CN111415893A - Single-drive two-side clamping device and sheet-arranging mechanism - Google Patents
Single-drive two-side clamping device and sheet-arranging mechanism Download PDFInfo
- Publication number
- CN111415893A CN111415893A CN202010214822.5A CN202010214822A CN111415893A CN 111415893 A CN111415893 A CN 111415893A CN 202010214822 A CN202010214822 A CN 202010214822A CN 111415893 A CN111415893 A CN 111415893A
- Authority
- CN
- China
- Prior art keywords
- drive
- plate
- clamping
- silicon wafer
- clamping device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 40
- 235000012431 wafers Nutrition 0.000 claims description 97
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 75
- 229910052710 silicon Inorganic materials 0.000 claims description 74
- 239000010703 silicon Substances 0.000 claims description 74
- 230000000712 assembly Effects 0.000 claims description 21
- 238000000429 assembly Methods 0.000 claims description 21
- 230000004888 barrier function Effects 0.000 claims description 20
- 230000000903 blocking effect Effects 0.000 claims description 20
- 239000007769 metal material Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 7
- 230000010354 integration Effects 0.000 description 6
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a single-drive two-side clamping device and a sheet-shaping mechanism, wherein the single-drive two-side clamping device comprises a lifting plate, a second air cylinder arranged on the lifting plate, and a drive plate which is arranged on the second air cylinder and can move along the Y direction under the drive of the second air cylinder, the drive plate is of a wedge-shaped structure, the front side and the rear side of the drive plate are provided with bevel edges, the small head of the drive plate is positioned in the extending direction of the drive plate, the large head of the drive plate is positioned in the retracting direction of the drive plate, the lifting plate is provided with a slide rail extending along the X direction and two clamping components respectively positioned on the front side and the rear side of the drive plate, the front side and the rear side of the drive plate are also respectively provided with a spring tension mechanism, one end of the spring tension mechanism is fixed on the lifting plate, and the other end.
Description
Technical Field
The invention relates to the field of silicon wafer processing, in particular to a single-drive two-side clamping device and a wafer arranging mechanism.
Background
The silicon chip is a carrier of the solar cell, the quality of the silicon chip directly determines the conversion efficiency of the solar cell, the solar cell needs a large-area PN junction to realize the conversion from light energy to electric energy, and the diffusion furnace is special equipment for manufacturing the PN junction of the solar cell. The tubular diffusion furnace mainly comprises an upper loading part and a lower loading part of a quartz boat, an exhaust gas chamber, a furnace body part, a gas holder part and the like. The diffusion is generally carried out by using a liquid source of phosphorus oxychloride as a diffusion source. The P-type silicon chip is placed in a quartz container of a tubular diffusion furnace, phosphorus oxychloride is brought into the quartz container by using nitrogen at the high temperature of 850-900 ℃, and phosphorus atoms are obtained by the reaction of the phosphorus oxychloride and the silicon chip. After a certain period of time, phosphorus atoms enter the surface layer of the silicon wafer from the periphery, and permeate and diffuse to the interior of the silicon wafer through gaps among the silicon atoms to form an interface of the N-type semiconductor and the P-type semiconductor, namely a PN junction.
In the prior art, when a silicon wafer is integrated in the front-back or left-right directions, the silicon wafer is generally integrated by respectively driving the front-back or left-right push plates through two cylinders, the number of the cylinders used is large, the error of the two cylinders in synchronous control is large, the cylinders are directly used for driving, collision is easily generated between the push plates and the silicon wafer, and the silicon wafer can be damaged.
Disclosure of Invention
The invention aims to provide a single-drive two-side clamping device and a sheet-arranging mechanism.
In order to solve the technical problem, the invention provides a single-drive two-side clamping device, which comprises a lifting plate, a second air cylinder arranged on the lifting plate, a drive plate arranged on the second air cylinder and capable of moving along the Y direction under the drive of the second air cylinder, the driving plate is of a wedge-shaped structure, the front side and the rear side of the driving plate are provided with bevel edges, the small end of the driving plate is positioned in the extending direction of the driving plate, the big end of the driving plate is positioned in the retraction direction of the driving plate, the lifting plate is provided with a slide rail extending along the X direction and two clamping components respectively positioned at the front side and the rear side of the driving plate, spring tension mechanisms are respectively arranged on the front side and the rear side of the driving plate, one end of each spring tension mechanism is fixed on the lifting plate, and the other end of each spring tension mechanism is fixed on the clamping assembly.
Preferably, the clamping assembly comprises a sliding block which can slide along the sliding rail, a pulley which is arranged on the sliding block, and a blocking arm which is arranged on the sliding block along the Y direction, wherein a first push plate is arranged on the blocking arm, and the first push plates of the two clamping assemblies are arranged oppositely.
Preferably, the single-drive two-side clamping device has a clamping position and an opening position, when the single-drive two-side clamping device is in the clamping position, the two pulleys are respectively located at two sides of the small end of the drive block, the two clamping assemblies are relatively close to each other, the two spring tension mechanisms respectively apply tension to the two clamping assemblies, so that the clamping assemblies clamp the silicon wafer loading device from the front side and the rear side, and perform wafer integration on the silicon wafer loading device, when the single-drive two-side clamping device is in the opening position, the drive plate extends out in the Y direction under the drive of the second cylinder and is inserted between the two pulleys, the two pulleys respectively slide to be separated from each other along two sides of the drive plate, so that the two clamping assemblies are in the opening position, the first push plate is separated from the silicon wafer loading device, and the spring tension mechanisms apply a restoring force to the clamping assemblies, giving the clamping assembly a tendency to return to the clamping position.
Preferably, the spring tension mechanism comprises a first fixing rod fixed on the lifting plate, a second fixing rod fixed on the sliding block, and a spring connected between the first fixing rod and the second fixing rod.
Preferably, the first push plate is provided with two first barrier strips which extend along the up-down direction and are parallel to each other.
Preferably, first push pedal still including installing the C type adjustment sheet on first blend stop, the C type adjustment sheet include with the parallel adjustment sheet body of first blend stop, locate upper portion board and the lower part board of both sides about the adjustment sheet body, the upper portion board and the lower part board of adjustment sheet on offer respectively along the Y slot hole to setting up, the upper portion board be located the top of first blend stop, the lower part board be located the bottom of first blend stop, upper portion board and lower part board pass through fastening screw respectively and fix the top and the bottom at first blend stop, fastening screw pass the slot hole.
Preferably, the adjusting sheet is made of a metal material, the first barrier strip is also of a C-shaped structure, the opening of the first barrier strip is opposite to the opening of the adjusting sheet, and a gap is formed between the adjusting sheet body and the first barrier strip.
The application also provides a sheet-arranging mechanism, the sheet-arranging mechanism comprise the single-drive two-side clamping device.
Preferably, the wafer-aligning mechanism comprises a silicon wafer loading device for stacking silicon wafers, a conveying device for conveying the silicon wafer loading device along the X direction, an X-direction positioning device for aligning the silicon wafer from the X direction, and a pair of Y-direction positioning devices for aligning the silicon wafer from the Y direction, wherein the conveying device is provided with an aligning station, the X-direction positioning device comprises a first air cylinder, and the single-drive two-side clamping device is arranged on the upper side of the first air cylinder and can move along the Z direction under the drive of the first air cylinder.
Preferably, the silicon wafer integrating mechanism further comprises a pair of base positioning devices capable of positioning the silicon wafer loading device on the integrating station.
The single-drive two-side clamping device and the sheet-arranging mechanism have the following beneficial effects:
the X of this application can drive second cylinder and clamping component to reciprocate to positioner's first cylinder, can dodge the silicon chip loading attachment in the conveying. The clamping device comprises a first cylinder, a second cylinder, a spring, a single-drive two-side clamping device, a spring, a buffer force and a single-drive two-side clamping device.
The utility model provides a single drive both sides clamping device's first push pedal is still including installing the C type adjustment sheet on first blend stop, and this C type adjustment sheet can be followed Y and finely tuned to relative first blend stop to make two clamping component's relative distance change, change the clamp force between the clamping component.
The structure of the first barrier strip of the first push plate of the single-drive two-side clamping device is also of a C-shaped structure, the first barrier strip is opposite to the opening of the adjusting sheet, and a gap exists between the adjusting sheet body and the first barrier strip. This structure makes the adjustment sheet main part be elastic construction, when the adjustment sheet main part touches the silicon chip, for the flexible contact, can not cause the damage to the silicon chip edge.
Drawings
FIG. 1 is a schematic structural diagram of a four-sided sheeting mechanism for a silicon wafer of the present application;
FIG. 2 is a schematic structural view of the X-direction positioning device of the present application;
FIG. 3 is a schematic top view of the X-positioning device of the present application;
FIG. 4 is a schematic view of the construction of a first pusher plate of the present application;
FIG. 5 is a schematic structural view of a second Y-position device of the present application;
FIG. 6 is a schematic view of a first Y-position device of the present application;
FIG. 7 is a schematic structural view of a first base positioning device of the present application;
FIG. 8 is a schematic structural view of a second base positioning device of the present application;
FIG. 9 is a schematic structural view of a wafer loading apparatus according to the present application;
FIG. 10 is a schematic structural view of the transfer device of the present application;
fig. 11 is a schematic top view of the singulation engine of the present application.
Wherein: 1. a conveying device; 2. a silicon wafer loading device; 31. a first Y-direction positioning device; 32. a second Y-direction positioning device; 4. an X-direction positioning device; 5. a first base positioning device; 6. a second base positioning device;
11. a top plate; 12. a side plate; 13. a conveyor belt; 14. a support plate; 15. a first base plate; 16. a second base plate; 17. a fixing strip; 18. a first inductor; 19. a second inductor;
21. a base; 22. a carrier plate; 23. a fence; 221. a recessed region.
311. A second mounting bracket; 313. a fifth cylinder; 314. a third push plate; 3141. a third barrier strip; 315. a second fixed seat;
321. a first mounting bracket; 322. a third cylinder; 323. a fourth cylinder; 324. a second push plate; 325. a first fixed seat; 326. a first stopper; 3241. a second barrier strip;
41. a first cylinder; 42. a lifting plate; 43. a second cylinder; 44. a slider; 441. a pulley; 45. a catch arm; 46. a first push plate; 461. a first barrier strip; 462. a regulating sheet; 463. a long hole; 464. fastening screws; 471. a first fixing lever; 472. a spring; 473. a second fixing bar; 48. a slide rail; 49. a drive plate;
51. a third fixed seat; 52. a sixth cylinder; 53. a seventh cylinder; 54. a first base stop;
61. a fourth fixed seat; 62. an eighth cylinder; 63. a second base stop.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
As shown in fig. 1, the wafer alignment mechanism according to the present invention includes a wafer loading device 2 for stacking wafers, a transfer device 1 for transporting the wafer loading device 2 in the X direction, an X-direction positioning device 4 for aligning the wafer alignment from the X direction, and a pair of Y-direction positioning devices for aligning the wafer alignment from the Y direction.
The conveying device 1 is provided with a sheet-integrating station. When the silicon wafer loading device 2 is conveyed to the wafer-arranging station, the X-direction positioning devices 4 respectively arrange the silicon wafers from the front side and the rear side, and the pair of Y-direction positioning devices respectively arrange the silicon wafers from the left side and the right side.
The silicon wafer integrating mechanism further comprises a pair of base positioning devices capable of positioning the silicon wafer loading device 2 on an integrating station.
As shown in fig. 2 and 3, the X-positioning device 4 of the present application includes a first cylinder 41, and a single-driving two-side clamping device connected to an upper side of the first cylinder 41 and capable of moving in a Z-direction under the driving of the first cylinder 41.
The single-drive two-side clamping device comprises a lifting plate 42, a second air cylinder 43 arranged on the lifting plate 42, a drive plate 49 arranged on the second air cylinder 43 and capable of moving along the Y direction under the drive of the second air cylinder 43,
the driving plate 49 is in a wedge-shaped structure, the front side and the rear side of the driving plate 49 are provided with a bevel edge, the small end of the driving plate 49 is positioned in the extending direction of the driving plate 49, the large end of the driving plate 49 is positioned in the retracting direction of the driving plate 49,
the lifting plate 42 is provided with a slide rail 48 extending along the X direction, two clamping components respectively positioned at the front side and the rear side of the driving plate 49,
the clamping assemblies comprise a sliding block 44 arranged on the sliding rail 48 and capable of sliding along the sliding rail, a pulley 441 arranged on the sliding block 44, and a blocking arm 45 arranged on the sliding block 44 and arranged along the Y direction, wherein a first push plate 46 is arranged on the blocking arm 45, the first push plates 46 of the two clamping assemblies are oppositely arranged,
spring tension mechanisms are respectively arranged on the front side and the rear side of the driving plate 49, one end of each spring tension mechanism is fixed on the lifting plate 42, and the other end of each spring tension mechanism is fixed on the clamping assembly.
The single-drive two-side clamping device is provided with a clamping position and an opening position,
when the single-drive two-side clamping device is in a clamping position, the two pulleys 441 are respectively positioned at two sides of the small end of the drive block, the two clamping components are relatively close to each other, the two spring tension mechanisms respectively apply tension to the two clamping components, so that the clamping components clamp the silicon wafer loading device 2 from the front side and the rear side to piece the silicon wafer on the silicon wafer loading device 2,
when the single-drive two-side clamping device is in the opening position, the driving plate 49 extends out along the Y direction under the drive of the second air cylinder 43 and is inserted between the two pulleys 441, the two pulleys 441 respectively slide along the two side surfaces of the driving plate 49 to be separated from each other, so that the two clamping assemblies are in the opening position, the first push plate 46 is separated from the silicon wafer loading device 2, and the spring tension mechanism applies a return force to the clamping assemblies, so that the clamping assemblies have a tendency of returning to the clamping position.
The spring tension mechanism includes a first fixing rod 471 fixed to the lifting plate 42, a second fixing rod 473 fixed to the slider 44, and a spring 472 connected between the first fixing rod 471 and the second fixing rod 473.
The pair of Y-direction positioning devices are respectively a first Y-direction positioning device 31 and a second Y-direction positioning device 32 which are respectively arranged at the left side and the right side of the whole station.
As shown in fig. 6, the first Y-direction positioning device 31 includes a second fixing seat 315 fixedly mounted on the conveying device 1, a second mounting frame 311 mounted on the second fixing seat 315, a fifth air cylinder 313 mounted on the second mounting frame 311, and a third push plate 314 driven by the fifth air cylinder 313 along the Y-direction.
As shown in fig. 5, the second Y-direction positioning device 32 includes a first fixing seat 325 installed on the conveying device 1, and a first mounting frame 321 installed on the first fixing seat 325, the first mounting frame 321 includes an upper mounting plate and a lower mounting plate, the upper mounting plate is provided with a fourth cylinder 323, and the lower mounting plate is provided with a third cylinder 322. The second Y-direction positioning device 32 further includes a second pushing plate 324 driven by the fourth cylinder 323 along the Y-direction, and a first stopper 326 driven by the third cylinder 322 along the Y-direction, wherein the second pushing plate 324 and the third pushing plate 314 respectively slice the silicon wafer from the left and right sides.
As shown in fig. 9, the wafer loading apparatus 2 according to the present invention includes a base 21, a carrier plate 22 mounted on the base 21 for stacking wafers, and a plurality of fences 23 disposed around the carrier plate 22 and fixed to the base 21, the fences 23 serving to prevent the wafers from falling off the carrier plate 22.
As shown in fig. 10, the conveyor 1 includes two side plates 12 arranged in a left-right direction, and the side plates 12 are respectively provided with a conveyor belt 13 moving synchronously. The top of the side plates 12 is respectively provided with a top plate 11, the height of the top plate 11 is greater than that of the conveyor belt 13, and when the silicon wafer loading device 2 is conveyed by the conveyor belt 13, the base 21 is positioned between the two top plates 11. The first fixing seat 325 of the first Y-direction positioning device 31 and the second fixing seat 315 of the second Y-direction positioning device 32 are respectively installed on the outer walls of the two side plates 12.
The pair of base positioning devices are respectively a first base positioning device 5 and a second base positioning device 6.
As shown in fig. 7, the first base positioning device 5 includes a third fixed base 51 mounted on the conveying device 1, a sixth air cylinder 52 mounted on the third fixed base 51, a seventh air cylinder 53 driven by the sixth air cylinder 52 in the Y direction, and a first base stopper 54 capable of moving up and down by the drive of the seventh air cylinder 53.
As shown in fig. 8, the second base positioning device 6 includes a fourth fixing base 61 mounted on the conveying device 1, an eighth air cylinder 62 mounted on the fourth fixing base 61, and a second base blocking member 63 capable of moving up and down under the driving of the eighth air cylinder 62.
The working process of the sheet integrating mechanism is as follows:
positioning of the wafer loading apparatus 2 in the X direction: when the silicon wafer loading device 2 moves on the conveyor belt 13, the first base stop part of the first base positioning device 5 and the second base stop part of the second base positioning device 6 are positioned at the lower side of the conveyor belt 13. When the wafer loading unit 2 is transferred to the wafer-aligning station by the transfer unit 1, the transfer belt 13 stops the transfer, the seventh cylinder 53 of the first base positioning unit 5 located at the front side of the wafer loading unit 2 drives the first base stopper 54 to ascend, the eighth cylinder of the second base positioning unit 6 located at the rear side of the wafer loading unit 2 drives the second base stopper 63 to ascend until the base of the wafer loading unit 2 is located between the first base stopper 54 and the second base stopper 63, then, the sixth air cylinder 52 drives the seventh air cylinder 53 to move toward the wafer loading device 2 in the X direction, so that the first base stopper 54 pushes the base 21 of the wafer loading device 2 until the base 21 of the wafer loading device 2 touches the second base stopper 63, and at this time, the wafer loading apparatus 2 is restrained in the X direction between the first pedestal stopper 54 and the second pedestal stopper 63.
(II) positioning of the silicon wafer loading apparatus 2 in the Y direction: the third cylinder 322 of the second Y-direction positioning device 32 drives the first stopper 326 to move along the Y-direction, so that the first stopper 326 pushes the base 21 of the silicon wafer loading device 2 until the other side of the base 21 of the silicon wafer loading device 2 contacts the top plate 11, and at this time, the silicon wafer loading device 2 is limited between the first stopper 326 and the top plate 11 in the Y-direction.
(III) silicon wafer integration in the X direction: when the silicon wafer loading unit 2 moves on the conveyor belt 13, the first push plate 46 of the single-drive both-side clamping unit is positioned at the upper side of the silicon wafer loading unit 2, and the silicon wafer loading unit 2 can pass from the lower portion of the X-direction positioning unit 4. When the silicon wafer loading device 2 is transferred to the wafer integrating station and the positioning in the X direction and the Y direction is completed, the first air cylinder 41 drives the second air cylinder 43 and the clamping assembly to descend until the silicon wafer loading device 2 is positioned between the two first pushing plates 46, at this time, the two clamping assemblies are in an open state, and the first pushing plates 46 are separated from the silicon wafer loading device 2. Then, the second air cylinder 43 is used to control the driving plate 49 to retract, and the two clamping assemblies approach each other under the action of the spring 472, so as to clamp the silicon wafer loading device 2, thereby completing the wafer alignment in the X direction.
(IV) silicon wafer integration in the Y direction: the fifth air cylinder 313 of the first Y-direction positioning device 31 and the fourth air cylinder 323 of the second Y-direction positioning device 32 respectively drive the third pushing plate 314 and the second pushing plate 324 to move oppositely along the Y direction, so as to complete the integration of the silicon wafer in the Y direction.
And (V) moving the silicon wafer loading device 2 after the whole wafer is finished to the next station: (1) the fifth cylinder 313 of the first Y-direction positioning device 31 and the fourth cylinder 323 of the second Y-direction positioning device 32 respectively drive the third pushing plate 314 and the second pushing plate 324 to withdraw to the original positions along the Y-direction, and the third cylinder 322 of the second Y-direction positioning device 32 controls the first limiting block 326 to withdraw to the original positions; (2) the second cylinder 43 of the single driving both-side clamping device 4 extends the driving plate 49 and inserts between the two pulleys 441, the two clamping assemblies are relatively separated, the first push plate 46 is separated from the silicon wafer loading mechanism, and the first cylinder 41 drives the second cylinder 43 and the clamping assemblies to rise to the upper side of the silicon wafer loading mechanism.
(3) The sixth cylinder 52 of the first base positioning device 5 drives the seventh cylinder 53 to return to the original position, the seventh cylinder 53 of the first base positioning device 5 and the eighth cylinder 62 of the second base positioning device 6 respectively drive the first base blocking piece 54 and the second base blocking piece 63 to descend to the lower side of the silicon wafer loading device 2, the conveyor belt 13 is restarted, and the silicon wafer loading device 2 is moved to the next station.
In a preferred embodiment, the carrier 22 has a rectangular structure, each edge of the carrier 22 has two recessed regions 221, and when a silicon wafer is placed on the carrier 22, the edge of the silicon wafer is located in the recessed region 221.
The first push plate 46 of the single-drive two-side clamping device is provided with two parallel first blocking strips 461 extending along the up-down direction, the third push plate 314 of the first Y-direction positioning device 31 is provided with two parallel third blocking strips 3141 extending along the up-down direction, and the second push plate 324 of the second Y-direction positioning device 32 is provided with two parallel second blocking strips 3241 extending along the up-down direction. In the third step, the first barrier ribs 461 of the two first push plates 46 are respectively inserted into the corresponding recessed regions 221, so as to complete the silicon wafer. In the step (four), the second stop bars 3241 of the second push plate 324 and the third stop bars of the third push plate 314 are respectively inserted into the corresponding concave regions 221 to complete the silicon wafer. Since the edge of the silicon wafer is smaller than that inside the edge of the carrier plate 22, the silicon wafer can be prevented from being offset due to collision during transportation. Meanwhile, each edge of the silicon wafer is integrated through the two barrier strips, so that the silicon wafer can be prevented from being twisted in the process of integration, and the integration effect is better.
Preferably, the first pushing plate 46 of the X-direction positioning device 4 further includes a C-shaped adjusting tab 462 installed on the first blocking strip 461, the C-shaped adjusting tab 462 includes an adjusting tab 462 body parallel to the first blocking strip 461, and an upper plate and a lower plate disposed on the upper and lower sides of the adjusting tab body, the upper plate and the lower plate of the adjusting tab are respectively provided with a long hole 463 disposed along the Y-direction, the upper plate is located at the top of the first blocking strip 461, the lower plate is located at the bottom of the first blocking strip 461, the upper plate and the lower plate are respectively fixed at the top and the bottom of the first blocking strip 461 through a fastening screw 464, and the fastening screw 464 penetrates through the long hole 463.
The C-shaped adjustment tab can be fine-tuned relative to the first stop 461 along the Y-direction to vary the relative distance between the two clamping assemblies and vary the clamping force between the clamping assemblies. In addition, the adjusting piece 462 is made of metal material, the first blocking strip 461 is also in a C-shaped structure, the first blocking strip 461 is opposite to the opening of the adjusting piece, and a gap exists between the adjusting piece body and the first blocking strip 461. This structure makes the adjustment sheet main part be elastic construction, when the adjustment sheet main part touches the silicon chip, for the flexible contact, can not cause the damage to the silicon chip edge.
In another preferred embodiment, a first bottom plate 15 and a second bottom plate 16 are installed between the bottoms of the two side plates 12 of the conveying device 1 along the front-back direction, the first base positioning device 5 is installed on the second bottom plate 16, and the second base positioning device 6 is installed on the first bottom plate 15. A supporting plate 14 is respectively arranged at the inner sides of the two side plates 12, and the supporting plate 14 is arranged at the lower side of the upper side surface of the conveyor belt 13 and is used for supporting the upper side surface of the conveyor belt 13. The inner side of one side plate 12 of the conveying device 1 is also provided with a fixing strip 17 arranged along the front-back direction, the fixing strip 17 is respectively provided with a first sensor 18 and a second sensor 19 along the front-back direction, the first sensor 18 and the second sensor 19 are used for detecting the position of the silicon wafer loading device 2, and when the silicon wafer loading device 2 is conveyed to the whole wafer station, the conveying belt 13 is controlled to stop working.
The X direction in this application is the running direction of the silicon wafer loading device 2 on the conveying device 1, i.e. the front-back direction; the Y direction in the present application means a direction perpendicular to the X direction on a horizontal plane, i.e., a left-right direction; the Z direction in the present application refers to the up-down direction.
The above-mentioned embodiments are merely preferred embodiments for fully explaining the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. The single-drive two-side clamping device is characterized by comprising a lifting plate, a second cylinder and a drive plate, wherein the second cylinder is arranged on the lifting plate, the drive plate is arranged on the second cylinder and can move along the Y direction under the drive of the second cylinder, the drive plate is of a wedge-shaped structure, the front side and the rear side of the drive plate are provided with bevel edges, the small head of the drive plate is located in the extending direction of the drive plate, the large head of the drive plate is located in the retracting direction of the drive plate, the lifting plate is provided with a slide rail extending along the X direction and two clamping components respectively located on the front side and the rear side of the drive plate, the front side and the rear side of the drive plate are respectively provided with a spring tension mechanism, one end of the spring tension mechanism is fixed on the lifting plate, and the other end of the spring tension mechanism is fixed on the.
2. The single-drive two-sided clamping device as claimed in claim 1, wherein the clamping assembly comprises a sliding block disposed to slide along the sliding rail, a pulley disposed on the sliding block, and a blocking arm disposed on the sliding block along the Y-direction, wherein the blocking arm is provided with a first pushing plate, and the first pushing plates of the two clamping assemblies are disposed opposite to each other.
3. The single drive two sided clamp of claim 2, wherein the single drive two sided clamp has a clamping position and an open position,
when the single-drive two-side clamping device is positioned at a clamping position, the two pulleys are respectively positioned at two sides of the small end of the drive block, the two clamping components are relatively close to each other, the two spring tension mechanisms respectively apply tension to the two clamping components, so that the clamping components clamp the silicon wafer loading device from the front side and the rear side to piece the silicon wafer on the silicon wafer loading device,
when the single-drive two-side clamping device is in the opening position, the drive plate extends out along the Y direction under the drive of the second air cylinder and is inserted between the two pulleys, the two pulleys respectively slide along the two side surfaces of the drive plate to be separated from each other, so that the two clamping assemblies are in the opening position, the first push plate is separated from the silicon wafer loading device, and the spring tension mechanism applies a restoring force to the clamping assemblies so that the clamping assemblies have a tendency of returning to the clamping positions.
4. The single-drive both-side clamping device as defined in claim 2, wherein said spring tension mechanism comprises a first fixing bar fixed to said lifting plate, a second fixing bar fixed to said slider, and a spring connected between said first fixing bar and said second fixing bar.
5. The single-drive both-side clamping device as defined in claim 2, wherein said first pushing plate is provided with two first bars extending in an up-down direction and being parallel to each other.
6. The single-drive two-side clamping device according to claim 5, wherein the first pushing plate further comprises a C-shaped adjusting piece mounted on the first barrier, the C-shaped adjusting piece comprises an adjusting piece body parallel to the first barrier, and an upper plate and a lower plate which are arranged on the upper side and the lower side of the adjusting piece body, the upper plate and the lower plate of the adjusting piece are respectively provided with a long hole arranged along the Y direction, the upper plate is positioned on the top of the first barrier, the lower plate is positioned on the bottom of the first barrier, the upper plate and the lower plate are respectively fixed on the top and the bottom of the first barrier through fastening screws, and the fastening screws penetrate through the long holes.
7. The single-drive both-side clamping device as defined in claim 6, wherein said adjustment tab is made of a metallic material, said first barrier is also of a C-shaped configuration, said first barrier is disposed opposite to said opening of said adjustment tab, and a gap is formed between said adjustment tab body and said first barrier.
8. A clamping mechanism comprising a single drive two-sided clamping device as claimed in any one of claims 1 to 7.
9. The wafer-processing mechanism according to claim 8, wherein the wafer-processing mechanism comprises a wafer loading device for stacking the wafers, a conveying device for conveying the wafer loading device in the X direction, an X-direction positioning device for aligning the wafer from the X direction, and a pair of Y-direction positioning devices for aligning the wafer from the Y direction, the conveying device is provided with a wafer-processing station, the X-direction positioning device comprises a first air cylinder, and the single-drive two-side clamping device is arranged on the upper side of the first air cylinder and can move in the Z direction under the drive of the first air cylinder.
10. The wafer collating mechanism according to claim 9 further including a pair of base positioning means for positioning said wafer loading means at the collating station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010214822.5A CN111415893A (en) | 2020-03-24 | 2020-03-24 | Single-drive two-side clamping device and sheet-arranging mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010214822.5A CN111415893A (en) | 2020-03-24 | 2020-03-24 | Single-drive two-side clamping device and sheet-arranging mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111415893A true CN111415893A (en) | 2020-07-14 |
Family
ID=71493173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010214822.5A Pending CN111415893A (en) | 2020-03-24 | 2020-03-24 | Single-drive two-side clamping device and sheet-arranging mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111415893A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112589084A (en) * | 2020-12-12 | 2021-04-02 | 丁子晨 | Mold positioning mechanism for general machinery |
-
2020
- 2020-03-24 CN CN202010214822.5A patent/CN111415893A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112589084A (en) * | 2020-12-12 | 2021-04-02 | 丁子晨 | Mold positioning mechanism for general machinery |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9793421B2 (en) | Systems, methods and apparatus for precision automation of manufacturing solar panels | |
| KR101258860B1 (en) | The wafer picker device for using solar cell wafer transfer system | |
| KR20160049452A (en) | Cell and jig transfer apparatus of tabbing apparatus | |
| CN111312646A (en) | Four-side wafer arranging mechanism for silicon wafers | |
| US11830956B2 (en) | Method and apparatus of fabricating a solar cell device | |
| CN215469350U (en) | Automatic installation equipment for junction box | |
| CN111415893A (en) | Single-drive two-side clamping device and sheet-arranging mechanism | |
| KR100724044B1 (en) | Transfer apparatus for manufacturing semiconductor | |
| KR20140021832A (en) | Substrate transfer module | |
| CN211828709U (en) | Single-drive two-side clamping device and sheet-arranging mechanism | |
| KR101106100B1 (en) | The pitch adjust device for solar cell wafer | |
| CN211828717U (en) | Four-side wafer arranging mechanism for silicon wafers | |
| CN210640209U (en) | Support plate positioning device and support plate mechanism | |
| KR20140021313A (en) | Align module, and method for aligning substrate and mask | |
| US8336757B2 (en) | Apparatus for transporting substrates for bonding | |
| CN115815839B (en) | Automatic chamfering device for silicon wafer | |
| CN210123751U (en) | Basket of flowers centre gripping handling device | |
| CN210640206U (en) | Multi-basket moving device | |
| CN114242632A (en) | Loading device of semiconductor equipment and semiconductor equipment | |
| CN216633009U (en) | Automatic feeding device and laser welding equipment | |
| CN211828718U (en) | Silicon wafer arranging mechanism | |
| CN211109821U (en) | Basket of flowers centre gripping subassembly and basket of flowers handling device | |
| KR101045029B1 (en) | Cell Wafer Picker | |
| CN111312647A (en) | Silicon wafer arranging mechanism | |
| CN210640197U (en) | Basket of flowers installation mechanism and basket of flowers lift quick switching device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |