipped with two sets ofly, box both sides wall symmetry is equipped with the rack, and two sets of regular manipulator are installed on the rack through erectting to move the pole lift.
Further, two sets of regular manipulator structures are the same, and every regular manipulator of group includes the mount pad, and mount pad bottom four corners is installed and is erected and move the pole, installs hydraulic lift on the rack, and hydraulic lift runs through rack mesa and mount pad bottom fixed connection, and the four corners of rack mesa is equipped with and erects to move the pole corresponding pole hole that moves of pole, and four are erected and move the pole and install respectively at moving the pole downthehole.
Each group of the regulating manipulators further comprises a driving motor, two sliding rods and a clamping plate, wherein the sliding rods are arranged on the mounting seat, two first through holes are formed in the side wall of the mounting seat, one ends of the two sliding rods penetrate through the first through holes and then are connected with the clamping plate through adapter plates, and the other ends of the sliding rods are connected through a baffle;
the side wall of the mounting seat is also provided with a second through hole, a screw rod is arranged in the second through hole, one end of the screw rod penetrates through the second through hole and then is connected with a first driving wheel, the baffle is provided with a third through hole, a screw rod nut is arranged in the third through hole, and the other end of the screw rod penetrates through the screw rod nut;
the mounting base top is equipped with the mounting panel, and driving motor installs on the mounting panel, and driving motor pivot end is connected with the second drive wheel, and the second drive wheel passes through first conveyer belt and is connected with first drive wheel.
Further, the sideslip subassembly includes sideslip motor, second conveyer belt, second gear, third conveyer belt, third gear, box one end is equipped with the motor mount pad, the sideslip motor is installed on the motor mount pad, and sideslip motor one end is connected with first gear, and the bottom half is equipped with a plurality of pivot mount pads, installs the pivot on the pivot mount pad, and pivot one end is connected with the second gear, the second gear passes through the second conveyer belt with first gear and is connected, and the bottom half is kept away from pivot mount pad one end and is equipped with the gear mount pad, the third gear is installed on the gear mount pad, the fourth gear is installed to the pivot intermediate position, and the fourth gear passes through the third conveyer belt with the third gear and is connected.
Furthermore, the cartridge clip transverse moving seat is fixed on a third conveyor belt, two groups of transverse moving rods are arranged at the bottom of the box body, sliding blocks corresponding to the transverse moving rods are arranged at the bottom of the cartridge clip transverse moving seat, and the sliding blocks are slidably mounted on the transverse moving rods.
Furthermore, a wafer supporting plate is arranged at one end of the box body, which is far away from the cartridge clip transverse moving seat.
Compared with the prior art, the silicon wafer normalization equipment provided by the invention has the following beneficial effects:
the silicon wafer arranging device is created, silicon wafers are arranged through the cooperation of the two groups of arranging mechanical arms, the cartridge clip is moved to the position of the silicon wafer through the transverse moving device, the silicon wafer is inserted into the cartridge clip, and the mechanical arms can take the cartridge clip away conveniently to clean the silicon wafer.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the invention without limitation. In the drawings:
FIG. 1 is a structural diagram of a silicon wafer arranging apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a silicon wafer normalization apparatus according to an embodiment of the present invention.
Description of reference numerals:
1. a box body; 2. a cartridge clip; 3. arranging the mechanical arm; 4. a traversing motor; 5. a wafer pallet; 21. a cartridge clip moving seat; 22. a traversing rod; 30. a rack; 31. a drive motor; 32. a mounting seat; 33. a slide bar; 34. a baffle plate; 35. an adapter plate; 36. a splint; 37. vertically moving the rod; 41. a second conveyor belt; 42. a second gear; 43. a third gear; 44. a third conveyor belt; 45. a gear mounting seat.
Detailed Description
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which are merely for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, the meaning of "a plurality" is two or more unless otherwise specified.
In the description of the invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "connected" are to be construed broadly, e.g. as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the creation of the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be described in detail with reference to the following embodiments with reference to the attached drawings.
As shown in fig. 1 to 2, a silicon wafer arranging device comprises a box body 1, a cartridge clip 2 arranged in the box body 1 through a transverse moving assembly, and an arranging manipulator 3 for arranging silicon wafers on the cartridge clip 2;
the traversing assembly is arranged at the bottom of the box body 1, the cartridge clips 2 are arranged on the traversing assembly through cartridge clip traversing seats 21, and the regulating mechanical arms 3 are arranged on the side wall of the box body 1 and are positioned at two sides of the cartridge clips 2.
The regulating mechanical arms 3 are provided with two groups, the racks 30 are symmetrically arranged on two side walls of the box body 1, and the two groups of regulating mechanical arms 3 are installed on the racks 30 in a lifting mode through the vertical moving rods 37.
Two sets of regular manipulator 3 structures are the same, and every regular manipulator of group 3 includes mount pad 32, and mount pad 32 bottom four corners is installed to erect and is moved pole 37, installs hydraulic lift on the rack 30, and hydraulic lift runs through rack 30 mesa and mount pad 32 bottom fixed connection, and the four corners of rack 30 mesa is equipped with and erects to move the pole hole that moves that pole 37 is corresponding, and four are erected and are moved pole 37 and install respectively at moving the pole downthehole.
Can adjust the height of mount pad 32 through hydraulic lift drive, it is spacing through erectting to move pole 37, prevent that mount pad 32 from taking place to rotate and causing hydraulic lift's damage.
Each group of the arranging manipulators 3 further comprises a driving motor 31, two sliding rods 33 and a clamping plate 36, the sliding rods 33 are mounted on the mounting seat 32, two first through holes are formed in the side wall of the mounting seat 32, the number of the sliding rods 33 is two, one ends of the two sliding rods 33 penetrate through the first through holes and then are connected with the clamping plate 36 through an adapter plate 35, and the other ends of the sliding rods 33 are connected through a baffle plate 34;
a second through hole is further formed in the side wall of the mounting seat 32, a screw rod is mounted in the second through hole, one end of the screw rod penetrates through the second through hole and then is connected with a first driving wheel, a third through hole is formed in the baffle 34, a screw rod nut is mounted in the third through hole, and the other end of the screw rod penetrates through the screw rod nut;
the mounting base 32 top is equipped with the mounting panel, and driving motor 31 installs on the mounting panel, and driving motor 31 pivot end is connected with the second drive wheel, and the second drive wheel is connected with first drive wheel through first conveyer belt.
Through driving motor 31 drive second drive wheel, the second drive wheel drives first conveyer belt, first drive wheel rotates and drives the lead screw rotation, screw nut sideslips on the lead screw when the lead screw rotates, thereby baffle 34 realizes the sideslip, promote two slide bars 33 and promote around on mount pad 32 during the sideslip of baffle 34, the other end of two slide bars 33 then promotes splint 36 and removes, two sets of regular manipulators 3 cooperate, two splint 36 remove simultaneously, thereby arrange the silicon chip.
The transverse moving assembly comprises a transverse moving motor 4, a second conveyor belt 41, a second gear 42, a third conveyor belt 44 and a third gear 43, a motor mounting seat 32 is arranged at one end of the box body 1, the transverse moving motor 4 is installed on the motor mounting seat 32, one end of the transverse moving motor 4 is connected with a first gear, a plurality of rotating shaft mounting seats 32 are arranged at the bottom of the box body 1, rotating shafts are installed on the rotating shaft mounting seats 32, one ends of the rotating shafts are connected with the second gear 42, the second gear 42 is connected with the first gear through the second conveyor belt 41, a gear mounting seat 45 is arranged at one end, far away from the rotating shaft mounting seat 32, of the bottom of the box body 1, the third gear 43 is installed on the gear mounting seat 45, a fourth gear is installed in the middle position of the rotating shafts, and the fourth gear is connected with;
the cartridge clip traverse motion seat 21 is fixed on the third conveyor belt 44, two groups of traverse motion rods 22 are arranged at the bottom of the box body 1, and sliders corresponding to the traverse motion rods 22 are arranged at the bottom of the cartridge clip traverse motion seat 21 and are slidably mounted on the traverse motion rods 22.
The end of the box body 1 far away from the cartridge clip traversing seat 21 is provided with a wafer supporting plate 5.
The wafer is placed on the wafer supporting plate 5 through the manipulator, the hydraulic cylinder lifter drives the arranging manipulator 3 to enable the arranging manipulator 3 to clamp the upper half part of the silicon wafer, the second conveyor belt 41 and the third conveyor belt 44 are driven to rotate through the driving transverse moving motor 4, the third conveyor belt 44 rotates to drive the clip transverse moving seat 21 to move towards the direction of the wafer supporting plate 5, and the arranged silicon wafer is inserted into the clip 2.
The cartridge clip 2 is placed on the cartridge clip transverse moving seat 21, a baffle 34 is arranged at the bottom of the cartridge clip transverse moving seat 21, and the cartridge clip 2 is placed to deviate.
The following are used specifically:
place the wafer on wafer layer board 5 through the manipulator, drive the second drive wheel through driving motor 31, the second drive wheel drives first conveyer belt, first drive wheel rotates and drives the lead screw rotation, screw nut sideslip on the lead screw when the lead screw rotates, thereby the sideslip is realized to baffle 34, promote two slide bars 33 and promote around on mount pad 32 during baffle 34 sideslip, the other end of two slide bars 33 then promotes splint 36 and removes, two sets of regular manipulators 3 cooperation, two splint 36 remove simultaneously, thereby regulate the silicon chip.
The second conveyor belt 41 and the third conveyor belt 44 are driven to rotate by the driving traversing motor 4, and the third conveyor belt 44 rotates to drive the cassette traversing seat 21 to move towards the wafer supporting plate 5, so that regular silicon wafers are inserted into the cassette 2.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the invention, so that any modifications, equivalents, improvements and the like, which are within the spirit and principle of the present invention, should be included in the scope of the present invention.
Claims (7)
1. A silicon wafer regularizing device is characterized in that: the silicon wafer arranging device comprises a box body (1), a cartridge clip (2) arranged in the box body (1) through a transverse moving assembly, and an arranging manipulator (3) used for arranging silicon wafers on the cartridge clip (2);
the horizontal moving assembly is arranged at the bottom of the box body (1), the cartridge clips (2) are arranged on the horizontal moving assembly through cartridge clip horizontal moving seats (21), and the arranging mechanical arms (3) are arranged on the side wall of the box body (1) and located on two sides of the cartridge clips (2).
2. The silicon wafer normalization apparatus as defined in claim 1, wherein: the two sets of the regulating manipulators (3) are arranged, the two side walls of the box body (1) are symmetrically provided with the rack (30), and the two sets of the regulating manipulators (3) are installed on the rack (30) in a lifting mode through the vertical moving rods (37).
3. The silicon wafer normalization apparatus as defined in claim 2, wherein: two sets of regular manipulator (3) structures are the same, and every regular manipulator of group (3) is including mount pad (32), and the four corners is installed in mount pad (32) bottom and is erected and move pole (37), installs hydraulic lift on rack (30), and hydraulic lift runs through rack (30) mesa and mount pad (32) bottom fixed connection, and the four corners of rack (30) mesa is equipped with and erects to move the pole hole that moves that pole (37) are corresponding, and four are erected and move pole (37) and install respectively at moving the pole downthehole.
4. The silicon wafer normalization apparatus as defined in claim 3, wherein: each group of the arranging manipulator (3) further comprises a driving motor (31), two sliding rods (33) and two clamping plates (36), the sliding rods (33) are mounted on the mounting seat (32), two first through holes are formed in the side wall of the mounting seat (32), one ends of the two sliding rods (33) penetrate through the first through holes and then are connected with the clamping plates (36) through adapter plates (35), and the other ends of the sliding rods (33) are connected through baffle plates (34);
a second through hole is further formed in the side wall of the mounting seat (32), a lead screw is mounted in the second through hole, one end of the lead screw penetrates through the second through hole and then is connected with a first driving wheel, a third through hole is formed in the baffle (34), a lead screw nut is mounted in the third through hole, and the other end of the lead screw penetrates through the lead screw nut;
the mounting plate is arranged at the top of the mounting seat (32), the driving motor (31) is installed on the mounting plate, the rotating shaft end of the driving motor (31) is connected with a second driving wheel, and the second driving wheel is connected with the first driving wheel through a first conveying belt.
5. The silicon wafer normalization apparatus as defined in claim 1, wherein: the transverse moving component comprises a transverse moving motor (4), a second conveyor belt (41), a second gear (42), a third conveyor belt (44) and a third gear (43), a motor mounting seat (32) is arranged at one end of the box body (1), the transverse moving motor (4) is mounted on the motor mounting seat (32), a first gear is connected at one end of the transverse moving motor (4), a plurality of rotating shaft mounting seats (32) are arranged at the bottom of the box body (1), a rotating shaft is mounted on each rotating shaft mounting seat (32), one end of the rotating shaft is connected with a second gear (42), the second gear (42) is connected with the first gear through a second conveyor belt (41), a gear mounting seat (45) is arranged at one end of the bottom of the box body (1) far away from the rotating shaft mounting seat (32), the third gear (43) is installed on the gear installation seat (45), a fourth gear is installed in the middle of the rotating shaft, and the fourth gear is connected with the third gear (43) through a third conveying belt (44).
6. The silicon wafer normalization apparatus as defined in claim 5, wherein: the cartridge clip transverse moving seat (21) is fixed on the third conveying belt (44), two groups of transverse moving rods (22) are arranged at the bottom of the box body (1), sliding blocks corresponding to the transverse moving rods (22) are arranged at the bottom of the cartridge clip transverse moving seat (21), and the sliding blocks are slidably mounted on the transverse moving rods (22).
7. The silicon wafer normalization apparatus as defined in claim 6, wherein: and a wafer supporting plate (5) is arranged at one end of the box body (1) far away from the cartridge clip transverse moving seat (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110201752.4A CN112864068B (en) | 2021-02-23 | Silicon wafer normalization equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110201752.4A CN112864068B (en) | 2021-02-23 | Silicon wafer normalization equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112864068A true CN112864068A (en) | 2021-05-28 |
| CN112864068B CN112864068B (en) | 2024-06-25 |
Family
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117508803A (en) * | 2024-01-08 | 2024-02-06 | 天津环博科技有限责任公司 | Silicon chip packagine machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130002569A (en) * | 2011-06-29 | 2013-01-08 | 넥스타테크놀로지 주식회사 | A transfer unit for auto shillings apparatus of the substrate |
| CN204566129U (en) * | 2015-02-06 | 2015-08-19 | 上海展谐清洗设备有限公司 | For hello the sheet manipulator automatically of silicon wafer |
| CN111312646A (en) * | 2020-03-24 | 2020-06-19 | 罗博特科智能科技股份有限公司 | Four-side wafer arranging mechanism for silicon wafers |
| CN111430505A (en) * | 2020-04-17 | 2020-07-17 | 天津环博科技有限责任公司 | Vertical material loading inserted sheet all-in-one |
| CN211578770U (en) * | 2019-12-26 | 2020-09-25 | 拉普拉斯(无锡)半导体科技有限公司 | Rewinding mechanism |
| CN214898362U (en) * | 2021-02-23 | 2021-11-26 | 天津环博科技有限责任公司 | Silicon wafer arranging equipment |
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130002569A (en) * | 2011-06-29 | 2013-01-08 | 넥스타테크놀로지 주식회사 | A transfer unit for auto shillings apparatus of the substrate |
| CN204566129U (en) * | 2015-02-06 | 2015-08-19 | 上海展谐清洗设备有限公司 | For hello the sheet manipulator automatically of silicon wafer |
| CN211578770U (en) * | 2019-12-26 | 2020-09-25 | 拉普拉斯(无锡)半导体科技有限公司 | Rewinding mechanism |
| CN111312646A (en) * | 2020-03-24 | 2020-06-19 | 罗博特科智能科技股份有限公司 | Four-side wafer arranging mechanism for silicon wafers |
| CN111430505A (en) * | 2020-04-17 | 2020-07-17 | 天津环博科技有限责任公司 | Vertical material loading inserted sheet all-in-one |
| CN214898362U (en) * | 2021-02-23 | 2021-11-26 | 天津环博科技有限责任公司 | Silicon wafer arranging equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117508803A (en) * | 2024-01-08 | 2024-02-06 | 天津环博科技有限责任公司 | Silicon chip packagine machine |
| CN117508803B (en) * | 2024-01-08 | 2024-04-05 | 天津环博科技有限责任公司 | Silicon chip packagine machine |
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